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    • 32. 发明申请
    • Method of fabricating a ceramic stack structure
    • 制造陶瓷堆叠结构的方法
    • US20030168784A1
    • 2003-09-11
    • US10376299
    • 2003-03-03
    • Akio IwaseTakeshi Matsui
    • C04B033/32
    • B32B18/00B32B38/145B32B2038/042B32B2311/08C04B35/491C04B2235/6567C04B2237/346C04B2237/348C04B2237/50C04B2237/68C04B2237/704H01G4/308H01L41/083H01L41/273
    • A method of fabricating a ceramic stack structure having dielectric layers which are not easily cracked or delaminated is disclosed. In fabricating a ceramic stack structure having a plurality of dielectric layers and a plurality of internal electrode layers stacked alternately with each other, a carrier film (20) is prepared and a plurality of internal electrode print portions (21) are formed. A large print portion (225) is formed in such a manner as to cover the internal electrode print portions (21). The large print portion (225) is dried and a coat layer (23) is formed in such a manner as to smooth out the unevenness of the surface of the large print portion (225). The large print portion (225) is removed from the carrier film (20) and punched to produce an unsintered unit. The unsintered unit is punched while at the same time stacking and attaching the particular unsintered unit on another unsintered unit under pressure. This process is repeated to produce an unsintered stack body including a plurality of the unsintered units. The unsintered stack body is sintered into a ceramic stack structure.
    • 公开了一种制造具有不容易破裂或分层的电介质层的陶瓷堆叠结构的方法。 在制造具有彼此交替堆叠的多个电介质层和多个内部电极层的陶瓷堆叠结构体的情况下,制备载体膜(20)并形成多个内部电极印刷部分(21)。 以覆盖内部电极印刷部分(21)的方式形成大的印刷部分(225)。 大的印刷部分(225)被干燥,并且形成涂层(23)以平滑大印刷部分(225)的表面的不均匀性。 将大的印刷部分(225)从载体薄膜(20)上取下并冲压成不烧结单元。 未烧结单元被冲压,同时在特定未烧结单元的压力下堆叠并附着在另一个未烧结单元上。 重复该过程以产生包括多个未烧结单元的未烧结堆叠体。 将未烧结的堆叠体烧结成陶瓷堆叠结构。