专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明授权

US10883027B2 Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite 有权
公开(公告)号：US10883027B2
公开(公告)日：2021-01-05
申请号：US16611250
申请日：2018-03-02
申请人： MEC COMPANY LTD.
发明人： Itsuro Tomatsu , Kosuke Kumazaki , Yasutaka Amitani , Yuko Shibanuma , Ikuyo Katayama
IPC分类号： C09J179/02 , B32B15/08 , B32B15/20 , B32B37/12 , C09J5/02 , C09J11/04 , C23C22/06 , C23C22/63 , C23C22/68 , H05K3/38
摘要： The coating film-forming composition includes an aromatic compound having an amino group and an aromatic ring in one molecule, and thio compound (sulfur oxoacids having a pKa of −1.9 or less and salts thereof are excluded). pH of the coating film-forming composition is 4 to 10. The thio compound is preferably one that ionized to form anions in a solution, and thiosulfate and thiocyanate are especially preferable. By bringing the coating film-forming composition into contact with the surface of a metal member, a coating film is formed on the surface of the metal member, so that a surface-treated metal member can be obtained.

42. 发明申请

US20160340788A1 MICROETCHING SOLUTION FOR COPPER, REPLENISHMENT SOLUTION THEREFOR AND METHOD FOR PRODUCTION OF WIRING BOARD 审中-公开
公开(公告)号：US20160340788A1
公开(公告)日：2016-11-24
申请号：US15224825
申请日：2016-08-01
申请人： MEC COMPANY LTD.
发明人： Masayo KURII , Kiyoto TAI , Mami NAKAMURA
IPC分类号： C23F1/18 , H05K3/00
CPC分类号： C23F1/18 , C23F1/34 , H05K3/0085 , H05K3/022 , H05K3/383 , H05K2203/0307 , H05K2203/0789
摘要： Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

43. 发明授权

US09493878B2 Surface roughening agent for aluminum, and surface roughening method using said surface roughening agent 有权
标题翻译：用于铝的表面粗糙剂，以及使用所述表面粗糙剂的表面粗糙化方法
公开(公告)号：US09493878B2
公开(公告)日：2016-11-15
申请号：US13580111
申请日：2010-11-08
申请人： Ryo Ogushi , Minoru Otani
发明人： Ryo Ogushi , Minoru Otani
IPC分类号： H01L21/302 , H01L21/461 , C09K13/00 , C09K13/02 , C23F1/36 , C23F1/32 , C23F1/14 , C23F1/00
CPC分类号： C23F1/36 , C09K13/00 , C09K13/02 , C23F1/00 , C23F1/14 , C23F1/32
摘要： Provided are a surface roughening agent for aluminum and a surface roughening method using said surface roughening agent wherein it is possible to easily reduce costs for the surface roughening step and to improve the adhesiveness between aluminum and a resin. Specifically, provided is a surface roughening agent for aluminum comprising an aqueous solution containing: an alkali source, an amphoteric metal ion, a nitrate ion, and a thio compound. Moreover, provided is a surface roughening method for aluminum which involves a surface roughening step in which the surface of aluminum is treated with the aforementioned surface roughening agent.
摘要翻译：提供了一种铝的表面粗糙剂和使用所述表面粗糙剂的表面粗糙化方法，其中可以容易地降低表面粗糙化步骤的成本并改善铝和树脂之间的粘附性。具体地，提供一种铝的表面粗糙剂，其包含含有碱源，两性金属离子，硝酸根离子和硫代化合物的水溶液。此外，提供了一种铝的表面粗糙化方法，其包括用上述表面粗糙剂处理铝的表面的表面粗糙化步骤。

44. 发明授权

US08828554B2 Electroconductive layer, laminate using the same, and producing processes thereof 有权
标题翻译：导电层，使用其的叠层及其制造方法
公开(公告)号：US08828554B2
公开(公告)日：2014-09-09
申请号：US12352048
申请日：2009-01-12
申请人： Mutsuyuki Kawaguchi , Satoshi Saito , Tsuyoshi Amatani , Yuko Fujii
发明人： Mutsuyuki Kawaguchi , Satoshi Saito , Tsuyoshi Amatani , Yuko Fujii
IPC分类号： B32B15/20 , H05K3/38
CPC分类号： H05K3/388 , H05K3/384 , H05K2201/0355 , H05K2203/0353 , H05K2203/0361 , Y10T428/12431 , Y10T428/12493 , Y10T428/12569 , Y10T428/12708
摘要： The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 μm.
摘要翻译：本发明的目的是提供一种导电层，其保持与树脂层的粘合性，并且还可以在随后的步骤中容易地除去铜 - 锡合金层的层，使用该层的层压体和制造方法其中。本发明的导电层是与树脂层接合并且在铜层上层叠有铜层和铜 - 锡合金层的导电层，其中，铜 - 锡合金层的厚度为0.001〜0.020μm。

