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41. 发明授权

US5680651A Duplex printing apparatus 失效
标题翻译：双面打印设备
公开(公告)号：US5680651A
公开(公告)日：1997-10-21
申请号：US646393
申请日：1996-05-09
申请人： Masaru Tsuji , Akira Nakashima , Yoshikazu Kondo
发明人： Masaru Tsuji , Akira Nakashima , Yoshikazu Kondo
IPC分类号： B41J3/60 , G03G15/23 , G03G21/00
CPC分类号： B41J3/60 , G03G15/234
摘要： An object of the invention is to shorten the path of back-side printing, improve the job efficiency, surely correct the curl given by a fixing roller and carry out switching for the back-side printing in a simple configuration. A duplex printing apparatus is provided with a sheet tray installed in a lower portion thereof, and first guiding device installed in one side portion thereof. Second transport path is installed in an upper portion above the first transporting device installed above the sheet tray, and installed in the second transport path are developing/image transferring device, fixing device and third guiding device, in this order from below. Installed substantially in parallel to the first transport path L1 and near one side of the duplex printing apparatus is third guiding device, and installed along the third transport path are fourth guiding device, correcting device, third transporting device and fifth guiding device, in this order from above. Second transporting device and a discharge port are installed on the opposite side of the third guiding from the fourth guiding device in this order.
摘要翻译：本发明的目的是为了缩短背面印刷的路径，提高作业效率，确实地校正由定影辊给出的卷曲，并以简单的结构进行背面印刷的切换。双面打印设备设置有安装在其下部的纸盘，并且其一侧的侧部安装有第一引导装置。第二传送路径安装在安装在片材托盘上方的第一传送装置上方的上部，并且从下方依次安装在第二传送路径中，是显影/图像传送装置，固定装置和第三引导装置。基本上平行于第一输送路径L1并且靠近双面打印装置的一侧安装的第三引导装置，沿着第三输送路径安装为第四引导装置，校正装置，第三输送装置和第五引导装置，依次从上面。第二输送装置和排出口依次安装在第四引导装置的第三引导件的相反侧。

42. 发明授权

US08452452B2 Grip position calculator and method of calculating grip position 有权
标题翻译：抓握位置计算器和计算抓地位置的方法
公开(公告)号：US08452452B2
公开(公告)日：2013-05-28
申请号：US13148183
申请日：2010-01-28
申请人： Toshiyuki Kondo , Shinji Sawada , Nobuhiro Nanba , Yoshikazu Hayakawa , Kenji Fujimoto , Akira Nakashima , Takashi Uno
发明人： Toshiyuki Kondo , Shinji Sawada , Nobuhiro Nanba , Yoshikazu Hayakawa , Kenji Fujimoto , Akira Nakashima , Takashi Uno
IPC分类号： G05B15/00 , G06F19/00
CPC分类号： B25J15/0009 , B25J9/1612 , B25J15/10
摘要： The grip position calculator determines a grip position where the fingers can grip a workpiece in any orientation of the workpiece. The calculator then determines an initial position where the finger tips can grip the workpiece and set the initial position as a point of calculation. Then an allowable gripping force is calculated which is an index that indicates an allowable force to be applied to the workpiece at point. Then other allowable forces are calculated for a plurality of points near the point of calculation. Then the point of calculation is selected as a possible gripping position if the allowable force a point is greater than any of the allowable forces. Otherwise, one of the points is selected for another point of calculation where the greatest allowable force (De) has been calculated and return to calculating an allowable gripping force.
摘要翻译：握持位置计算器确定手指可以在工件的任何取向上夹持工件的抓握位置。然后，计算器确定指尖可握住工件的初始位置，并将初始位置设置为计算点。然后，计算出允许的夹持力，其是指示在点处施加到工件的允许力的指标。然后对于计算点附近的多个点计算其他容许力。然后，如果允许的力一点大于任何允许的力，则选择计算点作为可能的夹持位置。否则，在计算最大容许力（De）的另一个计算点中选择一个点，并返回到计算允许的夹紧力。

