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    • 33. 发明授权
    • Method of preventing adhesion of organisms
    • 防止生物粘连的方法
    • US4904504A
    • 1990-02-27
    • US240657
    • 1988-09-06
    • Osamu IsozakiNaozumi Iwasawa
    • Osamu IsozakiNaozumi Iwasawa
    • C09D5/14C09D5/16C09D183/00C09D183/14
    • C09D183/14C09D5/1675Y10T428/31663
    • Disclosed is a method of preventing adhesion of organisms characterized by coating a substrate with a coating composition comprising as its vehicle component a reaction product of a silane compound and/or a low condensation product thereof and an organic compound having at least two hydroxyl groups per molecule, the silane compound being represented by the formula(R.sup.1).sub.n Si--(OR.sup.2).sub.4-nwherein R.sup.1 is alkyl having 1 to 20 carbon atoms, haloalkyl having 1 to 12 carbon atoms, cycloalkyl having 3 to 7 carbon atoms, aryl or aralkyl having an alkyl portion with 1 to 12 carbon atoms, R.sup.2 is a hydrogen atom, alkyl having 1 to 8 carbon atoms, cycloalkyl having 3 to 7 carbon atoms or haloalkyl having 1 to 8 carbon atoms and n is an integer of 0 to 3.
    • 公开了一种防止生物体粘附的方法,其特征在于用涂料组合物涂布基材,该涂料组合物包含作为其载体组分的硅烷化合物和/或其低缩合产物和每分子具有至少两个羟基的有机化合物的反应产物 硅烷化合物由式(R 1)n -Si-(OR 2)4-n表示,其中R 1是具有1至20个碳原子的烷基,具有1至12个碳原子的卤代烷基,具有3至7个碳原子的环烷基,芳基或芳烷基 具有1至12个碳原子的烷基部分,R 2是氢原子,具有1至8个碳原子的烷基,具有3至7个碳原子的环烷基或具有1至8个碳原子的卤代烷基,n是0至3的整数。
    • 36. 发明授权
    • Process for production of printed circuit board
    • 印刷电路板生产工艺
    • US5576148A
    • 1996-11-19
    • US382155
    • 1995-02-01
    • Genji ImaiYukari TakedaHideo KogureNaozumi Iwasawa
    • Genji ImaiYukari TakedaHideo KogureNaozumi Iwasawa
    • H05K3/42H05K3/00H05K3/06H05K3/46G03F7/00
    • H05K3/0094H05K2201/09581H05K2203/0582H05K2203/107H05K2203/135H05K3/0082H05K3/064
    • The present invention provides a process for producing a high-density printed wiring board with plated throughholes, at high productivity and reliability by a direct drawing method. The process comprises making throughholes in a substrate having an electro-conductive layer on each side; conducting plating on at least the walls of the substrate throughholes; forming a photosensitive resist film on each side of the substrate; applying an actinic radiation onto the resist film by a direct drawing method in the shape of a pattern to be obtained when the resist film is a negative type, or in the shape of a pattern reverse to a pattern to be obtained when the resist film is a positive type; forming, on the uncoated portion inside the throughholes by electrodeposition, an electrodeposition film which is insoluble in a developing solution used later and an etching solution used later but is removable with a peeling solution used later; conducting development with an appropriate developing solution to remove the resist film; removing the exposed plating layer portion and the electro-conductive layer portion present therebeneath, by etching; and then peeling the remaining resist film and the electrodeposition film inside the throughholes, with an appropriate peeling solution.
    • 本发明提供一种通过直接拉伸法以高生产率和可靠性制造具有电镀通孔的高密度印刷线路板的方法。 该方法包括在每个侧面上具有导电层的基板中形成通孔; 至少在基板通孔的壁上进行电镀; 在基板的每一侧上形成光敏抗蚀剂膜; 通过直接拉伸法将光化辐射施加到抗蚀剂膜为负型时获得的图案的形状,或者与抗蚀剂膜为 积极的类型 通过电沉积在通孔内的未涂覆部分上形成不溶于稍后使用的显影液的电沉积膜和稍后使用的可用随后使用的剥离溶液除去的蚀刻溶液; 用合适的显影液进行显影以除去抗蚀剂膜; 通过蚀刻去除暴露的镀层部分和存在于其中的导电层部分; 然后用适当的剥离溶液将剩余的抗蚀剂膜和电沉积膜剥离到通孔内。
    • 39. 发明授权
    • Electromagnetic wave reflection-preventing material and electromagnetic
wave reflection-preventing method
    • 电磁波防反射材料和电磁波反射防止方法
    • US5455117A
    • 1995-10-03
    • US140564
    • 1993-10-25
    • Toshiaki NaganoHideo KogureNaozumi IwasawaTetsu Maki
    • Toshiaki NaganoHideo KogureNaozumi IwasawaTetsu Maki
    • G21F1/12H05K9/00B32B9/00
    • G21F1/125H05K9/0088G21Y2002/301G21Y2004/10G21Y2004/30Y10T428/12007Y10T428/12014Y10T428/12035
    • An electromagnetic wave reflection-preventing material having a structure formed by successively laminating (A) an electromagnetic have reflecting metallic material layer, if needed, (B) a substrate layer, (C) a resin layer containing a powder of at least one selected from ferrite, carbon, metal powder and an electrically conductive metallic oxide, and, if needed, a good dielectric material, if needed, (D) a supporting film layer, and (E) a pattern coating layer prepared in the form of a geometrical pattern, containing a metal powder and having a volume resistivity of 10.sup.-3 to 10.sup.10 .OMEGA..multidot.cm, preferably further laminating (F) a clear or colored coating layer; and an electromagnetic wave reflection-preventing material which is obtained by substituting (G) a molded sheet layer formed by coating a coating composition prepared by dispersing the above powder into a binder onto a substrate having void, and molding under pressure for (C) a resin layer; and an electromagnetic wave reflection-preventing method which comprises applying the electromagnetic wave reflection-preventing material onto a structure, or which comprises applying a laminate obtained by removing the electromagnetic wave reflecting metallic material layer (A) from the electromagnetic wave reflection-preventing material onto an electromagnetic wave reflecting structure having a metallic surface.
