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31. 发明授权

US06528123B1 Coating system to permit direct brazing of ceramics 有权
标题翻译：涂层系统允许直接钎焊陶瓷
公开(公告)号：US06528123B1
公开(公告)日：2003-03-04
申请号：US09607314
申请日：2000-06-28
申请人： Charles H. Cadden , F. Michael Hosking
发明人： Charles H. Cadden , F. Michael Hosking
IPC分类号： B05D302
CPC分类号： C04B37/006 , B23K35/001 , C04B37/026 , C04B41/009 , C04B41/52 , C04B41/89 , C04B2235/6562 , C04B2235/6565 , C04B2235/6567 , C04B2237/062 , C04B2237/122 , C04B2237/124 , C04B2237/125 , C04B2237/343 , C04B2237/60 , C04B2237/72 , C04B41/4529 , C04B41/5035 , C04B41/5037 , C04B41/522 , C04B41/5133 , C04B41/0072 , C04B41/5111 , C04B41/5116 , C04B35/10 , C04B35/00
摘要： This invention relates to a method for preparing the surface of a ceramic component that enables direct brazing using a non-active braze alloy. The present invention also relates to a method for directly brazing a ceramic component to a ceramic or metal member using this method of surface preparation, and to articles produced by using this brazing method. The ceramic can be high purity alumina. The method comprises applying a first coating of a silicon-bearing oxide material (e.g. silicon dioxide or mullite (3Al2O3.2SiO2) to the ceramic. Next, a thin coating of active metal (e.g. Ti or V) is applied. Finally, a thicker coating of a non-active metal (e.g. Au or Cu) is applied. The coatings can be applied by physical vapor deposition (PVD). Alternatively, the active and non-active metals can be co-deposited (e.g. by sputtering a target made of mullite). After all of the coatings have been applied, the ceramic can be fired at a high temperature in a non-oxidizing environment to promote diffusion, and to enhance bonding of the coatings to the substrate. After firing, the metallized ceramic component can be brazed to other components using a conventional non-active braze alloy. Alternatively, the firing and brazing steps can be combined into a single step. This process can replace the need to perform a “moly-manganese” metallization step.
摘要翻译：本发明涉及一种制备能够使用非活性钎焊合金直接钎焊的陶瓷部件表面的方法。本发明还涉及使用这种表面处理方法将陶瓷成分直接钎焊到陶瓷或金属构件的方法，以及使用该钎焊法制造的制品。陶瓷可以是高纯度氧化铝。该方法包括将具有硅的氧化物材料（例如二氧化硅或莫来石（3Al2O3·2SO2））的第一涂层施加到陶瓷上，接下来，施加活性金属（例如Ti或V）的薄涂层，最后，涂覆非活性金属（例如Au或Cu），涂层可以通过物理气相沉积（PVD）进行涂覆，或者，活性和非活性金属可以共沉积（例如通过溅射靶材的莫来石），在所有的涂层被涂覆之后，陶瓷可以在非氧化环境中的高温下烧制以促进扩散，并且增强涂层与基材的粘合，烧制后，金属化陶瓷组分可以使用常规的非活性钎焊合金钎焊到其他部件，或者，烧结和钎焊步骤可以组合成单个步骤，该过程可以代替执行“钼 - 锰”金属化步骤的需要。

32. 发明授权

US06390354B1 Adhesive composition for bonding different kinds of members 有权
标题翻译：用于粘合不同种类的构件的粘合剂组合物
公开(公告)号：US06390354B1
公开(公告)日：2002-05-21
申请号：US09238731
申请日：1999-01-28
申请人： Takuma Makino , Masayuki Shinkai
发明人： Takuma Makino , Masayuki Shinkai
IPC分类号： B23K3102
CPC分类号： B23K35/001 , B23K35/0244
摘要： A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.
摘要翻译：复合材料通过以下方法制造：粘合剂组合物，其包含降低热应力的颗粒材料和含有贵金属元素作为基材的钎焊材料，其中粘合剂组合物可以粘合两种或更多种不同的构件以形成复合构件具有足够的粘结强度，以避免造成损坏，例如在构件的在热应力方面较弱的侧面发生的裂纹，以及通过制造由两种或更多种不同构件组成的复合构件的方法，使用粘合剂组合物或不同构件的粘合部分填充有降低热应力的颗粒材料，然后将熔融的钎焊材料浇注到其中，并冷却以使构件结合。

