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    • 31. 发明申请
    • COATING AND DEVELOPING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM
    • 涂料和开发设备,基板加工方法和储存介质
    • US20080014333A1
    • 2008-01-17
    • US11733441
    • 2007-04-10
    • Nobuaki MatsuokaYasushi HayashidaShinichi Hayashi
    • Nobuaki MatsuokaYasushi HayashidaShinichi Hayashi
    • B05C11/00B05D1/00
    • H01L21/67745H01L21/67178
    • A coating and developing apparatus is provided which requires a smaller occupation space even when it incorporates a substrate inspection unit, while eliminating a disadvantageous layout. A coating film forming part B3 including a plurality of process units and transfer mechanisms A3 and A4, and a developing part B1 including a plurality of process units 31 and a transfer mechanism A1 are vertically arranged in a process block S2. There are disposed in the process block S2 on a side of a carrier block S1, a plurality of vertically arranged transfer units TRS for transferring a substrate W between the same and transfer mechanisms for the respective parts, and a vertically movable transfer mechanism D1 for the transfer unit for transferring a substrate between these transfer units. At least one of the coating film forming part and the developing part includes a substrate inspection unit 43 for inspecting a substrate transferred by the transfer mechanism for the corresponding part.
    • 提供了一种涂覆和显影装置,即使当其包含基板检查单元时也需要较小的占用空间,同时消除不利的布局。 包括多个处理单元和转印机构A 3和A 4的涂膜形成部分B 3和包括多个处理单元31和转印机构A 1的显影部分B 1垂直地布置在处理块S2中 在载体块S1的一侧设置有处理块S2中的多个垂直设置的传送单元TRS,用于在相同部件之间传送基板W和用于各个部件的传送机构,以及可升降的传送机构D 1用于用于在这些转印单元之间转印衬底的转印单元。 涂膜形成部和显影部中的至少一个包括用于检查由相应部分的转印机构转印的基板的基板检查单元43。
    • 34. 发明授权
    • Coating and developing system control method of controlling coating and developing system
    • 涂料开发系统控制方法
    • US08377501B2
    • 2013-02-19
    • US12438031
    • 2007-09-11
    • Yasushi HayashidaYoshitaka HaraTomohiro Kaneko
    • Yasushi HayashidaYoshitaka HaraTomohiro Kaneko
    • C23C16/52C23C14/54
    • H01L21/67745H01L21/67178H01L21/67276
    • A coating and developing system and control method is provided. The system and control method curtails the amount of time for which a substrate is held with no purpose while improving the throughput of the coating and developing system. An inspection station through which a substrate processed in a processing station is transferred to a carrier station includes a plurality of different inspection modules respectively taking different inspection times, a buffer unit for temporarily holding a substrate and a substrate carrying means controlled by a controller. When the inspection module is engaged in inspecting a substrate, the substrate carrying means carries another substrate to be inspected by the same inspection module to the buffer unit and the substrate is held in the buffer unit. Thus, the holding of wafers in the inspection modules can be suppressed and the throughput can be improved.
    • 提供涂层和显影系统和控制方法。 该系统和控制方法在提高涂层和显影系统的生产量的同时,无需目的地限制基材保持的时间。 将在处理站中处理的基板通过其传送到承载站的检查站包括分别采取不同检查时间的多个不同检查模块,用于临时保持基板的缓冲单元和由控制器控制的基板承载装置。 当检查模块接合检查基板时,基板承载装置将待检查的另一基板由相同的检查模块携带到缓冲单元,并且基板保持在缓冲单元中。 因此,可以抑制检查模块中的晶片的保持,并且可以提高生产量。
    • 36. 发明授权
    • Coating and developing system, coating and developing method and storage medium
    • 涂层和显影系统,涂层和显影方法和存储介质
    • US08025023B2
    • 2011-09-27
    • US11826438
    • 2007-07-16
    • Yasushi HayashidaYoshitaka Hara
    • Yasushi HayashidaYoshitaka Hara
    • B05B7/00
    • H01L21/67276G02F1/1303G05B19/41865G05B2219/31428G05B2219/32097G05B2219/45031H01L21/67745Y02P90/20
    • Wafers A1 to A10 of a first lot A and wafers B1 to B10 of a second lot B are processed by a second heating unit at different temperatures, respectively. A wafer W is carried in a processing block included in coating and developing system along a route passing a temperature control unit CPL2, a coating unit BCT, a heating unit LHP2, a temperature control unit CPL3, a coating unit COT, a heating unit LHP3, and a cooling unit COL in that order. The process temperature of the heating unit LHP3 is changed after the last wafer A10 of the first lot A has been processed by the heating unit LHP3. The wafers of the second lot B are carried according to a carrying schedule such that carrying cycles succeeding a carrying cycle in which the first substrate B1 of the second lot B is carried to the second temperature conditioning unit CPL3 carry the substrates B of the second lot B succeeding the first substrate B1 and processed by a heating process by the heating unit LHP2 in due order to a buffer unit BF2, and the wafers B held in the buffer unit BF2 are carried in due order to the downstream modules after the process temperature of the heating unit LHP3 has been changed.
