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41. 发明申请

US20070221128A1 Method and apparatus for improving uniformity of large-area substrates 审中-公开
标题翻译：改善大面积基板均匀性的方法和装置
公开(公告)号：US20070221128A1
公开(公告)日：2007-09-27
申请号：US11389603
申请日：2006-03-23
申请人： Soo Young Choi , John M. White
发明人： Soo Young Choi , John M. White
IPC分类号： C23C16/00
CPC分类号： C23C16/45565 , C23C16/345 , C23C16/5096 , C23C16/52
摘要： Embodiments of the present invention generally provide methods and apparatus for improving the uniformity of a film deposited on a large-area substrate, particularly for films deposited in a PECVD system. In one embodiment, a plasma-processing chamber is configured to be asymmetrical relative to a substrate in order to compensate for plasma density non-uniformities in the chamber caused by unwanted magnetic fields. In another embodiment, a plasma-processing chamber is adapted to create a neutral current bypass path that reduces electric current flow through a magnetic field-generating feature in the chamber. In another embodiment, a method is provided for depositing a uniform film on a large-area substrate in a plasma-processing chamber. The chamber is made electrically symmetric during processing by creating a neutral current bypass path, wherein the neutral current bypass path substantially reduces neutral current flow through a magnetic field-generating feature in the chamber.
摘要翻译：本发明的实施例通常提供了用于改善沉积在大面积基板上的膜的均匀性的方法和装置，特别是用于沉积在PECVD系统中的薄膜。在一个实施例中，等离子体处理室被配置为相对于衬底是不对称的，以便补偿由不想要的磁场引起的腔室中的等离子体密度不均匀性。在另一个实施例中，等离子体处理室适于产生中性电流旁路路径，其减小通过腔室中的磁场产生特征的电流。在另一个实施例中，提供了一种用于在等离子体处理室中的大面积衬底上沉积均匀膜的方法。通过产生中性电流旁路路径，室在处理期间被电对称，其中中性线旁路通过基本上减少通过腔室中的磁场产生特征的中性点电流。

42. 发明授权

US07055809B2 Vaporizing reactant liquids for chemical vapor deposition film processing 失效
公开(公告)号：US07055809B2
公开(公告)日：2006-06-06
申请号：US10817396
申请日：2004-04-02
申请人： Visweswaren Sivaramakrishnan , John M. White
发明人： Visweswaren Sivaramakrishnan , John M. White
IPC分类号： B01F3/04
CPC分类号： C23C16/4481 , B01F3/022 , Y10S261/65
摘要： The disclosure relates to a vaporizer valve which accepts a carrier gas and a pressurized liquid and forms a mixture of the carrier gas and vaporized liquid. An internal cavity receives the carrier gas through a carrier aperture and the liquid through a liquid aperture, and the mixed gas and vapor are exhausted out of the cavity via a third aperture. A moveable diaphragm disposed adjacent to the liquid aperture forms a vaporization region having a pressure gradient. The liquid passing through this pressure gradient vaporizes due to expansion. By controlling the diaphragm position with a feedback control circuit responsive to a liquid flow rate monitor, the liquid flow rate may be controlled independently of the carrier gas flow rate.

43. 发明授权

US07029529B2 Method and apparatus for metallization of large area substrates 失效
标题翻译：用于大面积基板金属化的方法和装置
公开(公告)号：US07029529B2
公开(公告)日：2006-04-18
申请号：US10247403
申请日：2002-09-19
申请人： Kam S. Law , Robert Z. Bachrach , John M. White , Quanyuan Shang
发明人： Kam S. Law , Robert Z. Bachrach , John M. White , Quanyuan Shang
IPC分类号： B05C1/02 , B05C13/02
CPC分类号： C23C18/1632 , B05D1/002 , B05D7/142 , C23C18/1605 , C23C18/1608 , H01L21/288 , H01L21/76838 , H05K3/12 , H05K3/182
摘要： A system and method for processing large area substrates. In one embodiment, a system for processing large area substrates includes prep station, a stamping station and a stamp that is automatically moved between the stamping station and the prep station. The stamping station is adapted to retain a large area substrate thereon. The stamp has a patterned bottom surface that is adapted for microcontact printing. The prep station is for applying a precursor to the patterned bottom surface of the stamp. In one embodiment, a method for processing large area substrates includes the steps of disposing a large area substrate on a platen, inking a stamp adapted for microcontact printing, and automatically contacting a bottom of the stamp to the large area substrate supported on a platen.
摘要翻译：一种用于处理大面积基板的系统和方法。在一个实施例中，用于处理大面积基板的系统包括准备台，冲压站和在冲压站和准备站之间自动移动的印模。冲压站适于在其上保持大面积的基板。印模具有适于微接触印刷的图案底面。准备站用于将前体施加到印模的图案化底表面。在一个实施例中，一种用于处理大面积衬底的方法包括以下步骤：将大面积衬底设置在压板上，上墨适用于微接触印刷，以及自动地将印模底部接触到支撑在压板上的大面积衬底。

