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31. 发明授权

US09161459B2 Pre-heater latch and seal mechanism for wave solder machine and related method 有权
标题翻译：用于波峰焊机的预热器闩锁和密封机构及相关方法
公开(公告)号：US09161459B2
公开(公告)日：2015-10-13
申请号：US14189743
申请日：2014-02-25
申请人： Illinois Tool Works Inc.
发明人： Jonathan M. Dautenhahn
IPC分类号： B23K31/02 , B23K37/00 , H05K3/34 , B23K3/06 , B23K3/08 , B23K1/08 , B23K1/00 , B23K1/008 , F27B9/02 , H01T23/00
CPC分类号： B23K3/08 , B23K1/0016 , B23K1/008 , B23K1/085 , B23K3/047 , B23K3/0653 , B23K3/082 , F27B9/029 , F27B17/0025 , H01T23/00 , H05K3/34 , H05K3/341 , H05K3/3468 , H05K2203/044 , Y10T29/49826
摘要： A wave solder machine includes a pre-heating station, a wave soldering station, and a conveyor to transport substrates through a tunnel passing through the pre-heating station and the wave soldering station. The tunnel has a substantially oxygen-free environment. The pre-heating station includes a pre-heater including a support frame assembly, and a heater assembly supported by the support frame assembly. The heater assembly is slidably coupled to the support frame assembly between an operational position and a non-operational position. The pre-heater further includes a seal disposed between the heater assembly and the support frame assembly. The seal provides a gas-tight seal when the heater assembly is in the operational position to prevent atmosphere from entering the tunnel thereby preserving the substantially oxygen-free environment within the tunnel.
摘要翻译：波峰焊机包括预热站，波峰焊站和输送机，以通过穿过预热站和波峰焊站的隧道输送基板。隧道具有基本上无氧的环境。预热站包括预热器，其包括支撑框架组件和由支撑框架组件支撑的加热器组件。加热器组件在操作位置和非操作位置之间可滑动地联接到支撑框架组件。预热器还包括设置在加热器组件和支撑框架组件之间的密封件。当加热器组件处于操作位置时，密封件提供气密密封，以防止大气进入隧道，从而保持隧道内基本上无氧的环境。

32. 发明申请

US20150287693A1 BOND HEADS FOR THERMOCOMPRESSION BONDERS, THERMOCOMPRESSION BONDERS, AND METHODS OF OPERATING THE SAME 有权
公开(公告)号：US20150287693A1
公开(公告)日：2015-10-08
申请号：US14746065
申请日：2015-06-22
申请人： Kulicke and Soffa Industries, Inc.
发明人： Matthew B. Wasserman , Michael P. Schmidt-Lange
IPC分类号： H01L23/00 , B23K1/00
CPC分类号： H01L24/75 , B23K1/0016 , B23K1/008 , B23K3/02 , B23K3/08 , B23K3/085 , B23K37/003 , B23K2101/42 , H01L24/81 , H01L2224/75252 , H01L2224/75301 , H01L2224/755 , H01L2224/7565 , H01L2224/81203
摘要： A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.

33. 发明申请

US20150273627A1 METHOD OF SEAMLESS BONDING AND DEVICE THEREFOR 审中-公开
标题翻译：无缝连接方法及其设备
公开(公告)号：US20150273627A1
公开(公告)日：2015-10-01
申请号：US14670834
申请日：2015-03-27
申请人： PRATT & WHITNEY CANADA CORP.
发明人： Pierre Verrier
IPC分类号： B23K26/14 , B23K3/08 , B23K26/36 , B23K26/40 , B23K26/06 , B23K26/08
CPC分类号： B23K3/08 , B23K1/0018 , B23K9/167 , B23K9/173 , B23K26/0619 , B23K26/0622 , B23K26/083 , B23K26/142 , B23K26/361 , B23K2101/001 , B23K2101/32
摘要： A method of seamless bonding comprises in sequence: feeding a filler wire into a de-scaling unit; removing with the de-scaling unit a contamination layer disposed onto a core of the filler wire, removing the contamination layer comprising: applying a laser beam to the filler wire at a wavelength causing at least a portion of the contamination layer to break away from the core of the filler wire while leaving the core unaffected; and feeding the filler wire to a seamless bonding unit. A seamless bonding device is also presented.
摘要翻译：一种无缝键合的方法包括：将填充线馈送到减缩单元中; 用去除缩放单元去除设置在填充线的芯上的污染层，去除污染层，包括：以波长施加激光束，所述波长使得至少一部分污染层脱离填充芯的芯线，同时使芯不受影响; 并将填充线馈送到无缝接合单元。还提供了无缝粘合装置。