    • 具有通过依次层叠(A)电磁体形成的结构的电磁波反射防止材料具有反射金属材料层,如果需要,(B)基底层,(C)含有选自以下的至少一种的粉末的树脂层 铁素体,碳,金属粉末和导电金属氧化物,如果需要,如果需要,可以使用良好的介电材料(D)支撑膜层,和(E)以几何图案形式制备的图案涂层 ,含有金属粉末,体积电阻率为10-3至1010欧米加×厘米,优选进一步层压(F)透明或有色涂层; 和(G)通过将(G)通过将通过将上述粉末分散在粘合剂中而制备的涂料组合物形成的模塑片层而获得的模塑片层而获得,并且在压力下成型(C) 树脂层; 以及电磁波反射防止方法,其包括将电磁波反射防止材料施加到结构上,或者包括将从电磁波反射防止材料除去电磁波反射金属材料层(A)获得的层压体施加到 具有金属表面的电磁波反射结构。
    • 40. 发明授权
    • Electromagnetic wave reflection-preventing material and electromagnetic
wave reflection-preventing method
    • 电磁波防反射材料和电磁波反射防止方法
    • US5453328A
    • 1995-09-26
    • US183763
    • 1994-01-21
    • Toshiaki NaganoHideo KogureNaozumi IwasawaTetsu Maki
    • Toshiaki NaganoHideo KogureNaozumi IwasawaTetsu Maki
    • H05K9/00B32B9/00
    • H05K9/0086Y10T428/12007Y10T428/12014Y10T428/12035
    • An electromagnetic wave reflection-preventing material having a structure formed by a process which comprises successively laminating (A) a pattern layer formed in the form of a geometrical pattern having a volume resistivity of 10.sup.3 .OMEGA. . cm or less, if needed, (B) a supporting layer, (C) a resin layer, and, if needed, (D) a supporting layer, to form a laminate unit, laminating a pluralitry of the laminate unit so that the layer (A) may face on the layer (C) or (D) to form a multiple laminate unit structure, and laminating the multiple laminate unit structure onto (E) an electromagnetic wave reflecting material layer so that the layer (C) or (D) of the multiple laminate unit structure may face on the layer (E), preferably further laminating a clear or colored coating layer onto the uppermost metallic pattern layer of the electromagnetic wave, reflection-preventing material; and an electromagnetic wave reflection-preventing method which comprises applying the electromagnetic wave reflection-preventing material onto a structure, or which comprises applying the multiple laminate unit structure obtained by removing the electromagnetic wave reflecting material layer (E) from the electromagnetic wave reflection-preventing material onto an electromagnetic wave reflecting structure having a metallic surface.
    • 一种电磁波反射防止材料,其具有通过以下工序形成的结构形成的工艺:连续地层叠(A)形成为体积电阻率为103欧姆时的几何图案形式的图案层。 cm以下,如果需要,(B)支撑层,(C)树脂层,如果需要,(D)支撑层,形成层叠单元,层叠多层叠单元,使层 (A)可以在层(C)或(D)上面对以形成多层压单元结构,并将多层压单元结构层压到(E)电磁波反射材料层上,使得层(C)或(D 多层压单元结构可以在层(E)上面对,优选将透明或着色的涂层进一步层叠到电磁波的最上层的金属图案层上,防反射材料; 以及电磁波反射防止方法,其包括将电磁波反射防止材料施加到结构上,或者包括施加通过从电磁波反射防止中除去电磁波反射材料层(E)而获得的多层叠单元结构 材料到具有金属表面的电磁波反射结构。