45. 发明授权

US07156904B2 Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby 有权
标题翻译：接合层形成溶液，使用该溶液的铜 - 树脂粘合层的制造方法以及由此得到的层叠体
公开(公告)号：US07156904B2
公开(公告)日：2007-01-02
申请号：US10826091
申请日：2004-04-16
申请人： Mutsuyuki Kawaguchi , Satoshi Saito , Jun Hisada , Naomi Kanda , Toshiko Nakagawa
发明人： Mutsuyuki Kawaguchi , Satoshi Saito , Jun Hisada , Naomi Kanda , Toshiko Nakagawa
IPC分类号： C23C18/31 , C23C18/34 , C23C18/48 , C23C30/00
CPC分类号： C23C18/48 , C23C18/31 , H01L2924/0002 , H05K3/384 , H05K2203/072 , Y10T428/31681 , H01L2924/00
摘要： An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum; (d) a reaction accelerator; and (e) a diffusive retaining solvent, so that an alloy layer of tin and the at least one type of metal selected in (c) is formed on the surface of the copper. Subsequently, a portion of the alloy layer is removed, so that a bonding layer containing an alloy of diffused copper, tin, and the at least one type of metal selected in (c) is formed on a surface of copper which enhances the adhesion between copper and resin. The present invention provides the solution, a method of producing the bonding layer, and a product obtained thereby.
摘要翻译：一种铜 - 树脂粘合层水溶液，包括：（a）至少一种酸型; （b）锡盐或氧化锡; （c）选自银，锌，铝，钛，铋，铬，铁，钴，镍，钯，金和铂中的至少一种金属的盐或氧化物; （d）反应促进剂; 和（e）扩散保持溶剂，使得在铜的表面上形成锡的合金层和（c）中选择的至少一种类型的金属。随后，去除合金层的一部分，使得在铜的表面上形成包含扩散的铜，锡和（c）中选择的至少一种类型的金属的合金的粘合层，这增强了铜和树脂。本发明提供了溶液，粘合层的制造方法和由此获得的产物。

46. 发明申请

US20050279253A1 Resin surface treating agent and resin surface treatment 失效
标题翻译：树脂表面处理剂和树脂表面处理
公开(公告)号：US20050279253A1
公开(公告)日：2005-12-22
申请号：US11153968
申请日：2005-06-16
申请人： Sachiko Nakamura , Yoshinari Miyata , Terukazu Ishida , Miho Misumi
发明人： Sachiko Nakamura , Yoshinari Miyata , Terukazu Ishida , Miho Misumi
IPC分类号： C08J7/06 , C08J7/12 , C09K13/04 , H05K3/38 , C07G1/00 , B05D1/40 , B05D3/00
CPC分类号： C08J7/06 , C08J7/12 , H05K3/381
摘要： The present invention relates to a resin surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds. The surface treating method of the present invention is a method of bringing a surface of a resin into contact with a surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds, and thereafter treating the surface with an acidic aqueous solution. This activates the resin surface and thereby increases a strength of adhesion of, for instance, a polyimide-based resin film with metal wires, as well as a strength of adhesion of a polyimide-based resin film with another resin. Thus, a resin surface treating agent that provides excellent productivity and reduces processing costs, as well as a surface treating method using the same, are provided.
摘要翻译：本发明涉及含有至少一种选自四价和三价铈化合物的铈化合物作为有效成分的树脂表面处理剂。本发明的表面处理方法是使树脂的表面与含有选自四价和三价铈化合物的至少一种铈化合物作为有效成分的表面处理剂接触，然后用酸性水溶液。这激活树脂表面，从而增加例如具有金属线的聚酰亚胺系树脂膜的粘附强度，以及聚酰亚胺系树脂膜与其他树脂的粘合强度。因此，提供了提供优异的生产率和降低加工成本的树脂表面处理剂以及使用其的表面处理方法。

47. 发明申请

US20050003086A1 Copper compound and method for producing copper thin film using the same 审中-公开
标题翻译：铜化合物及其制造方法
公开(公告)号：US20050003086A1
公开(公告)日：2005-01-06
申请号：US10881276
申请日：2004-06-30
申请人： Minoru Otani , Jun Hisada , Toyoki Mawatari
发明人： Minoru Otani , Jun Hisada , Toyoki Mawatari
IPC分类号： C07F1/08 , C07F1/00 , C23C18/08 , H05K3/40 , C23C16/00
CPC分类号： C23C18/08
摘要： The present invention provides a copper compound having a decomposition temperature in a range of 100° C. to 300° C. and including one unit or a plurality of connected units represented by the following Formula (1): [R1COO]n[NH3]mCuX1p (1) where n is 1 to 3; m is 1 to 3; p is 0 to 1; n pieces of R1 respectively represent the following Formula (2), CH2X2, CH2X2(CHX2)q, NH2, or H, and may be the same or different from each other, or n is 2 and two pieces of [R1COO] represent together the following Formula (3); R2, R3, and R4 are respectively CH2X2, CH2X2(CHX2)q, NH2, or H; R5 is —(CHX2)r—; X2 is H, OH, or NH2; r is 0 to 4; q is 1 to 4; and X1 is NH4+, H2O, or solvent molecules According to the above configuration, there are provided a copper compound capable of forming a copper thin film required for producing an electronic device or the like safely, inexpensively, and easily, and a method for producing a copper thin film using the copper compound.
摘要翻译：本发明提供一种分解温度在100℃至300℃的铜化合物，并且包括由下式（1）表示的一个单元或多个连接单元：[R 1 COO] n [NH 3] mCuX 1 p（1）其中n为1至3; m为1〜3; p为0〜1; n个R 1分别表示下式（2），CH 2 X 2，CH 2 X 2（CHX 2）q，NH 2或H，并且可以彼此相同或不同，或 n为2，两个[R 1 COO]一起表示下式（3）。 R 2，R 3和R 4分别为CH 2 X 2，CH 2 X 2（CHX 2）q，NH 2或H; R 5为 - （CHX 2）r - ; X 2是H，OH或NH 2; r为0〜4; q为1〜4; X 1是NH 4 +，H 2 O或溶剂分子根据上述结构，提供了能够安全，廉价且容易地形成电子器件等制造所需的铜薄膜的铜化合物，使用铜化合物的铜薄膜的制造方法。

