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31. 发明授权

US07649739B2 Circuit device 失效
标题翻译：电路设备
公开(公告)号：US07649739B2
公开(公告)日：2010-01-19
申请号：US11526875
申请日：2006-09-26
申请人： Makoto Murai , Ryosuke Usui , Yasuhiro Kohara
发明人： Makoto Murai , Ryosuke Usui , Yasuhiro Kohara
IPC分类号： H05K5/00
CPC分类号： H05K1/0206 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/14 , H01L2924/19105 , H05K1/056 , H05K3/0052 , H05K3/0061 , H05K3/383 , H05K3/385 , H05K3/4652 , H05K2201/068 , H05K2201/09054 , H05K2201/2072 , H05K2203/0315 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A circuit device having superior mechanical strength at the interface between a circuit board and heat sink and superior efficiency for radiating heat from a circuit element to the heat sink through the circuit board. The circuit device includes the metal-based insulation board for installing the circuit element, and the heat sink, over which the insulation board is installed with a paste arranged therebetween. The insulation board has a projection arranged on the surface facing the heat sink along a peripheral portion. At least part of the projection contacts the heat sink through the paste layer.
摘要翻译：电路装置在电路板和散热器之间的界面处具有优良的机械强度，并且具有优异的效率，用于通过电路板从电路元件散热至散热片。电路装置包括用于安装电路元件的金属基绝缘板和安装有绝缘板的绝热板的散热器。绝缘板具有沿着周边部分布置在面向散热器的表面上的突起。突起的至少一部分通过膏层与散热片接触。

32. 发明申请

US20100005653A1 Circuit Apparatus and Method of Fabricating the Apparatus 有权
标题翻译：电路装置及其制造方法
公开(公告)号：US20100005653A1
公开(公告)日：2010-01-14
申请号：US12563849
申请日：2009-09-21
申请人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
发明人： Makoto Murai , Yasuhiro Kohara , Ryosuke Usui
IPC分类号： H05K3/10
CPC分类号： H05K3/243 , H01L23/3128 , H01L23/3142 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L2224/05553 , H01L2224/16225 , H01L2224/16237 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48464 , H01L2224/48465 , H01L2224/48599 , H01L2224/48644 , H01L2224/49171 , H01L2224/81801 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01088 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/351 , H05K3/284 , H05K3/3452 , H05K3/382 , H05K2201/0989 , H05K2203/049 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49222 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.
摘要翻译：密封树脂层在焊盘电极部分的剥离的可能性降低，从而提高了电路设备的可靠性。电路装置包括布线层，镀金层，绝缘树脂层，电路元件，导电构件和密封树脂层。金电镀层形成在焊盘电极的布线层区域中。该地区外面的表面粗糙。绝缘树脂层形成为覆盖布线层，并且在形成焊盘电极的区域中具有开口。电路元件安装在绝缘树脂层上的预定区域上。密封树脂层形成在绝缘树脂层上，以完全覆盖电路元件和焊盘电极的开口。用于焊盘电极的区域中的密封树脂层与镀金层和布线层接触。

33. 发明授权

US07473853B2 Circuit device 失效
标题翻译：电路设备
公开(公告)号：US07473853B2
公开(公告)日：2009-01-06
申请号：US11362516
申请日：2006-02-27
申请人： Makoto Murai , Ryosuke Usui
发明人： Makoto Murai , Ryosuke Usui
IPC分类号： H05K1/16
CPC分类号： C23C28/00 , C23C28/322 , C23C28/345 , H01L23/3121 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L23/49822 , H01L23/49894 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/451 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/0206 , H05K1/056 , H05K3/284 , H05K3/4652 , H05K2201/0209 , H05K2201/0266 , H05K2201/0269 , H05K2201/068 , H05K2201/09563 , H05K2201/096 , H05K2203/0315 , Y10T428/24331 , Y10T428/24917 , H01L2924/00012 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： The present invention provides a circuit device capable of controlling deformation of a circuit device while preventing an insulating layer from peeling from a substrate. The circuit device includes a substrate, an insulating layer formed on the substrate, a filler filled into the insulating layer, a conductive layer formed on the insulating layer, and a circuit element formed on the conductive layer, wherein an average particle diameter of the filler filled into the insulating layer is controlled so that a Young's modulus of a part of the insulating layer on a substrate side can be smaller than a Young's modulus of a part of the insulating layer on an opposite side relative to the substrate side.
摘要翻译：本发明提供一种能够控制电路装置的变形同时防止绝缘层从基板剥离的电路装置。该电路装置包括基板，形成在基板上的绝缘层，填充到绝缘层中的填充物，形成在绝缘层上的导电层和形成在导电层上的电路元件，其中填料的平均粒径控制填充到绝缘层中，使得基板侧的绝缘层的一部分的杨氏模量可以小于相对于基板侧的相对侧的绝缘层的一部分的杨氏模量。

