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    • 31. 发明授权
    • Process for making a contact betwen a capacitor electrode disposed in a
trench and an MOS transistor source/drain region disposed outside the
trench
    • 在设置在沟槽中的电容器电极和设置在沟槽外部的MOS晶体管源极/漏极区之间进行接触的工艺
    • US5432115A
    • 1995-07-11
    • US284502
    • 1994-08-04
    • Wolfgang RosnerFranz HofmannLothar Risch
    • Wolfgang RosnerFranz HofmannLothar Risch
    • H01L21/76H01L21/8242H01L27/10H01L27/108
    • H01L27/10861H01L27/10829
    • To make a contact between a capacitor electrode (13) disposed in a trench (11) and an MOS transistor source/drain region disposed outside the trench, a shallow etching is carried out in a self-aligned manner with respect to a field-oxide region insulating the MOS transistor by producing the trench (11) in a substrate (1). After forming an Si.sub.3 N.sub.4 spacer (10) at the edge (8), laid bare during the etching, of the substrate (1) the part laid bare of the field-oxide region (2) is first removed with the aid of a mask and the trench (11) is completed in a further etching. The contact is produced after the formation of an SiO.sub.2 layer (12) at the surface of the trench (11) after removing the Si.sub.3 N.sub.4 spacer (10) and producing the capacitor electrode (13) at the edge (8), laid bare by removing the Si.sub.3 N.sub.4 spacer (10), of the substrate (1).
    • PCT No.PCT / DE93 / 00078 Sec。 371日期:1994年8月4日 102(e)日期1994年8月4日PCT提交1993年2月1日PCT公布。 出版物WO93 / 16490 日期:1993年8月19日。为了在布置在沟槽(11)中的电容器电极(13)和设置在沟槽外部的MOS晶体管源/漏区之间进行接触,以自对准的方式进行浅蚀刻 相对于通过在衬底(1)中产生沟槽(11)来绝缘MOS晶体管的场氧化物区域。 在蚀刻过程中在边缘(8)处形成Si3N4间隔物(10)之后,在衬底(1)上放置裸露的场氧化物区域(2)的部分首先借助掩模去除, 在另外的蚀刻中完成沟槽(11)。 在除去Si 3 N 4间隔物(10)之后在沟槽(11)的表面形成SiO 2层(12)并在边缘(8)处产生电容器电极(13),在通过去除 (1)的Si 3 N 4间隔物(10)。
    • 32. 发明授权
    • Double gated transistor
    • 双门控晶体管
    • US06459123B1
    • 2002-10-01
    • US09302768
    • 1999-04-30
    • Gerhard EndersThomas SchulzDietrich WidmannLothar Risch
    • Gerhard EndersThomas SchulzDietrich WidmannLothar Risch
    • H01L2994
    • H01L27/11H01L21/823885H01L27/092H01L27/1104H01L27/1203
    • A semiconductor body having a pair of vertical, double-gated CMOS transistors. An insulating layer extending horizontally beneath the surface of the semiconductor body such insulating layer being disposed beneath the pair of transistors. The transistors, together with additional such transistors, are arranged to form a Synchronous Dynamic Random Access Memory (SRAM) array. The array includes a plurality of SRAM cells arranged in rows and columns, each one of the cells having a WORDLINE connected to a WORLDINE CONTACT. The WORDLINE CONTACT is common to four contiguous one of the cells. One of the cells having a plurality of electrically interconnected MOS transistors arranged to provide an SRAM circuit. Each one of the cells has a VDD CONTACT and a VSS CONTACT. One of such CONTACTs is disposed centrally within each one of the cells and the other one of the CONTACTs being common to four contiguous ones of the cells. Each one of the cells has the common one of the CONTACTs and the WORDLINE CONTACT disposed at peripheral, corner regions of the cell.