48. 发明申请

US20040219375A1 Bonding layer for bonding resin on copper surface 有权
标题翻译：用于在铜表面粘合树脂的接合层
公开(公告)号：US20040219375A1
公开(公告)日：2004-11-04
申请号：US10826508
申请日：2004-04-16
申请人： MEC COMPANY LTD.
发明人： Mutsuyuki Kawaguchi , Satoshi Saito , Jun Hisada , Toshiko Nakagawa
IPC分类号： B32B015/08 , B32B015/04
CPC分类号： H05K3/384 , C23C18/48 , H01L2924/0002 , H05K2201/0355 , H05K2203/073 , Y10T428/12715 , Y10T428/12903 , Y10T428/1291 , Y10T428/265 , Y10T428/31678 , Y10T428/31681 , H01L2924/00
摘要： A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum. The copper is contained in an amount of 1 to 50 atom %, the tin is contained in an amount of 20 to 98 atom %, and the third metal is contained in an amount of 1 to 50 atom %. The bonding layer has a thickness of not less than 0.001 nullm and not more than 1 nullm. Thus, adhesion between copper and resin can be enhanced.
摘要翻译：提供了一种用于粘结树脂的接合层，其形成在铜表面上，并且包含以下合金：（a）铜; （b）锡; 和（c）选自银，锌，铝，钛，铋，铬，铁，钴，镍，钯，金和铂中的至少一种金属（第三金属）。铜的含量为1〜50原子％，锡的含量为20〜98原子％，第3金属含量为1〜50原子％。接合层的厚度为0.001μm以上1μm以下。因此，可以提高铜和树脂之间的粘合性。

49. 发明申请

US20220073793A1 ADHESIVE COMPOSITION, METHOD FOR PRODUCING SURFACE-TREATED METAL MEMBER, AND METHOD FOR PRODUCING METAL-RESIN COMPOSITE BODY 有权
公开(公告)号：US20220073793A1
公开(公告)日：2022-03-10
申请号：US17310676
申请日：2020-01-09
申请人： MEC COMPANY LTD.
发明人： Tomoki Hayashi , Itsuro Tomatsu , Daisaku Akiyama
IPC分类号： C09J11/06 , C09J11/04
摘要： An adhesive composition for forming an adhesive layer to be in contact with a resin on a surface of a metal, including: a low molecular weight organic compound having two or more nitrogen atoms in one molecule; and at least one metal ion selected from the group consisting of a trivalent aluminum ion and a trivalent chromium ion, wherein the resin is a curable resin, and the adhesive composition is an aqueous solution having a pH of 12 or less and has a concentration of the low molecular weight organic compound of 0.01 to 150 g/L and a molar concentration of the at least one metal ion of 0.005 to 100 mmol/L. The adhesive composition can improve adhesion between surfaces of multiple metals and a resin.

50. 发明授权

US10801112B2 Composition for forming coating, production method for surface-treated metal member, and production method for metal-resin composite 有权
公开(公告)号：US10801112B2
公开(公告)日：2020-10-13
申请号：US16471126
申请日：2017-12-15
申请人： MEC COMPANY LTD.
发明人： Daisaku Akiyama , Itsuro Tomatsu , Yasutaka Amitani , Keisuke Joko , Tokuya Satomi
IPC分类号： C23C22/05 , B32B15/08 , B32B15/20 , B32B37/12 , C08J5/12 , C23C22/18
摘要： The coating film-forming composition is a solution of pH 4 to 10 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and an oxidizing agent. As the oxidizing agent, hypochlorous acid, chlorous acid, chloric acid, perchloric acid, persulfuric acid, percarbonic acid, hydrogen peroxide, organic peroxides, or the like is used. The aromatic compound preferably contains a nitrogen-containing aromatic ring, and more preferably contains a primary amino group or a secondary amino group. The coating film-forming composition is used for, for example, forming a coating film on surface of a metal member.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式