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1. 发明授权

US07156904B2 Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby 有权
标题翻译：接合层形成溶液，使用该溶液的铜 - 树脂粘合层的制造方法以及由此得到的层叠体
公开(公告)号：US07156904B2
公开(公告)日：2007-01-02
申请号：US10826091
申请日：2004-04-16
申请人： Mutsuyuki Kawaguchi , Satoshi Saito , Jun Hisada , Naomi Kanda , Toshiko Nakagawa
发明人： Mutsuyuki Kawaguchi , Satoshi Saito , Jun Hisada , Naomi Kanda , Toshiko Nakagawa
IPC分类号： C23C18/31 , C23C18/34 , C23C18/48 , C23C30/00
CPC分类号： C23C18/48 , C23C18/31 , H01L2924/0002 , H05K3/384 , H05K2203/072 , Y10T428/31681 , H01L2924/00
摘要： An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum; (d) a reaction accelerator; and (e) a diffusive retaining solvent, so that an alloy layer of tin and the at least one type of metal selected in (c) is formed on the surface of the copper. Subsequently, a portion of the alloy layer is removed, so that a bonding layer containing an alloy of diffused copper, tin, and the at least one type of metal selected in (c) is formed on a surface of copper which enhances the adhesion between copper and resin. The present invention provides the solution, a method of producing the bonding layer, and a product obtained thereby.
摘要翻译：一种铜 - 树脂粘合层水溶液，包括：（a）至少一种酸型; （b）锡盐或氧化锡; （c）选自银，锌，铝，钛，铋，铬，铁，钴，镍，钯，金和铂中的至少一种金属的盐或氧化物; （d）反应促进剂; 和（e）扩散保持溶剂，使得在铜的表面上形成锡的合金层和（c）中选择的至少一种类型的金属。随后，去除合金层的一部分，使得在铜的表面上形成包含扩散的铜，锡和（c）中选择的至少一种类型的金属的合金的粘合层，这增强了铜和树脂。本发明提供了溶液，粘合层的制造方法和由此获得的产物。

2. 发明授权

US07029761B2 Bonding layer for bonding resin on copper surface 有权
标题翻译：用于在铜表面粘合树脂的接合层
公开(公告)号：US07029761B2
公开(公告)日：2006-04-18
申请号：US10826508
申请日：2004-04-16
申请人： Mutsuyuki Kawaguchi , Satoshi Saito , Jun Hisada , Toshiko Nakagawa
发明人： Mutsuyuki Kawaguchi , Satoshi Saito , Jun Hisada , Toshiko Nakagawa
IPC分类号： B32B15/04 , B32B15/08 , B32B15/20
CPC分类号： H05K3/384 , C23C18/48 , H01L2924/0002 , H05K2201/0355 , H05K2203/073 , Y10T428/12715 , Y10T428/12903 , Y10T428/1291 , Y10T428/265 , Y10T428/31678 , Y10T428/31681 , H01L2924/00
摘要： A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum. The copper is contained in an amount of 1 to 50 atom %, the tin is contained in an amount of 20 to 98 atom %, and the third metal is contained in an amount of 1 to 50 atom %. The bonding layer has a thickness of not less than 0.001 μm and not more than 1 μm. Thus, adhesion between copper and resin can be enhanced.
摘要翻译：提供了一种用于粘结树脂的接合层，其形成在铜表面上，并且包含以下合金：（a）铜; （b）锡; 和（c）选自银，锌，铝，钛，铋，铬，铁，钴，镍，钯，金和铂中的至少一种金属（第三金属）。铜的含量为1〜50原子％，锡的含量为20〜98原子％，第3金属含量为1〜50原子％。接合层的厚度为0.001μm以上1μm以下。因此，可以提高铜和树脂之间的粘合性。