43. 发明申请

US20120192848A1 METHOD OF SLICING SILICON INGOT USING WIRE SAW AND WIRE SAW 审中-公开
标题翻译：使用电线和线锯切割硅芯片的方法
公开(公告)号：US20120192848A1
公开(公告)日：2012-08-02
申请号：US13499990
申请日：2010-09-13
申请人： Akira Nakashima , Yukinobu Kaiga
发明人： Akira Nakashima , Yukinobu Kaiga
IPC分类号： H01L21/304 , B28D5/04
CPC分类号： B28D5/045 , B24B27/0633 , B24B55/02 , B28D5/0076
摘要： To provide a method of slicing a silicon ingot for slicing a silicon ingot using a bonded abrasive wire saw, which can reduce the consumption of the bonded abrasive wire required for the slicing process as much as possible, thereby greatly reducing the manufacturing cost and to provide a wire saw used for this method. In the method of slicing a silicon ingot using a wire saw, while a bonded abrasive wire helically wound at a constant pitch around peripheral surfaces of a plurality of rollers is run with a coolant being supplied onto the wire, and while the coolant is also supplied to a side portion of the silicon ingot to be cut where the wire passes in slicing of the silicon ingot; the silicon ingot is moved relative to the wire, thereby slicing the silicon ingot to form a plurality of silicon wafers.
摘要翻译：提供一种切割硅锭的方法，用于使用粘结的磨料线锯切割硅锭，这可以尽可能地减少切割过程所需的粘合磨料的消耗，从而大大降低制造成本并提供用于该方法的线锯。在使用线锯切割硅锭的方法中，当在多个辊周围表面以恒定间距螺旋缠绕的接合磨料线在供给到丝线上的冷却剂运行时，以及当冷却剂也被供给时到硅锭的切片通过的要切割的硅锭的侧部; 硅锭相对于导线移动，从而切割硅锭以形成多个硅晶片。

44. 发明授权

US08118898B2 Spinous silica-based sol and method of producing the same 有权
标题翻译：二氧化硅基溶胶及其制备方法
公开(公告)号：US08118898B2
公开(公告)日：2012-02-21
申请号：US11907318
申请日：2007-10-11
申请人： Yoshinori Wakamiya , Hiroyasu Nishida , Yuji Tawarazako , Kazuaki Inoue , Osamu Yoshida , Akira Nakashima
发明人： Yoshinori Wakamiya , Hiroyasu Nishida , Yuji Tawarazako , Kazuaki Inoue , Osamu Yoshida , Akira Nakashima
IPC分类号： C09G1/04 , B01F3/12 , C01B33/12
CPC分类号： C09G1/02 , C01B33/14 , C09K3/1436 , C09K3/1463
摘要： The present invention provides a sol of spinous silica-based particles in which silica-based particles having peculiar forms, spinous forms are dispersed in a solvent. The spinous silica-based particles have verrucous projections formed on surfaces of spherical silica-based particles. In the spinous particles, a value of the surface roughness (SA1/SA2, SA1 indicating a specific surface area measured by the BET method or the Sears method and SA2 indicating a specific surface area converted from an average particle diameter (D2) measured by the image analysis method) is in the range from 1.7 to 10. Furthermore the average diameter (D2) measured by the image analysis method is in the range from 7 to 150 nm.
摘要翻译：本发明提供一种其中具有特殊形式的二氧化硅基颗粒，棘突分散在溶剂中的棘状二氧化硅基颗粒的溶胶。棘状二氧化硅基颗粒在球状二氧化硅基颗粒的表面上形成疣状突起。在棘突中，表示粗糙度（SA1 / SA2，SA1，表示通过BET法测定的比表面积或Sears法）的SA1，SA2表示由平均粒径（D2）测定的比表面积图像分析方法）在1.7至10的范围内。此外，通过图像分析方法测量的平均直径（D2）在7至150nm的范围内。

45. 发明授权

US07902039B2 Method for manufacturing silicon wafer 有权
标题翻译：硅晶片制造方法
公开(公告)号：US07902039B2
公开(公告)日：2011-03-08
申请号：US11946643
申请日：2007-11-28
申请人： Shinichi Tomita , Masao Yoshimuta , Yasuyuki Hashimoto , Akira Nakashima
发明人： Shinichi Tomita , Masao Yoshimuta , Yasuyuki Hashimoto , Akira Nakashima
IPC分类号： H01L21/00
CPC分类号： H01L21/304 , H01L21/02024 , H01L21/2007 , H01L21/76256
摘要： A method for manufacturing a silicon wafer is characterized by performing one or both of grinding and polishing to a thin discoid silicon wafer to give bowl-shaped warpage that is concave at a central part to a wafer surface. One main surface of the thin discoid silicon wafer is adsorbed and held, and one or both of grinding and polishing are performed to the other main surface to fabricate a convex wafer whose thickness is increased from a wafer outer periphery toward a wafer center or fabricate a concave wafer whose thickness is reduced from the wafer outer periphery toward the wafer center. Then, the other main surface is adsorbed and held to protrude the center or the periphery of the one main surface side based on elastic deformation. One or both of grinding and polishing are carried out with respect to the one main surface to flatten the main surface, and adsorption and holding are released to give bowl-shaped warpage that is concave at the central part to the other main surface or the one main surface. By the method, an SOI wafer or an epitaxial silicon wafer having a high degree of flatness is obtained.
摘要翻译：硅晶片的制造方法的特征在于对薄盘状硅晶片进行研磨抛光中的一个或两个以给出在晶片表面的中心部分凹陷的碗形翘曲。吸附并保持薄盘形硅晶片的一个主表面，并且对另一个主表面进行研磨和抛光中的一个或两个以制造厚度从晶片外周朝向晶片中心增加的凸形晶片，或者制造其厚度从晶片外周朝向晶片中心减小的凹晶片。然后，基于弹性变形，另一个主表面被吸附并保持成一个主表面侧的中心或周边突出。研磨抛光中的一个或两个相对于一个主表面进行，以平坦化主表面，并且释放吸附和保持以产生碗形翘曲，其在中心部分处凹入另一个主表面或一个主表面。通过该方法，获得具有高度平坦度的SOI晶片或外延硅晶片。