    • 具有一对垂直双门控CMOS晶体管的半导体本体。 在半导体本体的表面下水平延伸的绝缘层,该绝缘层设置在该对晶体管的下方。 晶体管与附加的这种晶体管一起被布置成形成同步动态随机存取存储器(SRAM)阵列。 阵列包括以行和列排列的多个SRAM单元,每个单元都具有连接到WORLDINE CONTACT的WORDLINE。 WORDLINE CONTACT是四个连续的一个单元格共同的。 具有多个电互连的MOS晶体管的单元之一被布置成提供SRAM电路。 每个单元都有一个VDD CONTACT和一个VSS CONTACT。 这种CONTACT之一被布置在每个单元格的中心并且另一个CONTACT被四个相邻的单元共同。 每个单元格具有共同的一个CONTACT和WORDLINE CONTACT放置在单元的外围角区域。
    • 33. 发明授权
    • Double gated transistor
    • 双门控晶体管
    • US06503784B1
    • 2003-01-07
    • US09670742
    • 2000-09-27
    • Gerhard EndersThomas SchulzDietrich WidmannLothar Risch
    • Gerhard EndersThomas SchulzDietrich WidmannLothar Risch
    • H01L218238
    • H01L27/11H01L21/823885H01L27/092H01L27/1104H01L27/1203
    • A semiconductor body-having a pair of vertical, double-gated CMOS transistors. An insulating layer extending horizontally beneath the surface of the semiconductor body such insulating layer being disposed beneath the pair of transistors. The transistors, together with additional such transistors, are arranged to form a Synchronous Dynamic Random Access Memory (SRAM) array. The array includes a plurality of SRAM cells arranged in rows and columns, each one of the cells having a WORDLINE connected to a WORLDINE CONTACT. The WORDLINE CONTACT is common to four contiguous one of the cells. One of the cells having a plurality of electrically interconnected MOS transistors arranged to provide an SRAM circuit. Each one of the cells has a VDD CONTACT and a VSS CONTACT. One of such CONTACTs is disposed centrally within each one of the cells and the other one of the CONTACTs being common to four contiguous ones of the cells. Each one of the cells has the common one of the CONTACTs and the WORDLINE CONTACT disposed at peripheral, corner regions of the cell.
    • 一种具有一对垂直双门控CMOS晶体管的半导体体。 在半导体本体的表面下水平延伸的绝缘层,该绝缘层设置在该对晶体管的下方。 晶体管与附加的这种晶体管一起被布置成形成同步动态随机存取存储器(SRAM)阵列。 阵列包括以行和列排列的多个SRAM单元,每个单元都具有连接到WORLDINE CONTACT的WORDLINE。 WORDLINE CONTACT是四个连续的一个单元格共同的。 具有多个电互连的MOS晶体管的单元之一被布置成提供SRAM电路。 每个单元都有一个VDD CONTACT和一个VSS CONTACT。 这种CONTACT之一被布置在每个单元格的中心并且另一个CONTACT被四个相邻的单元共同。 每个单元格具有共同的一个CONTACT和WORDLINE CONTACT放置在单元的外围角区域。
    • 34. 发明授权
    • Static random access memory (SRAM)
    • 静态随机存取存储器(SRAM)
    • US06472767B1
    • 2002-10-29
    • US09302757
    • 1999-04-30
    • Gerhard EndersThomas SchulzDietrich WidmannLothar Risch
    • Gerhard EndersThomas SchulzDietrich WidmannLothar Risch
    • H01L2711
    • H01L27/11H01L27/1104
    • A semiconductor body having a pair of vertical, double-gated CMOS transistors. An insulating layer extending horizontally beneath the surface of the semiconductor body such insulating layer being disposed beneath the pair of transistors. The transistors, together with additional such transistors, are arranged to form a Synchronous Dynamic Random Access Memory (SRAM) array. The array includes a plurality of SRAM cells arranged in rows and columns, each one of the cells having a WORDLINE connected to a WORLDINE CONTACT. The WORDLINE CONTACT is common to four contiguous one of the cells. One of the cells having a plurality of electrically interconnected MOS transistors arranged to provide an SRAM circuit. Each one of the cells has a VDD CONTACT and a VSS CONTACT. One of such CONTACTs is disposed centrally within each one of the cells and the other one of the CONTACTs being common to four contiguous ones of the cells. Each one of the cells has the common one of the CONTACTs and the WORDLINE CONTACT disposed at peripheral, corner regions of the cell.
