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41. 发明申请

US20130037905A1 HYBRID SUBSTRATELESS DEVICE WITH ENHANCED TUNING EFFICIENCY 有权
标题翻译：具有增强调谐效率的混合无底层设备
公开(公告)号：US20130037905A1
公开(公告)日：2013-02-14
申请号：US13205745
申请日：2011-08-09
申请人： Ivan Shubin , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Ivan Shubin , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： H01L27/12 , H01L21/50
CPC分类号： H01L27/1465 , H01L21/187 , H01L27/14661 , H01L27/1467 , H01L27/14881 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00
摘要： In a hybrid integrated module, a semiconductor die is mechanically coupled face-to-face to an integrated device in which the substrate has been removed. For example, the integrated circuit may include an optical device fabricated on a silicon-on-insulator (SOI) wafer in which the backside silicon handler has been completely removed, thereby facilitating improved device performance and highly efficient thermal tuning of the operating wavelength of the optical device. Moreover, the semiconductor die may be a VLSI chip that provides power, and serves as a mechanical handler and/or an electrical driver. The thermal tuning efficiency of the substrateless optical device may be enhanced by over 100× relative to an optical device with an intact substrate, and by 5× relative to an optical device in which the substrate has only been removed in proximity to the optical device.
摘要翻译：在混合集成模块中，将半导体管芯面对面地机械耦合到已经去除衬底的集成器件。例如，集成电路可以包括制造在绝缘体上硅（SOI）晶片上的光学器件，其中背面硅处理器已经被完全去除，从而有助于改进器件性能和高效率地调谐工作波长光学装置。此外，半导体管芯可以是提供电力并用作机械处理器和/或电驱动器的VLSI芯片。相对于具有完整衬底的光学器件，无基底光学器件的热调谐效率可以提高超过100倍，并且相对于其中衬底仅在光学器件附近被去除的光学器件可以提高5倍。

42. 发明授权

US08325773B2 Structures and methods for adjusting the wavelengths of lasers via temperature control 有权
公开(公告)号：US08325773B2
公开(公告)日：2012-12-04
申请号：US13326297
申请日：2011-12-14
申请人： Ashok V. Krishnamoorthy , John E. Cunningham , Bruce M. Guenin , Howard L. Davidson
发明人： Ashok V. Krishnamoorthy , John E. Cunningham , Bruce M. Guenin , Howard L. Davidson
IPC分类号： H01S3/04
CPC分类号： H01S5/423 , H01S5/005 , H01S5/02453 , H01S5/02461 , H01S5/0261 , H01S5/0422 , H01S5/0612 , H01S5/18305 , H01S5/18327 , H01S5/4087
摘要： One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths.

43. 发明授权

US08195990B2 Misalignment compensation for proximity communication 有权
标题翻译：邻近通信的对准补偿
公开(公告)号：US08195990B2
公开(公告)日：2012-06-05
申请号：US13212900
申请日：2011-08-18
申请人： Ronald Ho , Ashok V. Krishnamoorthy , John E. Cunningham , Robert J. Drost
发明人： Ronald Ho , Ashok V. Krishnamoorthy , John E. Cunningham , Robert J. Drost
IPC分类号： G11B5/00
CPC分类号： H04B5/0075 , H01L25/065 , H01L2924/0002 , H04B17/318 , H04L1/0009 , Y10T29/49133 , H01L2924/00
摘要： In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels.
摘要翻译：在接近通信系统中，一个芯片上的发射元件与与第一芯片并置的第二芯片上的接收元件对齐。然而，如果元件是静态的或动态的，则芯片之间的耦合会降低。可以通过可控地降低系统的性能来补偿未对准。例如，可以增加发射信号强度。可以增加用于偏置每个位的位周期或时间段，从而降低带宽。诸如电容器的多个耦合元件可以组合在一起，从而减少通道数量。可以通过减少每个符号的比特数来增加诸如图像的符号的粒度。诸如电容器的多个耦合元件可以组合在一起，从而减少通道数量。

44. 发明授权

US08188581B2 Mechanical coupling in a multi-chip module using magnetic components 有权
公开(公告)号：US08188581B2
公开(公告)日：2012-05-29
申请号：US12568024
申请日：2009-09-28
申请人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： H01L23/495
CPC分类号： H01L23/13 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L2224/16147 , H01L2224/16237 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/81141 , H01L2224/81191 , H01L2225/0651 , H01L2225/06517 , H01L2225/06593 , H01L2924/00014 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01051 , H01L2924/01056 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features mate with each other. In particular, a positive feature may mate with a given pair of negative features, which includes negative features on each of the substrates. Furthermore, at least one of the negative features in the given pair may include a hard magnetic material, and the positive feature and the other negative feature in the given pair may include a soft magnetic material that provide a flux-return path to the hard magnetic material. In this way, the hard magnetic material may facilitate the remateable mechanical coupling of the substrates.