46. 发明授权

US07604232B2 Sheet feeding device 有权
标题翻译：送纸装置
公开(公告)号：US07604232B2
公开(公告)日：2009-10-20
申请号：US11513212
申请日：2006-08-31
申请人： Akira Nakashima , Toyoaki Nanba
发明人： Akira Nakashima , Toyoaki Nanba
IPC分类号： B65H1/22
CPC分类号： B65H1/26 , B65H2405/121 , B65H2405/32 , B65H2511/51 , B65H2555/13 , B65H2220/01 , B65H2220/11
摘要： A sheet feeding device includes a casing having an engagement portion, and a sheet stacker detachably housed in the casing. The stacker has a liftable stacking plate, a handle, a lock claw, and a transmission mechanism. The plate is provided for loading a plurality of sheets. The handle is pivotable between operational and nonoperational positions. The claw is pivotable between engaged and disengaged positions. In the engaged and disengaged positions, the claw is engaged with, and disengaged from, the engagement portion, respectively. The mechanism has a solenoid and an interlock member. The solenoid has a plunger movable between locking and unlocking positions according to an input driving signal. The member allows, only with the plunger in the unlocking position, the claw to be moved from the engaged position to the disengaged position in association with pivot movement of the handle from the nonoperational position to the operational position.
摘要翻译：片材进给装置包括具有接合部的壳体和可拆卸地容纳在壳体中的片材堆垛机。堆垛机具有可升降的堆垛板，手柄，锁爪和传动机构。板被设置用于装载多个片材。手柄在操作和非操作位置之间可枢转。爪可在接合位置和脱离位置之间枢转。在接合和分离位置中，爪分别与接合部分接合并脱离啮合部分。该机构具有螺线管和互锁构件。螺线管具有根据输入驱动信号在锁定位置和解锁位置之间移动的柱塞。该构件允许只有当柱塞处于解锁位置时，爪将从把手从非操作位置的枢转运动与操作位置相关联地从接合位置移动到脱离位置。

47. 发明授权

US07540343B2 Fuel cell vehicle 失效
标题翻译：燃料电池车
公开(公告)号：US07540343B2
公开(公告)日：2009-06-02
申请号：US11428698
申请日：2006-07-05
申请人： Akira Nakashima , Tohru Ono , Daisuke Tsurumaki
发明人： Akira Nakashima , Tohru Ono , Daisuke Tsurumaki
IPC分类号： B60K1/00
CPC分类号： B60K1/00 , B62D25/025 , B62D25/20 , B62D25/2036
摘要： A fuel cell vehicle includes: a vehicle body; a floor panel provided in the vehicle body that has a floor tunnel that bulges in substantially a center in the width direction of the vehicle body; a pair of front seats each having a seating surface and a seat back and disposed on the floor panel outside of the floor tunnel in the width direction of the vehicle body; seat rails provided between the front seats and the floor panel and adapted to be able to move the front seats in the longitudinal direction of the vehicle body; and a fuel cell stack having a plurality of unit fuel cells stacked in the longitudinal direction of the vehicle body, being disposed under the floor tunnel so as to be substantially parallel with the seat rails.
摘要翻译：燃料电池车辆包括：车体; 设置在所述车身中的地板面板，所述地板通道具有在所述车体的宽度方向上的大致中心突出的地板通道; 一对前排座椅，每个前座椅具有座位表面和座椅靠背，并且在车体的宽度方向上设置在地板通道外面的地板面板上; 座椅导轨设置在前排座椅和地板面板之间，适于能够沿着车身纵向方向移动前排座椅; 以及燃料电池堆，其具有在车体的纵向方向上堆叠的多个单位燃料电池，布置在地板通道下方以与座椅轨道基本平行。

