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    • 31. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20130037868A1
    • 2013-02-14
    • US13548078
    • 2012-07-12
    • Yasuhiro OkamotoTatsuo NakayamaTakashi InoueHironobu Miyamoto
    • Yasuhiro OkamotoTatsuo NakayamaTakashi InoueHironobu Miyamoto
    • H01L29/78H01L21/20
    • H01L29/7787H01L21/02458H01L21/0254H01L29/2003H01L29/205H01L29/41775H01L29/4236H01L29/66462H01L29/7786
    • A semiconductor device includes: a first nitride semiconductor layer; a second nitride semiconductor layer formed over the first nitride semiconductor layer; and a gate electrode facing the second nitride semiconductor layer via a gate insulating film. Because the second nitride semiconductor layer is formed by stacking plural semiconductor layers with their Al composition ratios different from each other, the Al composition ratio of the second nitride semiconductor layer changes stepwise. The semiconductor layers forming the second nitride semiconductor layer are polarized in the same direction so that, among the semiconductor layers, a semiconductor layer nearer to the gate electrode has higher (or lower) intensity of polarization. In other words, the intensities of polarization of the semiconductor layers change with an inclination based on their distances from the gate electrode so that, at each interface between two semiconductor layers, the amount of negative charge becomes larger than that of positive charge.
    • 半导体器件包括:第一氮化物半导体层; 形成在第一氮化物半导体层上的第二氮化物半导体层; 以及经由栅极绝缘膜与第二氮化物半导体层相对的栅电极。 由于第二氮化物半导体层通过堆叠其Al组成比彼此不同的多个半导体层而形成,所以第二氮化物半导体层的Al组成比逐步变化。 形成第二氮化物半导体层的半导体层在相同的方向上极化,使得在半导体层中,更靠近栅电极的半导体层具有较高(或更低)的极化强度。 换句话说,半导体层的极化强度随着与栅电极的距离的倾斜而变化,使得在两个半导体层之间的每个界面处,负电荷的量变得大于正电荷的量。
    • 32. 发明申请
    • SEMICONDUCTOR DEVICE AND FIELD EFFECT TRANSISTOR
    • 半导体器件和场效应晶体管
    • US20120199889A1
    • 2012-08-09
    • US13393002
    • 2010-06-23
    • Hironobu MiyamotoYasuhiro OkamotoYuji AndoTatsuo NakayamaTakashi InoueKazuki OtaKazuomi Endo
    • Hironobu MiyamotoYasuhiro OkamotoYuji AndoTatsuo NakayamaTakashi InoueKazuki OtaKazuomi Endo
    • H01L29/78
    • H01L29/8122H01L29/0657H01L29/2003H01L29/201H01L29/205H01L29/41741H01L29/41766H01L29/4236H01L29/7809H01L29/7812H01L29/7813H01L29/8128
    • Provided is a semiconductor device in which the trade-off between the withstand voltage and the on-resistance is improved and the performance is increased.A semiconductor device comprises a substrate 1, a first n-type semiconductor layer 21′, a second n-type semiconductor layer 23, a p-type semiconductor layer 24, and a third n-type semiconductor layer 25′, wherein the first n-type semiconductor layer 21′, the second n-type semiconductor layer 23, the p-type semiconductor layer 24, and the third n-type semiconductor layer 25′ are laminated at the upper side of the substrate 1 in this order. The drain electrode 13 is in ohmic-contact with the first n-type semiconductor layer 21′ and the source electrode 12 is in ohmic-contact with the third n-type semiconductor layer 25′. A gate electrode 14 is arranged so as to fill an opening portion to be filled that extends from the third n-type semiconductor layer 25′ to the second n-type semiconductor layer 23, and the gate electrode 14 is in contact with the upper surface of the second n-type semiconductor layer 23, the side surfaces of the p-type semiconductor layer 24, and the side surfaces of the third n-type semiconductor layer 25′. The second n-type semiconductor layer 23 has composition that changes from the drain electrode 13 side toward the source electrode 12 side in the direction perpendicular to the plane of the substrate 1 and contains donor impurity.
    • 提供一种半导体器件,其中耐压和导通电阻之间的折衷被提高并且性能提高。 半导体器件包括衬底1,第一n型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25',其中第一n型半导体层 型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25'依次层叠在基板1的上侧。 漏电极13与第一n型半导体层21'欧姆接触,源电极12与第三n型半导体层25'欧姆接触。 栅电极14被布置成填充从第三n型半导体层25'延伸到第二n型半导体层23的待填充的开口部分,并且栅电极14与上表面 第二n型半导体层23,p型半导体层24的侧表面和第三n型半导体层25'的侧表面。 第二n型半导体层23具有从垂直于基板1的平面的方向从漏电极13侧向源电极12侧变化的成分,并且含有施主杂质。
    • 37. 发明申请
    • III-NITRIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR
    • III-NITRIDE半导体场效应晶体管
    • US20100038680A1
    • 2010-02-18
    • US12528578
    • 2008-02-26
    • Tatsuo NakayamaYuji AndoHironobu MiyamotoYasuhiro OkamotoTakashi Inoue
    • Tatsuo NakayamaYuji AndoHironobu MiyamotoYasuhiro OkamotoTakashi Inoue
    • H01L29/778
    • H01L29/42316H01L29/2003H01L29/7781
    • Provided is a semiconductor device that can reduce the contact resistance, has a small current collapse, and can improve the pinch-off characteristic upon a high-frequency operation. A field effect transistor using a wurtzite (having (0001) as the main plane) type III-nitride semiconductor includes: a substrate (101); an undercoat layer (103) of a first III-nitride semiconductor; and a carrier travel layer (104) of a second III-nitride semiconductor. The undercoat layer (103) (101) and the carrier travel layer (104) is formed on the substrate in this order. The field effect transistor includes source/drain electrodes (105, 106) in ohmic contact, and a gate electrode (107) in Schottky contact directly or via another layer on the carrier travel layer (104). The undercoat layer (103) has an average lattice constant greater than that of the carrier travel layer (104) and a band gap greater than that of the carrier travel layer (104).
    • 提供了能够降低接触电阻,具有小的电流崩溃的半导体器件,并且可以在高频操作时提高夹断特性。 使用纤锌矿(具有(0001)作为主面)的III型氮化物半导体的场效应晶体管包括:衬底(101); 第一III族氮化物半导体的底涂层(103) 和第二III族氮化物半导体的载流子行进层(104)。 底涂层(103)(101)和载体移动层(104)依次形成在基板上。 场效应晶体管包括欧姆接触的源极/漏极(105,106)和直接或通过载流子行进层(104)上的另一层的肖特基接触的栅电极(107)。 底涂层(103)的平均晶格常数大于载体移动层(104)的平均晶格常数,并且带隙大于载流子行进层(104)的平均晶格常数。