34. 发明授权

US09123860B2 Vacuum reflow voiding rework system 有权
标题翻译：真空回流排空返修系统
公开(公告)号：US09123860B2
公开(公告)日：2015-09-01
申请号：US13564568
申请日：2012-08-01
申请人： Dason Cheung , Murad Kurwa , Richard Loi
发明人： Dason Cheung , Murad Kurwa , Richard Loi
IPC分类号： B23K31/02 , H01L31/18 , B23K3/04 , B23K1/018 , B23K1/008 , B23K1/00 , B23K3/08
CPC分类号： B23K3/08 , B23K1/0016 , B23K1/002 , B23K1/008 , B23K1/012 , B23K1/018 , B23K3/04 , B23K3/087 , H01L31/18 , H01L31/188 , Y02E10/50
摘要： A solar cell module comprises a solar cell soldered to a mounting element, such as a ceramic substrate. The solder bond can comprise a void. A method of reducing a solder void comprises reflowing the solder using a vacuum source and a heat source in a sealed chamber. The chamber is formed, at least in part, by a cowling into which the solar cell module is mounted. A system for reducing voids in a solder bond comprises a heat source and a vacuum source coupled to the sealed chamber into which a solar cell module is placed. The system can optionally include a control system that automates the execution of methods of reducing solder voids. The system can further include a pressure source to aid in reducing the solder void and reflowing the solder after the void is reduced.
摘要翻译：太阳能电池模块包括焊接到诸如陶瓷衬底的安装元件的太阳能电池。焊接结合可以包括空隙。减少焊料空隙的方法包括使用密封室中的真空源和热源回流焊料。该室至少部分地由安装太阳能电池模块的整流罩形成。用于减少焊料接合中的空隙的系统包括耦合到密封室的热源和真空源，太阳能电池模块放置在该密封室中。该系统可以可选地包括控制系统，其自动执行减少焊料空隙的方法。该系统还可以包括压力源，以帮助减少焊料空隙并且在空隙减小之后回流焊料。

35. 发明授权

US09120171B2 Automatic tin-adding machine 有权
标题翻译：自动加锡机
公开(公告)号：US09120171B2
公开(公告)日：2015-09-01
申请号：US14321915
申请日：2014-07-02
申请人： Wistron Corp.
发明人： Sam Hu , Xiao-Hua Zeng , Chiu-Lin Lai , Bj Su
IPC分类号： B23K37/00 , B23K3/06 , B65G49/00
CPC分类号： B23K3/0646 , B23K3/08 , B65G49/00
摘要： An automatic tin-adding machine for adding a plurality of tin rods to a molten tin tank comprises a base, two transmission shafts, at least one first flexible transmission member, a plurality of tin rod carrying members, a tin stock detector, a drive and a circuit control system. The base has a tin rod adding opening corresponding to the molten tin tank. The two transmission shafts are pivoted on the base side by side. The at least one first flexible transmission member is sleeved on the two transmission shafts. The tin rod carrying members are fixed to the first flexible transmission member and configured to carry the tin rods. The tin stock detector is configured to detect the stock of tin liquid in the molten tin tank. The drive is connected to one of the transmission shafts. The circuit control system comprises a circuit control unit.
摘要翻译：一种用于将多个锡棒添加到熔锡罐的自动加锡机包括基座，两个传动轴，至少一个第一柔性传动部件，多个锡棒承载部件，锡料检测器，驱动器和电路控制系统。基座具有对应于熔融锡罐的锡棒加入开口。两个传动轴在基座上并排地枢转。所述至少一个第一柔性传动构件套在两个传动轴上。锡棒承载构件被固定到第一柔性传动构件并构造成承载锡棒。锡原料检测器被配置为检测熔融锡罐中锡液体的存量。驱动器连接到传动轴之一。电路控制系统包括电路控制单元。

