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31. 发明申请

US20080207039A1 COLLAR CLIP FOR AN ELECTRONIC MODULE 有权
标题翻译：电子模块的COLLAR CLIP
公开(公告)号：US20080207039A1
公开(公告)日：2008-08-28
申请号：US12038689
申请日：2008-02-27
申请人： Joshua Moore , Donald A. Ice , Chris Togami
发明人： Joshua Moore , Donald A. Ice , Chris Togami
IPC分类号： H01R13/625
CPC分类号： G02B6/4201 , G02B6/4261 , G02B6/4277 , H05K9/0058
摘要： In one example embodiment, a collar clip includes a body that is sized and configured to partially encircle a shell of an optoelectronic transceiver module. Each extended element in a pair of the extended elements is separated from the other extended element in the pair by a cavity. Each cavity is configured to receive a portion of a corresponding structure of the shell.
摘要翻译：在一个示例性实施例中，套环夹具包括主体，其尺寸和构造以部分地环绕光电收发器模块的外壳。一对延伸元件中的每个延伸元件与一对空腔中的另一个延伸元件分离。每个空腔构造成接收壳体的相应结构的一部分。

32. 发明申请

US20070237489A1 GROUNDING A PRINTED CIRCUIT BOARD IN A TRANSCEIVER MODULE 有权
标题翻译：在收发器模块中接地印刷电路板
公开(公告)号：US20070237489A1
公开(公告)日：2007-10-11
申请号：US11689351
申请日：2007-03-21
申请人： Gary D. Sasser , Chris Togami
发明人： Gary D. Sasser , Chris Togami
IPC分类号： G02B6/00
CPC分类号： G02B6/4246 , G02B6/4284 , H01R13/512 , H01R13/6485 , H01R13/6581 , H01R13/6583 , H01R13/6594 , H01R13/6658 , H01R13/7197 , H01R24/62
摘要： A transceiver module that utilizes an apparatus for providing chassis ground to a printed circuit board located within a connector structure of the transceiver module. In one example embodiment, a ground clip for use in a transceiver module includes a cross-arm, a pair of arms connected to the cross-arm, a pair of fingers each connected to one of the pair of arms, and at least one protrusion connected to the cross-arm. Each finger is configured to be inserted into a hole in a connector structure and configured to be electrically connected to ground contacts of a printed circuit board. The at least one protrusion is configured to bias against, and make reliable electrical contact with, a portion of a transceiver module that is electrically connected to a housing of the transceiver module.
摘要翻译：一种收发机模块，其利用一种用于向位于所述收发器模块的连接器结构内的印刷电路板提供机架接地的设备。在一个示例性实施例中，用于收发器模块中的接地夹具包括横臂，连接到横臂的一对臂，每对连接到该对臂之一的一对手指，以及至少一个突起连接到横臂。每个手指被配置成插入到连接器结构中的孔中并且被配置为电连接到印刷电路板的接地触头。所述至少一个突起被构造成偏置与电连接到所述收发器模块的外壳的收发器模块的一部分偏压并且使其可靠地电接触。

33. 发明申请

US20050271391A1 Dual stage modular optical devices 有权
标题翻译：双级模块化光学器件
公开(公告)号：US20050271391A1
公开(公告)日：2005-12-08
申请号：US11134532
申请日：2005-05-20
申请人： Chris Togami , Gary Sasser
发明人： Chris Togami , Gary Sasser
IPC分类号： G02B6/38 , H04B10/00 , H04B10/24
CPC分类号： H04B10/40 , G02B6/3897
摘要： Embodiments of the present invention are directed to a dual stage modular optical device for sending and/or receiving optical signals. A first fabricated package includes a light source for generating optical signals and/or a light detector for detecting received optical signals. A second fabricated package includes an opening for accepting circuitry that is to electrically interoperate with the light source and/or light detector to transfer optical signals. A lead frame mechanically connects the first fabricated package to the second fabricated package and electrically connects the light source and/or light detector to contacts exposed in the opening. The dual stage modular optical device can be coupled to a substrate configured to be received within a standard slot of a host system, such as a PCI or PCMCIA slot. Thus, one or more optical connections are integrated within the host device or system.
摘要翻译：本发明的实施例涉及用于发送和/或接收光信号的双级模块化光学装置。第一制造的封装包括用于产生光信号的光源和/或用于检测接收到的光信号的光检测器。第二制造的封装包括用于接受与光源和/或光检测器电互操作以传送光信号的电路的开口。引线框架将第一制造的封装机械地连接到第二制造的封装并将光源和/或光检测器电连接到暴露在开口中的触点。双级模块化光学器件可以耦合到被配置为被接收在诸如PCI或PCMCIA插槽的主机系统的标准槽内的衬底。因此，一个或多个光学连接被集成在主机设备或系统内。

