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41. 发明申请

US20210037657A1 MANUFACTURING METHOD OF CIRCUIT SUBSTRATE 有权
公开(公告)号：US20210037657A1
公开(公告)日：2021-02-04
申请号：US16844468
申请日：2020-04-09
申请人： Polytronics Technology Corp.
发明人： Hsun-Ching CHIANG , Hsiang-Yun YANG
IPC分类号： H05K3/06
摘要： A manufacturing method of a circuit substrate comprises the steps of providing a laminated substrate comprising an insulating layer and a circuit layer disposed on the insulating layer; forming a photoresist layer on the circuit layer; mechanically cutting the photoresist layer and a part of the circuit layer to form gaps; etching the circuit layer in the gaps until a surface of the insulating layer is exposed to form a circuit layout; and removing the photoresist layer to form the circuit substrate.

42. 发明授权

US10892130B2 Protection device and circuit protection apparatus containing the same 有权
公开(公告)号：US10892130B2
公开(公告)日：2021-01-12
申请号：US15924841
申请日：2018-03-19
申请人： Polytronics Technology Corp.
发明人： Tsungmin Su , Tongcheng Tsai , David Shau Chew Wang
IPC分类号： H02H5/00 , H01H85/46 , H01H37/76 , H05K1/02 , H01H85/046
摘要： A protection device comprises a first planar substrate, a second planar substrate, a heating element and a fusible element. The second planar substrate is attached to the underside of the first planar substrate to form a composite structure. The heating element comprises an insulating layer and a heating layer disposed thereon. The heating element is disposed on the first planar substrate, and the insulating layer is disposed between the first planar substrate and the heating layer. The fusible element is disposed above the heating element. The heating element heats up to blow the fusible element in the event of over-voltage or over-temperature.

43. 发明授权

US10892072B1 PTC device 有权
公开(公告)号：US10892072B1
公开(公告)日：2021-01-12
申请号：US16844585
申请日：2020-04-09
申请人： Polytronics Technology Corp.
发明人： Chun-Teng Tseng , Yao-Te Chang , Wen Feng Lee
IPC分类号： H01C7/02 , H01C1/14
摘要： A PTC device comprises a laminated substrate, a first PTC material layer, a second PTC material layer, a first metal layer and a second metal layer. The laminated substrate comprises a first conductive layer, a second conductive layer and an insulating layer laminated between the first and second conductive layers. The first PTC material layer is disposed on the first conductive layer, and the second PTC material layer is disposed on the second conductive layer. The first metal layer is disposed on the first PTC material layer, and the second metal layer is disposed on the second PTC material layer. The insulating layer has a through hole filled with PTC material to form a PTC connecting member of which one end connects to the first PTC material layer and another end connects to the second PTC material layer.

44. 发明申请

US20200273609A1 OVER-CURRENT PROTECTION DEVICE 审中-公开
公开(公告)号：US20200273609A1
公开(公告)日：2020-08-27
申请号：US16589704
申请日：2019-10-01
申请人： Polytronics Technology Corp.
发明人： CHUN-TENG TSENG , DAVID SHAU CHEW WANG
IPC分类号： H01C7/02 , H02H9/02 , H01C7/13 , H01C1/14
摘要： An over-current protection device is a hexahedron comprising an upper surface, a lower surface and four lateral surfaces. The over-current protection device comprises a PTC device, a first insulating layer, a first electrode layer and a second electrode layer. The PTC device comprises a first conductive layer, a second conductive layer and a PTC material layer laminated therebetween. The first conductive layer comprises a first conductive section and a second conductive section separated by at least one trench. The first insulating layer is disposed on the first conductive layer. The first electrode layer is disposed on the first insulating layer and electrically coupled to the first conductive section. The second electrode layer is disposed on the first insulating layer and electrically coupled to the second conductive section. The trench comprises a primary portion not parallel to a longitudinal direction of the first and second electrode layers.

