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    • 39. 发明授权
    • Flip-chip assembly of protected micromechanical devices
    • 保护微机械装置的倒装芯片组装
    • US06507082B2
    • 2003-01-14
    • US09779001
    • 2001-02-08
    • Sunil Thomas
    • Sunil Thomas
    • H01L2984
    • A43B3/0026B81B2201/042B81C1/00317B81C1/00793B81C2203/035H01L2224/13H01L2224/45144H01L2924/15311H01L2924/00
    • A low-cost ceramic package, in land-grid array or ball-grid array configuration, for micromechanical components is fabricated by coating the whole integrated circuits wafer with a protective material, selectively etching the coating for solder ball attachment, singulating the chips, flip-chip assembling a chip onto the opening of a ceramic substrate, underfilling the gaps between the solder joints with a polymeric encapsulant, removing the protective material form the components, and attaching a lid to the substrate for sealing the package. It is an aspect of the present invention to be applicable to a variety of different semiconductor micromechanical devices, for instance actuators, motors, sensors, spatial light modulators, and deformable mirror devices. In all applications, the invention achieves technical advantages as well as significant cost reduction and yield increase.
    • 通过用保护材料涂覆整个集成电路晶片来制造用于微机电部件的陆地电网阵列或球栅阵列配置的低成本陶瓷封装,选择性地蚀刻用于焊球附着的涂层,切割芯片,翻转 将芯片组装到陶瓷基板的开口上,用聚合物密封剂填充焊料接头之间的间隙,从组件中除去保护材料,并将盖子附着到基板上以密封封装。 本发明的一个方面可应用于各种不同的半导体微机械装置,例如致动器,马达,传感器,空间光调制器和可变形反射镜装置。 在所有应用中,本发明实现了技术优点以及显着的成本降低和产量增加。