34. 发明申请

US20050265670A1 Modular optical device with component insert 有权
标题翻译：带组件插入件的模块化光学装置
公开(公告)号：US20050265670A1
公开(公告)日：2005-12-01
申请号：US11135835
申请日：2005-05-23
申请人： Gary Sasser , Chris Togami , David Allouche
发明人： Gary Sasser , Chris Togami , David Allouche
IPC分类号： G02B6/36 , G02B6/42
CPC分类号： G02B6/4201 , G02B6/4246 , G02B6/4292
摘要： Embodiments of the present invention are directed to a modular optical device with a component insert for sending and/or receiving optical signals. A first fabricated package includes a light source for generating optical signals and/or a light detector for detecting received optical signals. A second fabricated package includes an opening for accepting circuitry. A lead frame mechanically connects the first fabricated package to the second fabricated package and electrically connects the light source and/or the light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts for electrical interoperation with the light source and/or the light detector to transfer optical signals. The modular optical device can be coupled to a substrate configured to be received within a standard host system slot.
摘要翻译：本发明的实施例涉及一种具有用于发送和/或接收光信号的部件插入件的模块化光学装置。第一制造的封装包括用于产生光信号的光源和/或用于检测接收到的光信号的光检测器。第二制造包装包括用于接受电路的开口。引线框架将第一制造的封装机械地连接到第二制造封装，并将第一制造封装中的光源和/或光检测器电连接到暴露在第二制造封装的开口中的触点。部件插入件机械耦合到第二制造的封装并电耦合到暴露的触点，用于与光源和/或光检测器的电互操作以传送光信号。模块化光学设备可以耦合到被配置为被接收在标准主机系统时隙内的基板。

35. 发明申请

US20050168963A1 Multi-board optical tranceiver 有权
标题翻译：多板光学收发器
公开(公告)号：US20050168963A1
公开(公告)日：2005-08-04
申请号：US11093647
申请日：2005-03-30
申请人： Chris Togami , Stephan Burdick , Stephen Gordy
发明人： Chris Togami , Stephan Burdick , Stephen Gordy
IPC分类号： G02B6/42 , H05K1/14 , H05K7/14
CPC分类号： H05K1/144 , G02B6/4246 , G02B6/4292 , H05K1/147 , H05K2201/10303 , H05K2201/10424
摘要： An optical transceiver module that includes an enclosure within which are disposed a transmitter module and a receiver module. A primary and secondary board are disposed as well in the enclosure, and the transmitter module and the receiver module are each connected with one of the boards. The primary and secondary boards each have a ground plane, and a third ground plane is provided by a ground signal plate that disposed within the enclosure and electrically coupled with the primary board and the secondary board.
摘要翻译：一种光收发器模块，包括其中设置有发射器模块和接收器模块的外壳。主板和副板也被安置在外壳中，并且发射器模块和接收器模块各自与一个板相连。主板和次板各自具有接地平面，并且第三接地平面由设置在外壳内并与主板和次板电连接的接地信号板提供。