33. 发明授权

US06279811B1 Solder application technique 失效
标题翻译：焊接应用技术
公开(公告)号：US06279811B1
公开(公告)日：2001-08-28
申请号：US09570404
申请日：2000-05-12
申请人： Michael M. Ramarge , David P. Bailey , Thomas C. Hartman
发明人： Michael M. Ramarge , David P. Bailey , Thomas C. Hartman
IPC分类号： B23K120
CPC分类号： B23K1/20 , B23K35/001 , B23K2101/36 , H01C7/108 , H01C7/12
摘要： A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.
摘要翻译：将第一电气部件的端面与第二电气部件的端面接合的方法包括将第一金属层施加到第一电气部件的端面，以形成第一金属化层，并将第二金属层施加到第二电气部件的端面以形成第二金属化层。通过熔化可熔合金并将熔融的可熔合金推进到第一金属化层上，将第一熔融合金层施加到第一金属化层，并且通过熔化可熔合金将第二熔融合金层施加到第二金属化层上，并推进熔融的可熔合金到第二金属化层。该方法还包括使第一可熔合金层与第二熔融合金层接触。接下来，加热端面和可熔合金层以熔化可熔合金层。加热后，端面和熔融合金层被冷却以在端面之间形成结合。

34. 依法登记的发明

USH1934H Gold-tin solder suitable for self-aligning applications 失效
标题翻译：金锡焊锡适用于自对准应用
公开(公告)号：USH1934H
公开(公告)日：2001-01-02
申请号：US08539491
申请日：1995-10-06
申请人： Mindaugas Fernand Dautartas
发明人： Mindaugas Fernand Dautartas
IPC分类号： C22C502
CPC分类号： B23K35/3013 , B23K35/001 , B23K2035/008
摘要： A tin-rich gold-tin solder is disclosed which is particularly advantageous for self-aligning applications. When utilized with gold-plated bond locations, the out-diffusion of tin from the solder during heating functions to shift the composition of the remaining solder closer to the eutectic value, thus preserving the liquid state of the solder and improving its reflow quality with respect to conventional eutectic solders.
摘要翻译：公开了一种富含锡的金锡焊料，其特别有利于自对准应用。当与镀金接合位置一起使用时，在加热期间锡从焊料中的扩散扩散使得剩余焊料的组成更接近于共晶值，从而保持焊料的液体状态并改善其回流质量传统的共晶焊料。

35. 发明授权

US6099974A Coating that enables soldering to non-solderable surfaces 失效
标题翻译：能够焊接到不可焊接表面的涂层
公开(公告)号：US6099974A
公开(公告)日：2000-08-08
申请号：US895129
申请日：1997-07-16
申请人： William J. Lenling
发明人： William J. Lenling
IPC分类号： B23K35/00 , B32B15/01 , C23C4/08 , C23C30/00 , H05K3/24 , H05K3/34 , B22F7/00 , B32B15/04 , B32B15/20
CPC分类号： C23C4/08 , B23K35/001 , B32B15/01 , C23C30/00 , B23K35/002 , H05K3/244 , H05K3/3457 , Y10T428/12028 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , Y10T428/12903 , Y10T428/12944 , Y10T428/29
摘要： A composite coating provides a solderable surface on materials that cannot otherwise be soldered. The solderable coating is comprised of a composite layer of two components made of metals or metal alloys that function as a solderable material and as a material that enhances solder flow. A thin layer of at least one of the two components can also be incorporated along with the composite layer. A solderable coating can be deposited on a non-solderable surface by any of a variety of thermal spray techniques, including plasma spraying or wire arc spraying. These solderable coatings are particularly useful in the manufacturing of high power electronic components.
摘要翻译：复合涂层在不能以其他方式焊接的材料上提供可焊接表面。可焊接涂层由作为可焊接材料的金属或金属合金制成的两个部件的复合层和作为增强焊料流动的材料组成。两个组分中的至少一个的薄层也可以与复合层一起并入。可焊接涂层可以通过任何各种热喷涂技术沉积在不可焊接的表面上，包括等离子喷涂或电弧喷涂。这些可焊接涂层在制造高功率电子部件中特别有用。

36. 发明授权

US5975405A Diffusion bonding method and diffusion bonding apparatus 失效
标题翻译：扩散接合法和扩散接合装置
公开(公告)号：US5975405A
公开(公告)日：1999-11-02
申请号：US845029
申请日：1997-04-21
申请人： Masaki Tsuchiya , Takao Shimizu , Hiroaki Suzuki
发明人： Masaki Tsuchiya , Takao Shimizu , Hiroaki Suzuki
IPC分类号： B23K20/00 , B23K20/02 , B23K20/26 , B23K35/00 , C21D1/10 , C21D1/74 , B23K37/053
CPC分类号： C21D1/10 , B23K20/00 , B23K20/023 , B23K20/028 , B23K20/26 , B23K20/02 , B23K2201/10 , B23K35/001 , C21D1/74 , Y02P10/253
摘要： A diffusion bonding method has a step of adjusting ends of material to be bonded before bonding the material after setting the materials in the diffusion bonding apparatus, whereas a diffusion bonding apparatus has a mechanism for finishing ends of materials to be bonded so that both ends face parallel to each other.
摘要翻译：扩散接合方法具有在将扩散接合装置中的材料固化之后，在将材料接合之前调整待结合材料的端部的步骤，而扩散接合装置具有用于完成待接合材料的端部的机构，使得两端面彼此平行。