48. 发明申请

US20070045946A1 Sheet feeding device 有权
标题翻译：送纸装置
公开(公告)号：US20070045946A1
公开(公告)日：2007-03-01
申请号：US11513212
申请日：2006-08-31
申请人： Akira Nakashima , Toyoaki Nanba
发明人： Akira Nakashima , Toyoaki Nanba
IPC分类号： B65H5/02
CPC分类号： B65H1/26 , B65H2405/121 , B65H2405/32 , B65H2511/51 , B65H2555/13 , B65H2220/01 , B65H2220/11
摘要： A sheet feeding device includes a casing having an engagement portion, and a sheet stacker detachably housed in the casing. The stacker has a liftable stacking plate, a handle, a lock claw, and a transmission mechanism. The plate is provided for loading a plurality of sheets. The handle is pivotable between operational and nonoperational positions. The claw is pivotable between engaged and disengaged positions. In the engaged and disengaged positions, the claw is engaged with, and disengaged from, the engagement portion, respectively. The mechanism has a solenoid and an interlock member. The solenoid has a plunger movable between locking and unlocking positions according to an input driving signal. The member allows, only with the plunger in the unlocking position, the claw to be moved from the engaged position to the disengaged position in association with pivot movement of the handle from the nonoperational position to the operational position.
摘要翻译：片材进给装置包括具有接合部的壳体和可拆卸地容纳在壳体中的片材堆垛机。堆垛机具有可升降的堆垛板，手柄，锁爪和传动机构。板被设置用于装载多个片材。手柄在操作和非操作位置之间可枢转。爪可在接合位置和脱离位置之间枢转。在接合和分离位置中，爪分别与接合部分接合并脱离啮合部分。该机构具有螺线管和互锁构件。螺线管具有根据输入驱动信号在锁定位置和解锁位置之间移动的柱塞。该构件允许只有当柱塞处于解锁位置时，爪将从把手从非操作位置的枢转运动与操作位置相关联地从接合位置移动到脱离位置。

49. 发明申请

US20060060180A1 End supporting plate for single crystalline ingot 有权
标题翻译：单晶锭端支撑板
公开(公告)号：US20060060180A1
公开(公告)日：2006-03-23
申请号：US11226368
申请日：2005-09-15
申请人： Akira Nakashima
发明人： Akira Nakashima
IPC分类号： B28D1/08
CPC分类号： B28D5/0082 , Y10T156/1082 , Y10T156/12
摘要： This invention relates to an end supporting plate which can be attached to both ends of cylindrical ingot. By wire saw cutting, semiconductor wafers are sliced from the ingot attached with the end supporting plates. The end supporting plate has an elongated support surface. Maximum width of the support surface along a direction perpendicular to an axial direction of the plate is smaller than the length along the axial direction. The length of the support surface is approximately similar to a diameter of the ingot to which the end support plate is to be attached, whereas maximum width of the support is smaller than the diameter of the ingot.
摘要翻译：本发明涉及一种可以连接到圆柱形锭的两端的端部支撑板。通过线锯切割，半导体晶片从附接有端部支撑板的铸锭切片。端部支撑板具有细长的支撑表面。支撑表面沿着与板的轴向垂直的方向的最大宽度小于沿着轴向的长度。支撑表面的长度大致类似于待附接端部支撑板的锭的直径，而支撑件的最大宽度小于锭的直径。

50. 发明授权

US06340641B1 Substrate flattening method and film-coated substrate made thereby 有权
标题翻译：底材平整方法和由此制成的薄膜包衣基材
公开(公告)号：US06340641B1
公开(公告)日：2002-01-22
申请号：US09297343
申请日：1999-04-29
申请人： Ryo Muraguchi , Akira Nakashima , Atsushi Tonai , Michio Kimatsu , Katsuyuki Machida , Hakaru Kyuragi , Kazuo Imai
发明人： Ryo Muraguchi , Akira Nakashima , Atsushi Tonai , Michio Kimatsu , Katsuyuki Machida , Hakaru Kyuragi , Kazuo Imai
IPC分类号： H01L2131
CPC分类号： B05D1/286 , G11B5/8404
摘要： The present invention provides a method of easily planarizing the uneven surface of a substrate having an uneven surface. This method comprises the steps of forming a coating film containing spherical fine particles on a surface of a smooth substrate; sticking the surface of the smooth substrate provided with the coating film containing spherical fine particles to the uneven surface of a substrate having an uneven surface; and transferring the coating film containing spherical fine particles to the uneven surface of the substrate so that the uneven surface is planarized.
摘要翻译：本发明提供一种容易平坦化具有不平坦表面的基板的凹凸表面的方法。该方法包括在平滑基材的表面上形成含有球状微粒的涂膜的步骤; 将具有含有球状微粒的涂膜的光滑基板的表面粘附到具有不平坦表面的基板的凹凸表面上; 并将含有球状微粒的涂膜转印到基板的不平坦表面上，使得凹凸表面平坦化。

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