45. 发明申请

US20190023960A1 THERMALLY CONDUCTIVE BOARD 审中-公开
公开(公告)号：US20190023960A1
公开(公告)日：2019-01-24
申请号：US15827897
申请日：2017-11-30
申请人： Polytronics Technology Corp.
发明人： KUO HSUN CHEN , MENG CHUN KO , YI AN SHA
IPC分类号： C09K5/14 , C08L63/00 , B32B15/092 , B32B15/20 , H05K1/02
摘要： A thermally conductive board is a laminated structure comprising a metal substrate, a thermally conductive and electrically insulating layer and a metal layer. The thermally conductive and electrically insulating layer is disposed on the metal substrate, and the metal layer is disposed on the thermally conductive and electrically insulating layer. The thermally conductive and electrically insulating layer comprises polymer and non-spherical thermally conductive filler dispersed therein. The polymer comprises at least two straight-chain epoxy resins with different EEW. The product of a mean particle size and a BET surface area of the non-spherical thermally conductive filler is 7.5-15 μm·m2/g. The thermally conductive and electrically insulating layer has a Tg of 40-90° C. and a thermal conductivity of 1-6 W/m·K.

46. 发明授权

US10141089B1 Surface-mountable over-current protection device 有权
公开(公告)号：US10141089B1
公开(公告)日：2018-11-27
申请号：US15827873
申请日：2017-11-30
申请人： Polytronics Technology Corp.
发明人： David Shau Chew Wang , Tsungmin Su
IPC分类号： H01C1/14 , H01C7/02 , H02H9/02 , H01C1/034 , H01C1/16
摘要： A surface-mountable over-current protection device comprises at least one chip, a first lead and a second lead. The chip comprises a PTC material layer and two metal electrode layers disposed on upper and lower surfaces of the PTC material layer. The first lead is bent into multiple portions comprising a first electrode connecting portion connecting to one of the two metal electrode layers of the at least one chip and a first soldering portion for surface-mounting. The second lead is bent into multiple portions comprising a second electrode connecting portion connecting to another one of the two electrode layers of the at least one chip and a second soldering portion for surface-mounting. The PTC material layer comprises crystalline polymer and conductive filler dispersed therein, and the conductive filler has a resistivity less than 500μΩ·cm. The surface-mountable over-current protection device can withstand a cycle life test of 300 cycles at 20V/40A without blowout.

47. 发明授权

US10096407B2 Surface-mountable over-current protection device 有权
公开(公告)号：US10096407B2
公开(公告)日：2018-10-09
申请号：US15437975
申请日：2017-02-21
申请人： Polytronics Technology Corp.
发明人： Chun Teng Tseng , Wen Feng Lee , Yung Hsien Chang , Yao Te Chang
IPC分类号： H01C7/02 , H01C7/13
摘要： A surface mountable over-current protection device comprises a PTC material layer, first and second conductive layers, left and right electrodes, left and right conductive members, and left and right insulating members. The PTC material layer comprises a left notch at a left end and a right notch at a right end. The first conductive layer comprises a primary portion disposed on an upper surface of the PTC material layer and a secondary portion extending over the left notch, and the second conductive layer comprises a primary portion disposed on a lower surface of the PTC material layer and a secondary portion extending over the underside of the right notch. The left conductive member connects to the left electrode and the first conductive layer and isolates from the second conductive layer. The right conductive member connects to the right electrode and the second conductive layer and isolates from the first conductive layer. The left and right insulating members are disposed in the left and right notches, respectively. The PTC material layer is not in direct contact with the left and right conductive members, and the primary portion and the secondary portion of the first or second conductive layer have different thicknesses.