45. 发明授权

US08121446B2 Macro-chip including a surface-normal device 有权
标题翻译：宏芯片包括表面正常的设备
公开(公告)号：US08121446B2
公开(公告)日：2012-02-21
申请号：US12566101
申请日：2009-09-24
申请人： Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： G02B6/12 , G02B6/26 , G02B6/36
CPC分类号： G02B6/4214 , G02B6/4201 , G02B6/43
摘要： A multi-chip module (MCM) is described. This MCM includes two substrates having facing surfaces. Disposed on a surface of a first of these substrates, there is an optical waveguide, having an eigenmode in the plane of the surface, and an optical coupler, which redirects optical signals to and/or from the optical waveguide and a direction normal to the surface. Furthermore, disposed on a surface of a second of the substrates, which faces the surface of the first substrate, and which overlaps the optical coupler, there is an optoelectronic device. This optoelectronic device, which has an eigenmode in a direction perpendicular to the surface of the second substrate, selectively receives or provides the optical signal to and/or from the optical coupler. For example, the selective receiving or providing may be controlled by selectively applying a potential to the quantum-well device, thereby changing the optical properties of the optoelectronic device.
摘要翻译：描述了多芯片模块（MCM）。该MCM包括具有相对表面的两个基板。设置在这些基板中的第一个基板的表面上，存在在表面的平面中具有本征模的光波导和光耦合器，其将光信号重定向到和/或从光波导和垂直于表面。此外，设置在面对第一基板的表面并且与光耦合器重叠的第二基板的表面上，存在光电子器件。该光电子器件在垂直于第二衬底的表面的方向上具有本征模式，选择性地接收或向光耦合器提供光信号。例如，可以通过选择性地向量子阱器件施加电势来控制选择性接收或提供，从而改变光电器件的光学特性。

46. 发明申请

US20110281395A1 SELF-ASSEMBLY OF MICRO-STRUCTURES 有权
标题翻译：自组织微结构
公开(公告)号：US20110281395A1
公开(公告)日：2011-11-17
申请号：US11864369
申请日：2007-09-28
申请人： Ashok V. Krishnamoorthy , John E. Cunningham , James G. Mitchell
发明人： Ashok V. Krishnamoorthy , John E. Cunningham , James G. Mitchell
IPC分类号： H01L21/50
CPC分类号： H01L23/48 , H01L25/0657 , H01L25/50 , H01L2224/16 , H01L2225/06513 , H01L2225/06531 , H01L2225/06534 , H01L2225/06593 , H01L2924/01079 , H01L2924/10253 , H01L2924/00
摘要： Embodiments of a method for assembling a multi-chip module (MCM) are described. During this method, a fluid that includes coupling elements is applied to a surface of a base plate in the MCM. Then, at least some of the coupling elements are positioned into negative features on the surface of the base plate using fluidic assembly. Note that a given coupling element selects a given negative feature using chemical-based selection and/or geometry-based selection. Next, the fluid and excess coupling elements (which reside in regions outside of the negative features on the surface) are removed.
摘要翻译：描述了用于组装多芯片模块（MCM）的方法的实施例。在该方法中，包括耦合元件的流体被施加到MCM中的基板的表面。然后，使用流体组件将至少一些联接元件定位在基板的表面上的负特征中。注意，给定的耦合元件使用基于化学的选择和/或基于几何的选择来选择给定的负特征。接下来，去除流体和过量的耦合元件（其位于表面上的负特征之外的区域中）。

