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    • 50. 发明授权
    • Green ceramic via metallization technique
    • 绿色陶瓷通过金属化技术
    • US5464652A
    • 1995-11-07
    • US178352
    • 1994-01-06
    • Richard P. HimmelRaymond Brown
    • Richard P. HimmelRaymond Brown
    • H01L21/48H01L23/367H01L23/498H01L23/538H05K1/03H05K3/40B05D5/12
    • H01L23/49827H01L21/4853H01L21/486H01L23/3677H01L23/5383H05K3/4046H01L2224/16H01L2924/09701H05K1/0306H05K2201/0382H05K2201/10234Y10T29/49117Y10T29/49124Y10T29/49204Y10T29/49218Y10T29/49224
    • The present invention provides a method for metallizing vias in co-fired ceramic green tape. A vacuum operated pick and place anvil comprising a porous block is used to pick up conductor balls from a bed. Air pressure is used to create a vacuum which pulls the conductor balls to the porous block. A stencil having openings is placed on a contact surface of the anvil, thereby permitting only one conductor ball to attach to each opening in the stencil. With the conductor balls attached to the anvil, the anvil is lowered onto the green tape. Next the anvil pushes the conductor balls into the tape until the conductor balls break through the opposite side of the tape. The anvil is retracted leaving the conductor balls lodged in the tape. It is possible to provide a green tape with pre-formed vias so that forcing the conductor balls into the tape is a simpler task. The locations of the openings in the stencil determines the location of the vias or must correspond to the vias in a tape having pre-formed vias. If the conductor balls protrude from any surface of the tape, the anvil or similar device can be used to flatten the protrusion.
    • 本发明提供了一种用于在共烧陶瓷生胶带中金属化通孔的方法。 使用包括多孔块的真空操作的拾取和放置砧座从床上拾取导体球。 空气压力用于产生将导体球拉到多孔块的真空。 具有开口的模板被放置在砧座的接触表面上,从而仅允许一个导体球附着在模板中的每个开口上。 将导体球连接到砧座上,将砧座下降到生胶带上。 接下来,砧将导体球推入带中,直到导体球穿过带的相对侧。 砧座被收回,使导体球落在带中。 可以提供具有预先形成的通孔的绿色带,使得将导体球强制进入带是更简单的任务。 模板中的开口的位置决定了通孔的位置,或者必须与具有预先形成的通孔的带中的通孔相对应。 如果导体球从带的任何表面突出,则可以使用砧座或类似装置使突起平坦化。