48. 发明申请

US20180097352A1 PROTECTION DEVICE AND CIRCUIT PROTECTION APPARATUS CONTAINING THE SAME 审中-公开
公开(公告)号：US20180097352A1
公开(公告)日：2018-04-05
申请号：US15615340
申请日：2017-06-06
申请人： Polytronics Technology Corp.
发明人： Tsungmin SU , Tongcheng TSAI , David Shau Chew WANG
IPC分类号： H02H5/04 , H01C1/144 , H01C7/12 , H01C7/13 , H01C7/02 , H02H7/085
CPC分类号： H02H5/041 , H01C1/144 , H01C7/02 , H01C7/12 , H01C7/13 , H01H85/0047 , H01H85/0241 , H01H85/046 , H01H2085/0283 , H01H2207/008 , H01H2231/002 , H02H3/05 , H02H3/085 , H02H3/20 , H02H7/0852
摘要： A protection device comprises a first planar substrate, a second planar substrate, a heating element, a fusible element and an absorbent element. The first substrate comprises a first surface, and the second substrate comprises a second surface facing the first surface. The heating element is disposed on the first surface, and the fusible element is disposed above the heating element. The absorbent element is disposed on the second surface and above the fusible element. When over-current or over-temperature occurs, the heating element heats up to melt and blow the fusible element and the absorbent element absorbs melted metal of the fusible element.

49. 发明申请

US20170066955A1 THERMAL INTERFACE MATERIAL 审中-公开
标题翻译：热接口材料
公开(公告)号：US20170066955A1
公开(公告)日：2017-03-09
申请号：US15156781
申请日：2016-05-17
申请人： Polytronics Technology Corp.
发明人： Kuo Hsun CHEN , Yi An SHA
IPC分类号： C09K5/14
CPC分类号： C09K5/14
摘要： A thermal interface material comprises a fluoroelastomer component and a heat conductive filler evenly dispersed in the fluoroelastomer component. The fluoroelastomer component contains greater than 50% fluorine and has a Mooney viscosity ML(1+10) less than 60 at 121° C. The heat conductive filler comprises 40-65% by volume of the thermal interface material. The thermal interface material is manufactured by solventless processes, and has a heat conductivity between 0.7 W/m·K-9 W/m·K.
摘要翻译：热界面材料包括均匀分散在含氟弹性体组分中的含氟弹性体组分和导热填料。氟弹性体组分含有大于50％的氟，并且在121℃下门尼粘度ML（1 + 10）小于60。导热填料包含40-65体积％的热界面材料。热界面材料通过无溶剂法制造，导热系数在0.7W / m·K-9W / m·K之间。

50. 发明申请

US20150340181A1 REFLOWABLE THERMAL FUSE 审中-公开
标题翻译：可反射的热保险丝
公开(公告)号：US20150340181A1
公开(公告)日：2015-11-26
申请号：US14613981
申请日：2015-02-04
申请人： POLYTRONICS TECHNOLOGY CORP.
发明人： Chien Cheng HO , David Shau Chew WANG
IPC分类号： H01H37/76
CPC分类号： H01H37/761 , H01H37/70 , H01H2037/046 , H01H2037/762 , H01H2037/763
摘要： A reflowable thermal fuse comprises a base, a housing, an elastic conductive element, a sensor and a restraining element. The base comprises first and second bonding pads and combines with the housing to form an internal accommodating space in which the elastic conductive element has first and second ends connecting to the first and second bonding pads, respectively. The elastic conductive element is operable to exert a resilient force which is able to sever the connection between the second end and the second bonding pad. The sensor connects to the second end and the second bonding pad to form electrical connection. The restraining element comprises a pressing member going through an opening of the housing and pressing the second end to resist the resilient force during reflow. After reflow, the restraining element is removed and thereby the reflowable thermal fuse is in an activation condition.
摘要翻译：可回流热熔丝包括基座，外壳，弹性导电元件，传感器和约束元件。基座包括第一和第二接合焊盘并与壳体组合以形成内部容纳空间，弹性导电元件分别具有连接到第一和第二接合焊盘的第一和第二端。弹性导电元件可操作以施加能够切断第二端和第二接合焊盘之间的连接的弹性力。传感器连接到第二端和第二接合焊盘以形成电连接。约束元件包括穿过壳体的开口的按压构件，并且在回流期间按压第二端以抵抗弹性力。在回流之后，去除限制元件，从而可回流的热熔丝处于激活状态。

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