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    • 43. 发明授权
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • US07947585B2
    • 2011-05-24
    • US12090891
    • 2006-12-04
    • In Bok BaekSeong Jae LeeJong Heon YangChang Geun AhnHan Young YuKi Ju Im
    • In Bok BaekSeong Jae LeeJong Heon YangChang Geun AhnHan Young YuKi Ju Im
    • H01L21/22
    • H01L29/66439B82Y10/00H01L21/0273H01L21/28123H01L29/66484H01L29/66545H01L29/66575H01L29/66772H01L29/7613H01L29/7831
    • Provided is a method of manufacturing a semiconductor device in which properties of photoresist through a lithography process are changed to form a dummy structure, and the structure is applied to a process of forming a gate electrode. The method includes the steps of: forming a buffer layer on the top of a semiconductor substrate; applying an inorganic photoresist on the buffer layer, and forming a photoresist pattern using a lithography process; thermally treating the photoresist pattern using a predetermined gas; uniformly depositing an insulating layer on the thermally treated structure, and etching the deposited layer by the deposited thickness in order to expose the thermally treated photoresist pattern; depositing an insulating layer on the etched structure, and etching the deposited insulating layer to expose the thermally treated photoresist pattern; removing the exposed photoresist pattern using an etching process; forming a gate oxide layer in the portion in which the photoresist pattern is removed; and forming a gate electrode on the gate oxide layer. Accordingly, in forming a structure for manufacturing a nano-sized device, the properties of the layer formed by a lithography process are improved through thermal treatment, and thus the structure used to manufacture various devices can be easily formed.
    • 提供了通过光刻处理改变光致抗蚀剂的特性以形成虚拟结构的半导体器件的制造方法,并且将该结构应用于形成栅电极的工艺。 该方法包括以下步骤:在半导体衬底的顶部上形成缓冲层; 在缓冲层上施加无机光致抗蚀剂,并使用光刻工艺形成光致抗蚀剂图案; 使用预定气体热处理光刻胶图案; 在热处理结构上均匀沉积绝缘层,并通过沉积的厚度蚀刻沉积层,以暴露热处理的光致抗蚀剂图案; 在蚀刻的结构上沉积绝缘层,并蚀刻沉积的绝缘层以暴露热处理的光致抗蚀剂图案; 使用蚀刻工艺去除曝光的光致抗蚀剂图案; 在除去光致抗蚀剂图案的部分中形成栅氧化层; 以及在所述栅极氧化物层上形成栅电极。 因此,在形成纳米尺寸器件的制造结构时,通过热处理提高了通过光刻工艺形成的层的性质,因此可以容易地形成用于制造各种器件的结构。
    • 47. 发明申请
    • BIOSENSOR AND METHOD OF MANUFACTURING THE SAME
    • 生物传感器及其制造方法
    • US20090152597A1
    • 2009-06-18
    • US12195305
    • 2008-08-20
    • Tae Youb KIMNae Man ParkHan Young YuMoon Gyu JangJong Heon Yang
    • Tae Youb KIMNae Man ParkHan Young YuMoon Gyu JangJong Heon Yang
    • H01L29/12H01L21/00
    • G01N27/4146G01N27/4145Y10S977/71Y10S977/742Y10S977/963
    • Provided are a biosensor with a silicon nanowire and a method of manufacturing the same, and more particularly, a biosensor with a silicon nanowire including a defect region formed by irradiation of an electron beam, and a method of manufacturing the same. The biosensor includes: a silicon substrate; a source region disposed on the silicon substrate; a drain region disposed on the silicon substrate; and a silicon nanowire disposed on the source region and the drain region, and having a defect region formed by irradiation of an electron beam. Therefore, by irradiating a certain region of a high-concentration doped silicon nanowire with an electron beam to lower electron mobility in the certain region, it is possible to maintain a low contact resistance between the silicon nanowire and a metal electrode and to lower operation current of a biomaterial detection part, thereby improving sensitivity of the biosensor.
    • 本发明提供一种具有硅纳米线的生物传感器及其制造方法,更具体地,涉及具有通过电子束照射形成的缺陷区域的硅纳米线的生物传感器及其制造方法。 生物传感器包括:硅衬底; 设置在所述硅基板上的源极区域; 设置在所述硅基板上的漏极区域; 以及设置在源极区域和漏极区域上的硅纳米线,并且具有通过电子束的照射而形成的缺陷区域。 因此,通过用特定的区域照射具有电子束的高浓度掺杂的硅纳米线的特定区域来降低电子迁移率,可以保持硅纳米线与金属电极之间的低接触电阻并降低工作电流 的生物材料检测部件,从而提高生物传感器的灵敏度。