47. 发明申请

US20110278718A1 ASSEMBLY OF MULTI-CHIP MODULES USING REFLOWABLE FEATURES 有权
标题翻译：使用可逆特性组装多芯片模块
公开(公告)号：US20110278718A1
公开(公告)日：2011-11-17
申请号：US12781732
申请日：2010-05-17
申请人： Hiren D. Thacker , Jing Shi , John E. Cunningham , Ashok V. Krishnamoorthy
发明人： Hiren D. Thacker , Jing Shi , John E. Cunningham , Ashok V. Krishnamoorthy
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L23/13 , H01L23/48 , H01L23/49811 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/0652 , H01L25/50 , H01L2224/0401 , H01L2224/05557 , H01L2224/05558 , H01L2224/05571 , H01L2224/05655 , H01L2224/05671 , H01L2224/13147 , H01L2224/13155 , H01L2224/1319 , H01L2224/13541 , H01L2224/13561 , H01L2224/1357 , H01L2224/13578 , H01L2224/13611 , H01L2224/14051 , H01L2224/14505 , H01L2224/16147 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17517 , H01L2224/81141 , H01L2224/81211 , H01L2224/81815 , H01L2225/06531 , H01L2225/06593 , H01L2924/0002 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/15787 , H01L2924/00012 , H01L2924/00014 , H01L2924/01082 , H01L2924/01079 , H01L2924/01029 , H01L2924/01049 , H01L2924/206 , H01L2924/01028 , H01L2224/05552 , H01L2924/00
摘要： A multi-chip module (MCM) that includes at least two substrates, having facing surfaces, which are mechanically coupled by a set of coupling elements having a reflow characteristic, is described. One of the two substrates includes another set of coupling elements having another reflow characteristic, which is different than the reflow characteristic. These different reflow characteristics of the sets of coupling elements allow different temperature profiles to be used when bonding the two substrates to each other than when bonding the one of the two substrates to a carrier. For example, the temperature profiles may have different peak temperatures and/or different durations from one another. These reflow characteristics may facilitate low-cost, high-yield assembly and alignment of the substrates in the MCM, and may allow temperature-sensitive components to be included in the MCM.
摘要翻译：描述了包括具有面对表面的至少两个基板的多芯片模块（MCM），其通过一组具有回流特性的耦合元件机械耦合。两个基板中的一个包括另一组具有不同于回流特性的另外的回流特性的耦合元件。耦合元件组的这些不同的回流特性允许在将两个基板彼此接合时使用不同的温度曲线，而不是将两个基板中的一个接合到载体上。例如，温度分布可以具有不同的峰值温度和/或彼此不同的持续时间。这些回流特性可以促进MCM中的基板的低成本，高产量组装和对准，并且可以允许将温度敏感组件包括在MCM中。

48. 发明授权

US08039308B2 Integrated-circuit package for proximity communication 有权
标题翻译：用于近距离通信的集成电路封装
公开(公告)号：US08039308B2
公开(公告)日：2011-10-18
申请号：US13006227
申请日：2011-01-13
申请人： James G. Mitchell , John E. Cunningham , Ashok V. Krishnamoorthy
发明人： James G. Mitchell , John E. Cunningham , Ashok V. Krishnamoorthy
IPC分类号： H01L21/00
CPC分类号： H01L25/0652 , H01L23/10 , H01L23/48 , H01L24/02 , H01L24/16 , H01L24/72 , H01L24/81 , H01L24/95 , H01L25/50 , H01L2224/0401 , H01L2224/13099 , H01L2224/73251 , H01L2224/81136 , H01L2224/81801 , H01L2224/95136 , H01L2225/06513 , H01L2225/06531 , H01L2225/06534 , H01L2225/06593 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01067 , H01L2924/01074 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10157 , H01L2924/10158 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H01L2924/00 , H01L2224/16 , H01L2224/72
摘要： Embodiments of a multi-chip module (MCM) are described. This MCM includes a first semiconductor die and a second semiconductor die, where a given semiconductor die, which can be the first semiconductor die or the second semiconductor die, includes proximity connectors proximate to a surface of the given semiconductor die. Moreover, the given semiconductor die is configured to communicate signals with the other semiconductor die via proximity communication through one or more of the proximity connectors. Furthermore, the MCM includes an alignment plate and a top plate coupled to the alignment plate. This alignment plate includes a first negative feature configured to accommodate the first semiconductor die and a second negative feature configured to accommodate the second semiconductor die, and the top plate includes a positive feature. Note that the positive feature is coupled to the first semiconductor die, and the positive feature facilitates mechanical positioning of the first semiconductor die.
摘要翻译：描述了多芯片模块（MCM）的实施例。该MCM包括第一半导体管芯和第二半导体管芯，其中可以是第一半导体管芯或第二半导体管芯的给定半导体管芯包括靠近给定半导体管芯的表面的接近连接器。此外，给定的半导体管芯被配置为通过一个或多个接近连接器的接近通信与另一个半导体管芯通信信号。此外，MCM包括对准板和联接到对准板的顶板。该对准板包括被配置为容纳第一半导体管芯的第一负特性构件和被配置为容纳第二半导体管芯的第二负特征，并且顶板包括正特征。注意，正特征耦合到第一半导体管芯，并且正特征有利于第一半导体管芯的机械定位。