44. 发明授权

US07017269B2 Suspended gas distribution plate 有权
标题翻译：悬浮气体分配板
公开(公告)号：US07017269B2
公开(公告)日：2006-03-28
申请号：US10729565
申请日：2003-12-05
申请人： John M. White , Ernst Keller , Wendell T. Blonigan
发明人： John M. White , Ernst Keller , Wendell T. Blonigan
IPC分类号： B23P15/00 , C23C16/455 , H01L21/00
CPC分类号： C23C16/45565 , C23C16/455 , C23C16/5096 , H01J37/3244 , Y10T29/49428 , Y10T29/49826
摘要： A gas inlet manifold for a plasma chamber having a perforated gas distribution plate suspended by flexible side walls. The flexible suspension minimizes mechanical stress due to thermal expansion of the gas distribution plate. In another aspect, the suspension provides thermal isolation between the gas distribution plate and other components of the chamber.
摘要翻译：一种用于等离子体室的气体入口歧管，其具有由柔性侧壁悬挂的穿孔气体分配板。柔性悬架使气体分配板的热膨胀的机械应力最小化。在另一方面，悬架提供气体分配板和腔室的其它部件之间的热隔离。

45. 发明授权

US07008303B2 Web lift system for chemical mechanical planarization 失效
公开(公告)号：US07008303B2
公开(公告)日：2006-03-07
申请号：US10408032
申请日：2003-04-03
申请人： John M. White , Phillip R. Sommer , Sasson Somekh
发明人： John M. White , Phillip R. Sommer , Sasson Somekh
IPC分类号： B24B1/00 , B24B7/00
CPC分类号： B24B37/16 , B24B21/004 , B24B21/008 , B24B21/20
摘要： Generally, a method and system for lifting a web of polishing material is provided. In one embodiment, the system includes a platen that has a first lift member disposed adjacent to a first side and a second lift member disposed adjacent to a second side. The platen is adapted to support the web of polishing media that is disposed between the first and the second lift members. A method includes supporting a web of polishing media on a platen between a first lift member and a second lift member and moving at least the first lift member or the second lift member to an extended position relative the platen that places the web in a spaced-apart relation with the platen.

46. 发明授权

US06837779B2 Chemical mechanical polisher with grooved belt 失效
标题翻译：化学机械抛光机带槽带
公开(公告)号：US06837779B2
公开(公告)日：2005-01-04
申请号：US09851185
申请日：2001-05-07
申请人： Christopher W. Smith , John M. White
发明人： Christopher W. Smith , John M. White
IPC分类号： B24B21/04 , B24B37/26 , B24D11/00 , B24B21/02
CPC分类号： B24B37/26 , B24B21/04
摘要： A chemical mechanical polishing apparatus has a substrate holder, a polishing belt, and a backing member positioned on a side of the polishing belt opposite the substrate holder. The polishing belt has a polishing surface to contact at least a portion of the substrate held by the substrate holder. The polishing belt is movable in a first direction in a generally linear path relative to the substrate. The polishing belt has a plurality of grooves formed therein.
摘要翻译：化学机械抛光装置具有衬底保持器，抛光带和位于与衬底保持器相对的抛光带侧面上的背衬构件。抛光带具有与衬底保持器保持的衬底的至少一部分接触的抛光表面。研磨带可相对于基底在大致线性的路径中沿第一方向移动。抛光带具有形成在其中的多个槽。

47. 发明授权

US06825134B2 Deposition of film layers by alternately pulsing a precursor and high frequency power in a continuous gas flow 有权
标题翻译：通过在连续气流中交替地脉冲前驱和高频功率沉积膜层
公开(公告)号：US06825134B2
公开(公告)日：2004-11-30
申请号：US10254627
申请日：2002-09-24
申请人： Kam S. Law , Quanyuan Shang , William R. Harshbarger , Dan Maydan , Soo Young Choi , Beom Soo Park , Sanjay Yadav , John M. White
发明人： Kam S. Law , Quanyuan Shang , William R. Harshbarger , Dan Maydan , Soo Young Choi , Beom Soo Park , Sanjay Yadav , John M. White
IPC分类号： H01L21471
CPC分类号： C23C16/45542 , C23C16/402 , H01L21/02164 , H01L21/02274 , H01L21/0228 , H01L21/3143 , H01L21/31612 , H01L21/31683 , H01L21/318 , H01L21/3185 , H01L21/32105 , H01L21/3211 , H01L29/66765
摘要： A method of film layer deposition is described. A film layer is deposited using a cyclical deposition process. The cyclical deposition process consists essentially of a continuous flow of one or more process gases and the alternate pulsing of a precursor and energy to form a film on a substrate structure.
摘要翻译：描述了膜层沉积的方法。使用循环沉积工艺沉积膜层。循环沉积过程基本上由一种或多种工艺气体的连续流动以及前体和能量的交替脉冲组成在衬底结构上形成膜。