36. 发明申请

US20150231722A1 SEMI-AUTOMATIC BRAZING DEVICE 审中-公开
标题翻译：半自动切割装置
公开(公告)号：US20150231722A1
公开(公告)日：2015-08-20
申请号：US14703248
申请日：2015-05-04
申请人： LINCOLN GLOBAL, INC.
发明人： DAVID J NANGLE , Andreu P. Meckler , Robert M. Henson
IPC分类号： B23K3/08 , B23K3/06
CPC分类号： B23K3/08 , B23K3/0384 , B23K3/063 , B23K9/095 , B23K9/124 , B23K9/323
摘要： A semi-automatic brazing apparatus having a brazing wire feeding apparatus containing a brazing wire feed mechanism, a controller, and a user input device. The brazing wire from a brazing wire source is continuously drawn from the source through the apparatus via the feeding mechanism and is directed towards a brazing gun for a semi-automatic brazing operation.
摘要翻译：一种半自动钎焊装置，具有包含钎焊丝进给机构的钎焊丝进给装置，控制器和用户输入装置。来自铜焊丝源的钎焊线经由进给机构从源极连续地抽出，并被引导到用于半自动钎焊操作的钎焊枪。

37. 发明申请

US20150202753A1 HAND TOOL, IN PARTICULAR A SOLDERING GUN, WITH LIGHTS 审中-公开
标题翻译：手工具，特别是焊枪，带灯
公开(公告)号：US20150202753A1
公开(公告)日：2015-07-23
申请号：US14420980
申请日：2013-08-14
申请人： APEX BRANDS, INC.
发明人： Gert Mittmann
IPC分类号： B25B23/18 , F21V33/00 , F21V19/00 , B23K3/03
CPC分类号： B25B23/18 , B23K3/02 , B23K3/0338 , B23K3/08 , B23Q17/2404 , F21V19/0025 , F21V33/0084 , F21W2111/10 , F21Y2115/10
摘要： The invention relates to a hand tool, in particular a soldering gun, having at least one handle and a tool element protruding therefrom with an actuating end section on the free end. The hand tool also has more than one light for illuminating an installation location of the hand tool.
摘要翻译：本发明涉及一种手动工具，特别是焊枪，其具有至少一个手柄和从其上突出的工具元件，该自由端具有致动端部。手动工具还具有多个用于照亮手动工具的安装位置的灯。

38. 发明申请

US20150190874A1 AUTOMATIC TIN-ADDING MACHINE 有权
标题翻译：自动加药机
公开(公告)号：US20150190874A1
公开(公告)日：2015-07-09
申请号：US14321915
申请日：2014-07-02
申请人： Wistron Corp.
发明人： Sam HU , Xiao-Hua ZENG , Chiu-Lin LAI , BJ SU
IPC分类号： B23K3/06 , B65G49/00
CPC分类号： B23K3/0646 , B23K3/08 , B65G49/00
摘要： An automatic tin-adding machine for adding a plurality of tin rods to a molten tin tank comprises a base, two transmission shafts, at least one first flexible transmission member, a plurality of tin rod carrying members, a tin stock detector, a drive and a circuit control system. The base has a tin rod adding opening corresponding to the molten tin tank. The two transmission shafts are pivoted on the base side by side. The at least one first flexible transmission member is sleeved on the two transmission shafts. The tin rod carrying members are fixed to the first flexible transmission member and configured to carry the tin rods. The tin stock detector is configured to detect the stock of tin liquid in the molten tin tank. The drive is connected to one of the transmission shafts. The circuit control system comprises a circuit control unit.
摘要翻译：一种用于将多个锡棒添加到熔锡罐的自动加锡机包括基座，两个传动轴，至少一个第一柔性传动部件，多个锡棒承载部件，锡料检测器，驱动器和电路控制系统。基座具有对应于熔融锡罐的锡棒加入开口。两个传动轴在基座上并排地枢转。所述至少一个第一柔性传动构件套在两个传动轴上。锡棒承载构件被固定到第一柔性传动构件并构造成承载锡棒。锡原料检测器被配置为检测熔融锡罐中锡液体的存量。驱动器连接到传动轴之一。电路控制系统包括电路控制单元。