    • 具有一对垂直双门控CMOS晶体管的半导体本体。 在半导体本体的表面下水平延伸的绝缘层,该绝缘层设置在该对晶体管的下方。 晶体管与附加的这种晶体管一起被布置成形成同步动态随机存取存储器(SRAM)阵列。 阵列包括以行和列排列的多个SRAM单元,每个单元都具有连接到WORLDINE CONTACT的WORDLINE。 WORDLINE CONTACT是四个连续的一个单元格共同的。 具有多个电互连的MOS晶体管的单元之一被布置成提供SRAM电路。 每个单元都有一个VDD CONTACT和一个VSS CONTACT。 这种CONTACT之一被布置在每个单元格的中心并且另一个CONTACT被四个相邻的单元共同。 每个单元格具有共同的一个CONTACT和WORDLINE CONTACT放置在单元的外围角区域。
    • 35. 发明授权
    • SRAM cell configuration and method for its fabrication
    • SRAM单元配置及其制造方法
    • US6038164A
    • 2000-03-14
    • US200071
    • 1998-11-25
    • Thomas SchulzThomas AeugleWolfgang RosnerLothar Risch
    • Thomas SchulzThomas AeugleWolfgang RosnerLothar Risch
    • H01L21/8244H01L27/11G11C11/00
    • H01L27/11H01L27/1104
    • The SRAM cell configuration has at least six transistors in each memory cell. Four of the transistors form a flip-flop and they are arranged at the corners of a quadrilateral. The flip-flop is driven by two of the transistors, which are disposed so as to adjoin diagonally opposite corners of the quadrilateral and outside the quadrilateral. Adjacent memory cells along a word line can be arranged in such a way that a first bit line and a second bit line of the adjacent memory cells coincide. The transistors are preferably vertical and are arranged at semiconductor structures (St1, St2, St3, St4, St5, St6) produced from a layer sequence. Two of the transistors having n-doped channel regions are preferably formed in each case on two semiconductor structures.
    • SRAM单元配置在每个存储单元中具有至少六个晶体管。 四个晶体管形成触发器,并且它们被布置在四边形的角部。 触发器由两个晶体管驱动,这些晶体管被设置为邻接四边形的对角线相对的角部并且在四边形之外。 沿着字线的相邻存储器单元可以以相邻存储器单元的第一位线和第二位线重合的方式布置。 晶体管优选是垂直的,并且被布置在从层序列产生的半导体结构(St1,St2,St3,St4,St5,St6)处。 在每种情况下,优选在两个半导体结构上形成具有n掺杂沟道区的两个晶体管。
    • 40. 发明授权
    • Memory cell having trench capacitor and vertical, dual-gated transistor
    • 存储单元具有沟槽电容器和垂直双门控晶体管
    • US06262448B1
    • 2001-07-17
    • US09302756
    • 1999-04-30
    • Gerhard EndersMatthias IlgLothar RischDietrich Widmann
    • Gerhard EndersMatthias IlgLothar RischDietrich Widmann
    • H01L27108
    • H01L27/10864H01L27/10841H01L27/10876
    • A DRAM cell is disposed in an electrically isolated region of a semiconductor body. The cell includes a storage capacitor disposed in a trench. The capacitor is disposed entirely within the isolated region of the semiconductor body. The cell includes a transistor disposed in the isolated region. The transistor has a pair of gates. A word line is provided for addressing the cell. The word line has an electrical contact region to the transistor. The word line contact region is disposed entirely within the isolated region of the semiconductor body. The transistor has an active area. The active area has source, drain, and channel regions. The active area is disposed entirely within the isolated region of the semiconductor body. A bit line is provided for the cell. The bit line is in electrical contact with the gates of the transistor at a pair of bit line contact regions. Both such bit line contact regions are disposed entirely within the isolated region of the cell. With such an arrangement a DRAM cell is provided having a relatively occupies a relatively small amount of surface area of the semiconductor body.
    • DRAM单元设置在半导体本体的电隔离区域中。 电池包括设置在沟槽中的存储电容器。 电容器完全设置在半导体本体的隔离区域内。 电池包括设置在隔离区域中的晶体管。 晶体管有一对门。 提供字线用于寻址单元。 字线具有到晶体管的电接触区域。 字线接触区域完全设置在半导体本体的隔离区域内。 晶体管有一个有源区。 有源区域有源极,漏极和沟道区域。 有源区域完全设置在半导体本体的隔离区域内。 为单元提供位线。 位线在一对位线接触区域与晶体管的栅极电接触。 两个这样的位线接触区域完全设置在电池的隔离区域内。 通过这样的布置,提供了DRAM单元,其具有相对占据半导体本体的较小量的表面积。