48. 发明授权

US06820298B2 Wafer scrubbing device having brush assembly and mounting assembly forming spherical joint 有权
标题翻译：具有刷组件和安装组件形成球形接头的晶片擦洗装置
公开(公告)号：US06820298B2
公开(公告)日：2004-11-23
申请号：US09838959
申请日：2001-04-19
申请人： John M White , Ying Yu , Michael Sugarman
发明人： John M White , Ying Yu , Michael Sugarman
IPC分类号： B08B104
CPC分类号： H01L21/67046 , B08B1/04 , Y10T403/591 , Y10T403/599
摘要： A brush mounting system for a wafer scrubbing device includes a brush mandrel and a mounting assembly on which the brush mandrel is mounted. The mounting assembly includes a mounting member adapted to be mounted to a wall of the wafer scrubbing device, and a bearing secured to the mounting member. A brush support is rotatably mounted on the bearing and has an outer end that includes a contact surface adapted to contact the brush mandrel. The contact surface has a spherical profile. The brush mandrel includes a corresponding contact surface having a spherical profile, so that the brush mandrel and the mounting assembly form a spherical joint at the point of contact.
摘要翻译：用于晶片洗涤装置的刷子安装系统包括刷心轴和安装组件，其上安装有刷心轴。安装组件包括适于安装到晶片洗涤装置的壁上的安装构件和固定到安装构件的轴承。刷支撑件可旋转地安装在轴承上，并具有外端，该外端包括适于接触刷心的接触表面。接触表面具有球形轮廓。刷心轴包括具有球形轮廓的对应的接触表面，使得刷心轴和安装组件在接触点处形成球形接头。

49. 发明授权

US06517303B1 Substrate transfer shuttle 失效
公开(公告)号：US06517303B1
公开(公告)日：2003-02-11
申请号：US09082484
申请日：1998-05-20
申请人： John M. White , Norman L. Turner , Robin L. Tiner , Ernst Keller , Shinichi Kurita , Wendell T. Blonigan , David E. Berkstresser
发明人： John M. White , Norman L. Turner , Robin L. Tiner , Ernst Keller , Shinichi Kurita , Wendell T. Blonigan , David E. Berkstresser
IPC分类号： B65G133
CPC分类号： H01L21/67748 , C03B25/08 , C03B29/08 , C03B35/142 , C03B35/202 , C03B2225/02 , C03C17/002 , F27D3/00 , F27D5/00 , H01L21/67173 , H01L21/67236 , Y02P40/57 , Y10S414/135 , Y10S414/139
摘要： The present invention provides an apparatus and method for substrate transport. In systems according to the invention, at least a first and second chamber are provided. The first chamber may be a load lock and the second chamber a processing chamber. A substrate transfer shuttle is provided and is moveable along a linear path defined by guide rollers between one position in the first chamber and another position in the second chamber. In this way, the substrate may be transferred, in both a forward and a reverse direction, between the first chamber and the second chamber. The substrate transfer shuttle is structured so that a substrate may be removed therefrom by moving a support in one of the chambers from a lowered position to an intermediate position, after which the substrate transfer shuttle may be removed from the chamber.

50. 发明授权

US06517048B2 Isolation valves 有权
公开(公告)号：US06517048B2
公开(公告)日：2003-02-11
申请号：US09938761
申请日：2001-08-24
申请人： Gary C. Ettinger , John M. White
发明人： Gary C. Ettinger , John M. White
IPC分类号： F16K310
CPC分类号： F16K3/188
摘要： Isolation valves for selectively sealing a first region from a second region. A gate valve can include a housing which defines a channel between the first and second regions. The valve includes a gate, located in the housing, and displaceable between a stowed position and a deployed position. When the gate is in the stowed position, communication is permitted between the first and second regions. When the gate is in the deployed position, the gate spans the channel and can be controlled to isolate the first and second regions. The valves can be used, for example, in connection with systems for processing large glass substrates. The valves are particularly useful for isolating long rectangular openings, such as the openings in substrate processing chambers. Isolating processing chambers or load lock chambers from one another, for example, in a linear system, is facilitated.

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