36. 发明申请

US20050152701A1 Internal EMI shield for an optoelectronic module 有权
标题翻译：用于光电子模块的内部EMI屏蔽
公开(公告)号：US20050152701A1
公开(公告)日：2005-07-14
申请号：US11029944
申请日：2005-01-05
申请人： Linda Liu , Tom Downey , John Moller , Chris Togami
发明人： Linda Liu , Tom Downey , John Moller , Chris Togami
IPC分类号： H04B10/00 , H04B10/28 , H05K9/00
CPC分类号： G02B6/4277 , G02B6/4246 , H04B10/43 , H04B10/801 , H05K9/0058
摘要： A shield device for preventing the emission of electromagnetic interference (“EMI”) from an optoelectronic device, such as an optical transceiver, is disclosed. In particular, an EMI shield is disclosed for placement within an optical transceiver module in order to intercept and absorb EMI produced by electronic components included within the transceiver. This absorption by the EMI shield prevents EMI from escaping the optical transceiver module and interfering with other electronic components that are typically placed in close proximity to the transceiver. The EMI shield in one embodiment includes a sheet of EMI absorbing material that is sized for placement within the transceiver. The EMI shield can be interposed between an outer shell of the transceiver and electronic components located on a printed circuit board that is disposed within the transceiver. The proximity of the EMI shield to the EMI-producing electronic components maximizes EMI absorption by the shield.
摘要翻译：公开了一种用于防止来自诸如光收发器之类的光电子器件的电磁干扰（“EMI”）的发射的屏蔽装置。特别地，公开了用于放置在光收发器模块内的EMI屏蔽，以便截取和吸收由包含在收发器内的电子元件产生的EMI。 EMI屏蔽的这种吸收防止EMI从光收发器模块中逸出，并干扰通常放置在收发器附近的其他电子元件。 EMI屏蔽在一个实施例中包括一片EMI吸收材料，其尺寸适于放置在收发器内。 EMI屏蔽可插入在收发器的外壳和位于设置在收发器内的印刷电路板上的电子元件之间。 EMI屏蔽对EMI产生电子部件的接近使屏蔽件的EMI吸收最大化。

37. 发明授权

US08858425B2 Disposable endoscope and portable display 有权
标题翻译：一次性内窥镜和便携式显示器
公开(公告)号：US08858425B2
公开(公告)日：2014-10-14
申请号：US12759169
申请日：2010-04-13
申请人： Mina Farr , Franklin J. Wall, Jr. , Chris Togami , Gary D. Sasser
发明人： Mina Farr , Franklin J. Wall, Jr. , Chris Togami , Gary D. Sasser
IPC分类号： A61B1/04 , A61B1/00
CPC分类号： A61B1/00103 , A61B1/00177 , A61B1/05 , A61B1/0615 , A61B1/0638 , A61B1/0676 , A61B1/0684 , A61B17/00234 , A61B17/3421 , A61B17/3439 , A61B90/37 , A61B90/53 , A61B2017/0023 , A61B2017/00296 , A61B2017/3484 , A61B2090/0813 , A61B2090/309 , A61B2090/373
摘要： Various embodiments for providing removable, pluggable and disposable opto-electronic modules for illumination and imaging for endoscopy or borescopy are provided for use with portable display devices. Generally, various medical or industrial devices can include one or more solid state or other compact electro-optic illuminating elements located thereon. Additionally, such opto-electronic modules may include illuminating optics, imaging optics, and/or image capture devices. The illuminating elements may have different wavelengths and can be time-synchronized with an image sensor to illuminate an object for imaging or detecting purpose or other conditioning purpose. The removable opto-electronic modules may be plugged onto the exterior surface of another medical device, deployably coupled to the distal end of the device, or otherwise disposed on the device.
摘要翻译：提供了用于提供用于内窥镜检查或孔镜的照明和成像的可移除，可插拔和一次性光电模块的各种实施例，用于便携式显示装置。通常，各种医疗或工业设备可以包括位于其上的一个或多个固态或其他紧凑的电光照明元件。此外，这样的光电模块可以包括照明光学器件，成像光学器件和/或图像捕获器件。照明元件可以具有不同的波长，并且可以与图像传感器时间同步以照亮物体以进行成像或检测目的或其他调节目的。可拆卸的光电模块可以被插入到另一医疗装置的外表面上，可展开地联接到装置的远端，或者以其他方式设置在装置上。