    • 第一批次A的晶片A1至A10和第二批次B的晶片B1至B10分别由不同温度的第二加热单元处理。 沿着通过温度控制单元CPL2,涂布单元BCT,加热单元LHP2,温度控制单元CPL3,涂布单元COT,加热单元LHP3的路线,在包括在涂布显影系统中的处理块中承载晶片W. ,以及冷却单元COL。 在第一批次A的最后一个晶片A10已被加热单元LHP3处理之后,加热单元LHP3的处理温度改变。 第二批次B的晶片根据携带时间表进行,使得在第二批次B的第一基板B1被承载到第二温度调节单元CPL3的承载循环之后的承载循环携带第二批次的基板B B在第一衬底B1之后,并且通过加热单元LHP2按照缓冲单元BF2进行加热处理,并且保持在缓冲单元BF2中的晶片B在处理温度为 加热单元LHP3已被改变。
    • 37. 发明授权
    • Coating and developing apparatus, substrate processing method, and storage medium
    • 涂布显影装置,基板处理方法和存储介质
    • US07955011B2
    • 2011-06-07
    • US11733441
    • 2007-04-10
    • Nobuaki MatsuokaYasushi HayashidaShinichi Hayashi
    • Nobuaki MatsuokaYasushi HayashidaShinichi Hayashi
    • G03D5/04
    • H01L21/67745H01L21/67178
    • A coating and developing apparatus is provided which requires a smaller occupation space even when it incorporates a substrate inspection unit, while eliminating a disadvantageous layout. A coating film forming part B3 including a plurality of process units and transfer mechanisms A3 and A4, and a developing part B1 including a plurality of process units 31 and a transfer mechanism A1 are vertically arranged in a process block S2. There are disposed in the process block S2 on a side of a carrier block S1, a plurality of vertically arranged transfer units TRS for transferring a substrate W between the same and transfer mechanisms for the respective parts, and a vertically movable transfer mechanism D1 for the transfer unit for transferring a substrate between these transfer units. At least one of the coating film forming part and the developing part includes a substrate inspection unit 43 for inspecting a substrate transferred by the transfer mechanism for the corresponding part.
    • 提供了一种涂覆和显影装置,即使当其包含基板检查单元时也需要较小的占用空间,同时消除不利的布局。 包括多个处理单元和转印机构A3和A4的涂膜形成部分B3和包括多个处理单元31和转印机构A1的显影部分B1垂直地布置在处理块S2中。 在载体块S1的一侧设置有处理块S2,多个垂直设置的传送单元TRS,用于将基板W传送到相应部件的传送机构和用于各部件的传送机构之间, 转印单元,用于在这些转印单元之间转印衬底。 涂膜形成部和显影部中的至少一个包括用于检查由相应部分的转印机构转印的基板的基板检查单元43。
    • 39. 发明授权
    • Substrate processing system and substrate processing method
    • 基板加工系统和基板加工方法
    • US07880859B2
    • 2011-02-01
    • US12621252
    • 2009-11-18
    • Yasushi HayashidaShinichi HayashiYoshitaka Hara
    • Yasushi HayashidaShinichi HayashiYoshitaka Hara
    • H01L21/20
    • H01L21/67276H01L21/67288Y10S414/135
    • A substrate processing system processes a plurality of substrates in a single-substrate processing mode by a plurality of processes and provided with a plurality of modules respectively for carrying out processes. When a defect is found in a substrate, a defective processing unit that caused the defect can be easily found out. The substrate processing system and a substrate processing method to be carried out by the substrate processing system can suppress the reduction of throughput when a large number of substrates are to be processed. The substrate processing system is provided with a plurality of modules for processing a plurality of substrates (W) in a single-substrate processing mode by a plurality of processes and includes a substrate carrying means (A4) for carrying a substrate (W) from a sending module to a receiving module, and a control means (6) for controlling the substrate carrying means (A4) on the basis of one of at least two carrying modes each assigning receiving modules to sending modules. The control means (6) changes the carrying mode in effect for the other carrying mode upon the reception of a carrying mode change command while substrates are being processed and makes the substrate carrying means (A4) carry substrates in the carrying mode newly brought into effect.
    • 基板处理系统通过多个处理以单基板处理模式处理多个基板,并且分别具有用于执行处理的多个模块。 当在基板中发现缺陷时,可以容易地发现引起缺陷的缺陷处理单元。 基板处理系统和由基板处理系统执行的基板处理方法可以抑制当要处理大量基板时的吞吐量的降低。 基板处理系统设置有多个模块,用于通过多个处理以单基板处理模式来处理多个基板(W),并且包括用于承载基板(W)的基板承载装置(A4) 发送模块到接收模块,以及控制装置(6),用于基于至少两种携带模式中的一种来控制基板承载装置(A4),每个模式分配接收模块到发送模块。 控制装置(6)在基板被处理时接收到承载模式改变命令时改变其他承载模式的承载模式,并使基板承载装置(A4)在新生效的承载模式中承载基板 。