49. 发明申请

US20110223778A1 MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER 有权
标题翻译：具有多级插补器的多芯片模块
公开(公告)号：US20110223778A1
公开(公告)日：2011-09-15
申请号：US12719975
申请日：2010-03-09
申请人： Eugene M. Chow , John E. Cunningham , James G. Mitchell , Ivan Shubin
发明人： Eugene M. Chow , John E. Cunningham , James G. Mitchell , Ivan Shubin
IPC分类号： H01R12/02 , B23P11/00 , H01R43/16
CPC分类号： H01L23/49811 , H01L21/4853 , H01L21/6835 , H01L23/13 , H01L23/147 , H01L23/15 , H01L23/49827 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0652 , H01L2221/68309 , H01L2221/68345 , H01L2223/54426 , H01L2223/54473 , H01L2224/13 , H01L2224/13016 , H01L2224/131 , H01L2224/136 , H01L2224/16237 , H01L2224/81005 , H01L2224/81007 , H01L2224/81136 , H01L2224/81138 , H01L2224/81141 , H01L2224/81191 , H01L2224/81192 , H01L2224/81801 , H01L2224/81901 , H01L2924/0001 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15156 , H01L2924/15787 , Y10T29/49165 , Y10T29/49204 , Y10T29/49895 , Y10T29/49947 , H01L2924/00012 , H01L2224/13099 , H01L2924/00
摘要： A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors.
摘要翻译：描述了包括多层插入板的多层插入板和多芯片模块（MCM）。多层插入板的不同区域中的第一表面和第二表面具有相关联的不同厚度。此外，第一微弹簧连接器和第二微弹簧连接器分别设置在第一表面和第二表面上。在MCM中，多级插入板的给定的一个第一表面面向MCM中芯片阵列的第一层中的桥式芯片，使得设置在桥式芯片上的第一连接器机械地和电耦合到第一个微型弹簧连接器。类似地，多层插入板的给定的一个第二表面面向芯片阵列中的第二层中的岛状芯片，使得设置在岛状芯片上的第二连接器机械地和电耦合到第二微型弹簧连接器

50. 发明申请

US20100329685A1 OPTICAL DEVICE WITH REDUCED THERMAL TUNING ENERGY 有权
标题翻译：具有减少热调节能的光学装置
公开(公告)号：US20100329685A1
公开(公告)日：2010-12-30
申请号：US12493509
申请日：2009-06-29
申请人： Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham , Guoliang Li
发明人： Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham , Guoliang Li
IPC分类号： H04J14/02 , H04B10/04 , H04B10/06
CPC分类号： G02F1/025 , G02F1/0147 , G02F2203/05 , G02F2203/15 , H04B10/506 , H04B10/572 , H04J14/02
摘要： An optical device that includes multiple optical modulators having actual operating wavelengths at a given temperature is described. Because of differences between the actual operating wavelengths and target operating wavelengths of the optical modulators, heating elements may be used to thermally tune the optical modulators so that the actual operating wavelengths match corresponding carrier wavelengths in a set of optical signals. Furthermore, control logic in the optical device may assign the optical modulators to the corresponding carrier wavelengths based at least on differences between the carrier wavelengths and the actual operating wavelengths, thereby reducing an average thermal tuning energy associated with the heating elements.
摘要翻译：描述了包括在给定温度下具有实际工作波长的多个光调制器的光学装置。由于光调制器的实际工作波长和目标工作波长之间的差异，可以使用加热元件来热调谐光学调制器，使得实际工作波长匹配一组光信号中的相应载波波长。此外，光学装置中的控制逻辑可以至少基于载波波长和实际工作波长之间的差异将光调制器分配给相应的载波波长，由此降低与加热元件相关联的平均热调谐能量。

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