37. 发明授权

US5935640A Method for enhancing the solderability of a surface 失效
标题翻译：提高表面可焊性的方法
公开(公告)号：US5935640A
公开(公告)日：1999-08-10
申请号：US982980
申请日：1997-12-02
申请人： Donald Ferrier , Eric Yakobson
发明人： Donald Ferrier , Eric Yakobson
IPC分类号： B23K1/20 , B23K35/00 , C22C5/06 , C23C18/42 , C23C18/44 , H05K3/24 , H05K3/34 , B05D5/12
CPC分类号： H05K3/244 , B23K35/004 , B23K35/007 , C23C18/42 , B23K35/001 , H05K2203/073
摘要： A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.
摘要翻译：公开了一种通过使用浸渍银沉积来增强表面的可焊性的方法。在优选实施例中，顺序地使用两个浸没沉积物。还公开了一种用于浸镀银的组合物。

38. 发明授权

US5812925A Low temperature bonding of materials 失效
标题翻译：低温接合材料
公开(公告)号：US5812925A
公开(公告)日：1998-09-22
申请号：US735934
申请日：1996-10-23
申请人： Gunes M. Ecer
发明人： Gunes M. Ecer
IPC分类号： B22F7/06 , B23K35/00 , B23K35/02 , B22F7/04
CPC分类号： B23K35/004 , B22F7/064 , B23K35/001 , B23K35/007 , B23K35/02 , Y10T428/12028 , Y10T428/12069 , Y10T428/12097
摘要： A method for joining a first metal surface to a second metal surface that includes providing powder metal particles substantially all of which have hardnesses lower than the hardnesses of the first and second metal surfaces, at normal temperatures; locating the particles in a layer between the first and second metallic surfaces, to form an assembly; heating the assembly to an elevated temperature or temperatures below the softening temperature of the first and second metallic surfaces; and effecting compression of the layer by and between the first and second surfaces at a pressure level or levels below the compressive yield strengths of the first and second surfaces, and above the compressive yield strengths of the particles, and for a time duration to effect a bond between the first and second metallic surfaces.
摘要翻译：一种将第一金属表面接合到第二金属表面的方法，包括在常温下提供基本上具有低于第一和第二金属表面的硬度的硬度的粉末金属颗粒; 将颗粒定位在第一和第二金属表面之间的层中，以形成组件; 将组件加热到低于第一和第二金属表面的软化温度的升高的温度或温度; 并且在第一和第二表面的压缩屈服强度的压力水平或低于第一表面和第二表面的压缩屈服强度的压力水平或高于第一表面和第二表面之间的压缩屈服强度以上，并且在颗粒的压缩屈服强度之上，第一和第二金属表面之间的接合。

39. 发明授权

US5733599A Method for enhancing the solderability of a surface 失效
公开(公告)号：US5733599A
公开(公告)日：1998-03-31
申请号：US621098
申请日：1996-03-22
申请人： Donald Ferrier , Eric Yakobson
发明人： Donald Ferrier , Eric Yakobson
IPC分类号： B23K1/20 , B23K35/00 , C22C5/06 , C23C18/42 , C23C18/44 , H05K3/24 , H05K3/34 , B05D5/12
CPC分类号： H05K3/244 , B23K35/004 , B23K35/007 , C23C18/42 , B23K35/001 , H05K2203/073
摘要： A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.

40. 发明授权

US5655703A Solder hierarchy for chip attachment to substrates 失效
标题翻译：用于芯片附着到衬底的焊接层次
公开(公告)号：US5655703A
公开(公告)日：1997-08-12
申请号：US449747
申请日：1995-05-25
申请人： Miguel Angel Jimarez , Amit Kumar Sarkhel , Lawrence Harold White
发明人： Miguel Angel Jimarez , Amit Kumar Sarkhel , Lawrence Harold White
IPC分类号： B23K1/00 , B23K35/00 , B23K35/26 , H01L21/56 , H01L21/60 , H05K3/34 , B23K1/018 , B23K31/02
CPC分类号： H01L24/81 , B23K1/0016 , B23K35/26 , B23K35/262 , B23K35/268 , H01L21/563 , H05K3/3463 , B23K2201/40 , B23K35/001 , H01L2224/13111 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H05K2201/094 , H05K3/3431 , Y10T29/49144
摘要： The method for soldering a chip to a substrate to form a module and then soldering the module to a circuit board includes selecting a three level hierarchy of solders by the temperature required to melt. By this method, a module can be soldered to and de-soldered from a circuit board without affecting adversely the solder between the chip and the substrate. The package formed by this method is free of faults that are caused frequently during both manufacture and service.
摘要翻译：将芯片焊接到基板以形成模块，然后将模块焊接到电路板的方法包括通过熔化所需的温度来选择焊料的三级层级。通过该方法，可以将模块焊接到电路板上并从其中去除焊接，而不会不利地影响芯片和衬底之间的焊料。通过该方法形成的包装在制造和服务期间都不会产生频繁的故障。

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