39. 发明授权

US09076806B1 Device and method for reduction of overstress in soldering process 有权
标题翻译：在焊接过程中减少过应力的装置和方法
公开(公告)号：US09076806B1
公开(公告)日：2015-07-07
申请号：US13485394
申请日：2012-05-31
申请人： Vladimir Kraz
发明人： Vladimir Kraz
IPC分类号： H01H47/00 , H01L23/60 , H01L23/552
CPC分类号： H01L23/60 , B23K1/0016 , B23K3/033 , B23K3/08 , B23K2101/42 , H01L23/552 , H01L2924/0002 , H01L2924/00
摘要： A device and a method of reducing high-frequency currents between the tip of the soldering iron and the circuit board are described. In one embodiment, a special EMI filter and a method of it implementation in soldering process is described. This device and this method of implementation provide significant reduction of high-frequency current to the sensitive components. Another embodiment describes an implementation of EMI-reducing filter inside the soldering iron. Yet other embodiments include implementation of EMI-reducing filter as a part of the solder station, of the vise holding the circuit board, of the solder spool holder and as a stand-alone device.
摘要翻译：描述了一种降低烙铁尖端与电路板之间的高频电流的装置和方法。在一个实施例中，描述了一种特殊的EMI滤波器及其在焊接过程中实现的方法。该器件和这种实现方法可以显着降低敏感元件的高频电流。另一实施例描述了烙铁内的EMI减小滤波器的实现。其他实施例包括作为焊接站的一部分的EMI减小过滤器，夹持电路板的钳口保持器和作为独立设备的实现。

40. 发明申请

US20150156889A1 SOLDERING A SEMICONDUCTOR DEVICE AND A SUBSTRATE BASED ON OSCILLATING FREQUENCIES 审中-公开
标题翻译：焊接半导体器件和基于振荡频率的衬底
公开(公告)号：US20150156889A1
公开(公告)日：2015-06-04
申请号：US14567085
申请日：2014-12-11
申请人： International Business Machines Corporation
发明人： Julien Sylvestre
IPC分类号： H05K3/34 , B23K1/00 , B23K3/04 , B23K31/02 , B23K3/08 , H01L23/00 , B23K1/008
CPC分类号： H05K3/341 , B23K1/0016 , B23K1/008 , B23K1/06 , B23K3/04 , B23K3/08 , B23K31/02 , H01L24/13 , H01L24/16 , H01L24/74 , H01L24/75 , H01L24/81 , H01L2224/1416 , H01L2224/16225 , H01L2224/16227 , H01L2224/75252 , H01L2224/75272 , H01L2224/75701 , H01L2224/75702 , H01L2224/75801 , H01L2224/75841 , H01L2224/759 , H01L2224/81024 , H01L2224/81149 , H01L2224/81169 , H01L2224/81193 , H01L2924/12042 , H01L2924/00012 , H01L2924/00
摘要： A method includes applying solder to conductive pads of a semiconductor device, applying solder to conductive pads of a substrate, aligning the solder on the semiconductor device with the solder on the substrate such that portions of the solder on the semiconductor device contact corresponding portions of the solder on the substrate, heating the semiconductor device and the substrate to liquefy the solder, and exerting an oscillating force operative to oscillate the semiconductor device relative to the substrate at a frequency.
摘要翻译：一种方法包括将焊料施加到半导体器件的导电焊盘，将焊料施加到衬底的导电焊盘上，使半导体器件上的焊料与衬底上的焊料对准，使得半导体器件上的焊料的部分接触到在衬底上焊接，加热半导体器件和衬底以使焊料液化，并发挥振荡力，使振荡力以一定的频率相对于衬底振荡半导体器件。

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