34. 发明申请

US20070176303A1 Circuit device 审中-公开
标题翻译：电路设备
公开(公告)号：US20070176303A1
公开(公告)日：2007-08-02
申请号：US11645803
申请日：2006-12-27
申请人： Makoto Murai , Ryosuke Usui , Tetsuro Sawai , Toshikazu Imaoka , Yasunori Inoue
发明人： Makoto Murai , Ryosuke Usui , Tetsuro Sawai , Toshikazu Imaoka , Yasunori Inoue
IPC分类号： H01L23/28
CPC分类号： H01L23/3107 , H01L21/4832 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L25/16 , H01L2221/68377 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/83001 , H01L2224/85001 , H01L2224/92247 , H01L2225/0651 , H01L2924/00014 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A highly reliable circuit device is provided at low cost. The circuit device includes a semiconductor element electrically connected to a wiring layer (copper plate and plating film) and passive parts sealed by a molded resin layer. The wiring layer has a predetermined pattern formed by a conductive member. The molded resin layer has projections protruding from gaps in the adjacent wiring layer toward an underside of the wiring layer. Thereby, the drop of yield is prevented and the highly reliable circuit device is provided at low cost.
摘要翻译：以低成本提供了高度可靠的电路装置。电路装置包括与布线层（铜板和电镀膜）电连接的半导体元件和由模制树脂层密封的被动部分。布线层具有由导电构件形成的预定图案。模制树脂层具有从相邻布线层中的间隙朝向布线层的下侧突出的突起。从而，可以防止产量的下降，并且以低成本提供高可靠性的电路装置。

35. 发明申请

US20070164349A1 CIRCUIT BOARD, CIRCUIT APPARATUS, AND METHOD OF MANUFACTURING THE CIRCUIT BOARD 审中-公开
标题翻译：电路板，电路设备及制造电路板的方法
公开(公告)号：US20070164349A1
公开(公告)日：2007-07-19
申请号：US11616182
申请日：2006-12-26
申请人： Mayumi Nakasato , Makoto Murai , Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue
发明人： Mayumi Nakasato , Makoto Murai , Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue
IPC分类号： H01L29/788
CPC分类号： H01L21/6835 , H01L23/145 , H01L23/3737 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2221/68345 , H01L2221/68377 , H01L2224/32225 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/0206 , H05K1/0373 , H05K3/421 , H05K3/4652 , H05K3/4655 , H05K2201/0209 , H05K2201/0248 , H05K2201/0266 , H05K2201/09509 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A circuit board includes a substrate and an insulating layer. The substrate has a first surface. The insulating layer has a second surface and is connected to the substrate. The first surface is in contact with the second surface. Heat-conductive particles are provided in the insulating layer. A part of the particles projects from the second surface of the insulating layer and is in contact with the first surface of the substrate.
摘要翻译：电路板包括基板和绝缘层。衬底具有第一表面。绝缘层具有第二表面并连接到基板。第一表面与第二表面接触。在绝缘层中设置导热粒子。一部分颗粒从绝缘层的第二表面突出并且与衬底的第一表面接触。

36. 发明授权

US06365460B1 Production of silicon carbide bodies 失效
标题翻译：生产碳化硅体
公开(公告)号：US06365460B1
公开(公告)日：2002-04-02
申请号：US09460018
申请日：1999-12-13
申请人： Hirotake Yamada , Makoto Murai , Hiroshi Furukubo , Yasufumi Aihara , Tsuneaki Ohashi
发明人： Hirotake Yamada , Makoto Murai , Hiroshi Furukubo , Yasufumi Aihara , Tsuneaki Ohashi
IPC分类号： H01L2100
CPC分类号： C23C16/56 , C23C16/325
摘要： A method for producing a silicon carbide body, includes the steps of forming a silicon carbide mass by chemical vapor deposition, and thermally treating the silicon carbide mass under vacuum or in an inert gas atmosphere at a temperature not less than 2000° C., the silicon carbide article having an electric resistivity higher than that of the silicon carbide mass having not been thermally treated.
摘要翻译：一种生产碳化硅体的方法包括以下步骤：通过化学气相沉积法形成碳化硅块，并在真空或惰性气体气氛中在不低于2000℃的温度下对碳化硅块进行热处理，碳化硅制品的电阻率高于未被热处理的碳化硅块的电阻率。