3. 发明授权

US06733886B2 Laminate and method of manufacturing the same 有权
标题翻译：层压板及其制造方法
公开(公告)号：US06733886B2
公开(公告)日：2004-05-11
申请号：US10131771
申请日：2002-04-23
申请人： Mutsuyuki Kawaguchi , Jun Hisada , Toshiko Nakagawa
发明人： Mutsuyuki Kawaguchi , Jun Hisada , Toshiko Nakagawa
IPC分类号： B32B1508
CPC分类号： B32B15/08 , B32B15/20 , B32B37/0038 , B32B38/0012 , B32B2311/12 , B32B2398/00 , B32B2457/08 , C23C22/52 , H05K3/389 , Y10S428/91 , Y10T428/12556 , Y10T428/12569 , Y10T428/273 , Y10T428/31511 , Y10T428/31515 , Y10T428/31529 , Y10T428/3154 , Y10T428/31681
摘要： A laminate is made by adhering at least one metal layer selected from the group consisting of copper and a copper alloy to a resin layer. A coating film of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in an range from 0.1 mass % to 15 mass % and an organic acid in a range from 1 mass % to 80 mass % is formed on the metal layer surface, and the metal layer adheres to the resin layer via the coating film of the azole-copper complex compound. Thereby, the present invention provides a laminate with improved adhesion between a surface of copper or a copper alloy and resin in a multilayered printed circuit board, and also a method of manufacturing the laminate.
摘要翻译：通过将选自铜和铜合金的至少一种金属层粘附到树脂层上来制造层压体。形成了通过与含有0.1质量％-15质量％的唑类化合物的水溶液和1质量％至80质量％范围内的有机酸接触形成的唑 - 铜络合物的涂膜在金属层表面上，并且金属层通过唑 - 铜络合物的涂膜粘附到树脂层。因此，本发明提供了一种具有改进的铜或铜合金表面与多层印刷电路板中的树脂之间的粘附性的层压体，以及制造层压体的方法。

4. 发明申请

US20050003086A1 Copper compound and method for producing copper thin film using the same 审中-公开
标题翻译：铜化合物及其制造方法
公开(公告)号：US20050003086A1
公开(公告)日：2005-01-06
申请号：US10881276
申请日：2004-06-30
申请人： Minoru Otani , Jun Hisada , Toyoki Mawatari
发明人： Minoru Otani , Jun Hisada , Toyoki Mawatari
IPC分类号： C07F1/08 , C07F1/00 , C23C18/08 , H05K3/40 , C23C16/00
CPC分类号： C23C18/08
摘要： The present invention provides a copper compound having a decomposition temperature in a range of 100° C. to 300° C. and including one unit or a plurality of connected units represented by the following Formula (1): [R1COO]n[NH3]mCuX1p (1) where n is 1 to 3; m is 1 to 3; p is 0 to 1; n pieces of R1 respectively represent the following Formula (2), CH2X2, CH2X2(CHX2)q, NH2, or H, and may be the same or different from each other, or n is 2 and two pieces of [R1COO] represent together the following Formula (3); R2, R3, and R4 are respectively CH2X2, CH2X2(CHX2)q, NH2, or H; R5 is —(CHX2)r—; X2 is H, OH, or NH2; r is 0 to 4; q is 1 to 4; and X1 is NH4+, H2O, or solvent molecules According to the above configuration, there are provided a copper compound capable of forming a copper thin film required for producing an electronic device or the like safely, inexpensively, and easily, and a method for producing a copper thin film using the copper compound.
摘要翻译：本发明提供一种分解温度在100℃至300℃的铜化合物，并且包括由下式（1）表示的一个单元或多个连接单元：[R 1 COO] n [NH 3] mCuX 1 p（1）其中n为1至3; m为1〜3; p为0〜1; n个R 1分别表示下式（2），CH 2 X 2，CH 2 X 2（CHX 2）q，NH 2或H，并且可以彼此相同或不同，或 n为2，两个[R 1 COO]一起表示下式（3）。 R 2，R 3和R 4分别为CH 2 X 2，CH 2 X 2（CHX 2）q，NH 2或H; R 5为 - （CHX 2）r - ; X 2是H，OH或NH 2; r为0〜4; q为1〜4; X 1是NH 4 +，H 2 O或溶剂分子根据上述结构，提供了能够安全，廉价且容易地形成电子器件等制造所需的铜薄膜的铜化合物，使用铜化合物的铜薄膜的制造方法。

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