38. 发明授权

US07959467B2 Communication module ground contact 有权
标题翻译：通讯模块接地
公开(公告)号：US07959467B2
公开(公告)日：2011-06-14
申请号：US12611843
申请日：2009-11-03
申请人： Gary D. Sasser , Chris Togami
发明人： Gary D. Sasser , Chris Togami
IPC分类号： H01R13/648
CPC分类号： H01R13/6275 , H01R13/6583 , Y10S439/939
摘要： A transceiver module that utilizes a side contact spring portion to ground a shielded cable that is plugged into the transceiver module. In one example embodiment, a transceiver module includes a housing, a jack, and a side contact spring portion. The housing is operative to be electrically connected to chassis ground when the transceiver module is received within a host port. The jack is defined in the housing and operative to receive a shielded plug. The side contact spring portion is substantially implemented within the jack and is configured to be in electrical contact with both the housing and a conductive element of the shielded plug received by the jack such that a chassis ground is established between the housing and the shielded plug and such that a moveable bail pivot lever is able to move without disrupting the electrical contact between the side contact spring portion and the housing and/or the conductive element of the shielded plug.
摘要翻译：收发器模块，其利用侧接触弹簧部分将插入到收发器模块中的屏蔽电缆接地。在一个示例实施例中，收发器模块包括壳体，千斤顶和侧接触弹簧部分。当收发器模块被接收在主机端口内时，壳体可操作地电连接到机壳接地。插座被限定在壳体中并且可操作地接收屏蔽插头。侧接触弹簧部分基本上在千斤顶内实现，并被构造成与壳体和由插座接收的屏蔽插头的导电元件电接触，使得在壳体和屏蔽插头之间建立底盘接地，使得可移动的吊环枢转杆能够移动而不破坏侧接触弹簧部分与壳体和/或屏蔽塞的导电元件之间的电接触。

39. 发明授权

US07837399B2 Electromagnetic interference containment structures 有权
标题翻译：电磁干扰遏制结构
公开(公告)号：US07837399B2
公开(公告)日：2010-11-23
申请号：US12348767
申请日：2009-01-05
申请人： Chris Togami , Gary Dean Sasser , Kai F Ng
发明人： Chris Togami , Gary Dean Sasser , Kai F Ng
IPC分类号： G02B6/36 , G02B6/12
CPC分类号： G02B6/4292 , G02B6/4204 , G02B6/4246 , G02B6/4277 , H05K9/0058
摘要： In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.
摘要翻译：在一个示例实施例中，光电子模块包括主体，信号接地和OSA。主体连接到机架接地并限定一个空腔，一个或多个部件设置在该空腔内。光学子组件设置在体腔中，具有连接到信号地面的一个或多个部件，并且包括头部组件，壳体和一个或多个容纳结构。头部组件容纳一个或多个产生EMI发射并且包括光学孔的部件。外壳包括一个端口和一个桶。端口限定纤维容器，并且筒限定了至少部分地容纳头部组件的空腔。遏制结构至少部分地包含OSA内的EMI发射。

40. 发明授权

US07699629B2 Grounding via a pivot lever in a transceiver module 有权
标题翻译：通过收发模块中的枢纽杆接地
公开(公告)号：US07699629B2
公开(公告)日：2010-04-20
申请号：US11688753
申请日：2007-03-20
申请人： Gary D. Sasser , Chris Togami
发明人： Gary D. Sasser , Chris Togami
IPC分类号： H01R13/648 , H01R13/00
CPC分类号： G02B6/4284 , G02B6/4201 , G02B6/4261 , G02B6/4277 , G02B6/428 , H01R13/6581 , H01R13/6594
摘要： A transceiver module that utilizes a pivot lever to ground a shielded cable that is plugged into the transceiver module. In one example embodiment, a transceiver module includes a housing, a jack, and a movable pivot lever. The housing is operative to be electrically connected to chassis ground when the transceiver module is received within a host port. The jack is defined in the housing and operative to receive a shielded plug. The pivot lever is configured to allow removal of the transceiver module from within the host port. Further, the pivot lever is configured to be in electrical contact with both the housing and a conductive element of the shielded plug received by the jack such that a chassis ground is established between the housing and the shielded plug.
摘要翻译：收发器模块，其利用枢轴来将插入收发器模块的屏蔽电缆接地。在一个示例性实施例中，收发器模块包括壳体，千斤顶和可移动枢转杆。当收发器模块被接收在主机端口内时，壳体可操作地电连接到机壳接地。插座被限定在壳体中并且可操作地接收屏蔽插头。枢轴杠杆被配置为允许从主机端口中移除收发器模块。此外，枢转杠杆构造成与壳体和由插座接收的屏蔽插头的导电元件电接触，使得在壳体和屏蔽插塞之间建立底盘接地。

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