37. 发明授权

US5332598A Process for the production of lanthanum chromite films by plasma spraying 失效
标题翻译：通过等离子体喷涂生产铬酸镧薄膜的方法
公开(公告)号：US5332598A
公开(公告)日：1994-07-26
申请号：US984456
申请日：1992-12-02
申请人： Shinji Kawasaki , Makoto Murai , Yasufumi Aihara
发明人： Shinji Kawasaki , Makoto Murai , Yasufumi Aihara
IPC分类号： C23C4/02 , C23C4/10 , C23C4/18 , H01M4/88 , H01M8/02 , H01M8/12 , B05D1/08 , B05D5/12
CPC分类号： C23C4/18 , C23C4/11 , H01M8/0215 , H01M8/0219 , Y02P70/56
摘要： A process for the production of a lanthanum chromite film, including the steps of preparing a plasma spray powder by mixing 1-15 parts by weight of powdery chromium oxide powder to 100 parts by weight of powdery lanthanum chromite, this lanthanum chromite having a composition ratio of A sites to B-sites being in a range of 1:1 to 1:0.9, forming a plasma sprayed film by plasma spraying the plasma spray powder onto a substrate, and forming the lanthanum chromite film by heat treating the resulting plasma sprayed film. The plasma spray powder may be produced by preparing a mixed powder by adding 1-15 parts by weight of powdery chromium oxide to 100 parts by weight of a synthesis powder capable of producing the lanthanum chromite film by heat treatment, the synthesis powder containing at least chromium oxide and lanthanum chromite and the lanthanum chromite film having a composition ratio of A-sites to B-sites being in a range of 1:1 to 1:0.9, obtaining a synthesized product by heating the mixed powder, and granulating the synthesized product.
摘要翻译：一种生产亚铬酸镧膜的方法，包括以下步骤：通过将1-15重量份粉末状氧化铬粉末与100重量份粉末状亚铬酸镧混合来制备等离子喷涂粉末，该亚铬酸镧组成比的B位置的比例范围为1：1〜1：0.9，通过将等离子喷涂粉末等离子喷涂到基板上而形成等离子体喷涂膜，通过热处理得到的等离子体喷涂膜。等离子喷涂粉末可以通过向100重量份的能够通过热处理生产亚铬酸镧膜的合成粉末中加入1-15重量份的粉末状氧化铬来制备混合粉末，所述合成粉末至少含有氧化铬和亚铬酸镧，并且A位与B位的组成比在1：1〜1：0.9范围内的亚铬酸镧膜，通过加热混合粉末得到合成产物，并将合成产物。

38. 发明授权

US5194337A Glass joint body and method of manufacturing the same 失效
标题翻译：玻璃接合体及其制造方法
公开(公告)号：US5194337A
公开(公告)日：1993-03-16
申请号：US699735
申请日：1991-05-14
申请人： Akihiko Yoshida , Tomonori Takahashi , Makoto Murai
发明人： Akihiko Yoshida , Tomonori Takahashi , Makoto Murai
IPC分类号： C03C8/24 , C04B37/00 , H01M2/08 , H01M10/39
CPC分类号： H01M2/08 , C03C8/24 , C04B37/005 , H01M10/3909 , C04B2235/6565 , C04B2237/10 , C04B2237/343 , C04B2237/64 , C04B2237/704 , C04B2237/76 , C04B2237/765 , C04B2237/80 , C04B2237/88
摘要： In order to improve the reliability of a glass joint body, a first ceramic member and a second ceramic member are connected by using (a) glass consisting of 10.about.65 wt % of SiO.sub.2, 30 wt % or less of Na.sub.2 O, and the balance of B.sub.2 O.sub.3 and Al.sub.2 O.sub.3, (b) glass including less than 10 wt % of SiO.sub.2, and 30.about.80 wt % of B.sub.2 O.sub.3, (c) glass including substantially none of SiO.sub.2, and 30.about.80 wt % of B.sub.2 O.sub.3, or (d) glass consisting of 10.about.65 wt % of SiO.sub.2, 20 wt % or less of Na.sub.2 O, 30 wt % or less of Al.sub.2 O.sub.3, 20 wt % or less of MgO, and the balance of B.sub.2 O.sub.3.

39. 发明授权

US4955080A Selectively called receiver 失效
标题翻译：选择性地称为接收器
公开(公告)号：US4955080A
公开(公告)日：1990-09-04
申请号：US223983
申请日：1988-07-25
申请人： Kiyoshi Wagai , Makoto Murai
发明人： Kiyoshi Wagai , Makoto Murai
IPC分类号： G08B3/10 , H04W52/02 , H04W88/02
CPC分类号： G08B3/1066 , H04W52/0283 , H04W88/022
摘要： This selectively called receiver intermittently receives a frame signal including call information and transmitted through radio communication from a calling end on a battery saving basis and checks the presence of a call to the receiver. When the call to the receiver is detected, the receiver generates a ringing tone such as a bell sound. While a conventional selectively called receiver usually sets a reference level for proper binarization and reproduction of the frame signal and generates a ringing tone related to battery checking simultaneously, the inventive receiver performs the setting of the reference level and the generation of a ringing tone related to battery checking with different timings in order to stabilize the setting of the reference level.
摘要翻译：该选择性地被称为接收机间歇地接收包括呼叫信息的帧信号，并且在电池节省的基础上从呼叫端通过无线电通信发送，并且检查对接收机的呼叫的存在。当检测到对接收机的呼叫时，接收机产生诸如铃声的振铃音。为了稳定参考电平的设置，接收机执行用于二值化和帧再现的参考电平的设置以及与不同定时的电池检查相关的振铃音的产生。

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