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    • 1. 发明授权
    • Electromagnetic interference containment structures
    • 电磁干扰遏制结构
    • US07837399B2
    • 2010-11-23
    • US12348767
    • 2009-01-05
    • Chris TogamiGary Dean SasserKai F Ng
    • Chris TogamiGary Dean SasserKai F Ng
    • G02B6/36G02B6/12
    • G02B6/4292G02B6/4204G02B6/4246G02B6/4277H05K9/0058
    • In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.
    • 在一个示例实施例中,光电子模块包括主体,信号接地和OSA。 主体连接到机架接地并限定一个空腔,一个或多个部件设置在该空腔内。 光学子组件设置在体腔中,具有连接到信号地面的一个或多个部件,并且包括头部组件,壳体和一个或多个容纳结构。 头部组件容纳一个或多个产生EMI发射并且包括光学孔的部件。 外壳包括一个端口和一个桶。 端口限定纤维容器,并且筒限定了至少部分地容纳头部组件的空腔。 遏制结构至少部分地包含OSA内的EMI发射。
    • 2. 发明授权
    • Electromagnetic interference containment structures
    • 电磁干扰遏制结构
    • US08172469B2
    • 2012-05-08
    • US12952107
    • 2010-11-22
    • Chris TogamiGary Dean SasserKai F Ng
    • Chris TogamiGary Dean SasserKai F Ng
    • G02B6/36G02B6/12
    • G02B6/4292G02B6/4204G02B6/4246G02B6/4277H05K9/0058
    • In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.
    • 在一个示例实施例中,光电子模块包括主体,信号接地和OSA。 主体连接到机架接地并限定一个空腔,一个或多个部件设置在该空腔内。 光学子组件设置在体腔中,具有连接到信号地面的一个或多个部件,并且包括头部组件,壳体和一个或多个容纳结构。 头部组件容纳一个或多个产生EMI发射并且包括光学孔的部件。 外壳包括一个端口和一个桶。 端口限定纤维容器,并且筒限定了至少部分地容纳头部组件的空腔。 遏制结构至少部分地包含OSA内的EMI发射。
    • 3. 发明申请
    • ELECTROMAGNETIC INTEFERENCE CONTAINMENT STRUCTURES
    • 电磁固体含量结构
    • US20090175582A1
    • 2009-07-09
    • US12348767
    • 2009-01-05
    • Chris TogamiGary Dean SasserKai F. Ng
    • Chris TogamiGary Dean SasserKai F. Ng
    • G02B6/42G02B6/36H05K9/00
    • G02B6/4292G02B6/4204G02B6/4246G02B6/4277H05K9/0058
    • In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.
    • 在一个示例实施例中,光电子模块包括主体,信号接地和OSA。 主体连接到机架接地并限定一个空腔,一个或多个部件设置在该空腔内。 光学子组件设置在体腔中,具有连接到信号地面的一个或多个部件,并且包括头部组件,壳体和一个或多个容纳结构。 头部组件容纳一个或多个产生EMI发射并且包括光学孔的部件。 外壳包括一个端口和一个桶。 端口限定纤维容器,并且筒限定了至少部分地容纳头部组件的空腔。 遏制结构至少部分地包含OSA内的EMI发射。
    • 4. 发明申请
    • ELECTROMAGNETIC INTEFERENCE CONTAINMENT STRUCTURES
    • 电磁固体含量结构
    • US20110064365A1
    • 2011-03-17
    • US12952107
    • 2010-11-22
    • Chris TogamiGary Dean SasserKai F. Ng
    • Chris TogamiGary Dean SasserKai F. Ng
    • G02B6/36
    • G02B6/4292G02B6/4204G02B6/4246G02B6/4277H05K9/0058
    • In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.
    • 在一个示例实施例中,光电子模块包括主体,信号接地和OSA。 主体连接到机架接地并限定一个空腔,一个或多个部件设置在该空腔内。 光学子组件设置在体腔中,具有连接到信号地面的一个或多个部件,并且包括头部组件,壳体和一个或多个容纳结构。 头部组件容纳一个或多个产生EMI发射并且包括光学孔的部件。 外壳包括一个端口和一个桶。 端口限定纤维容器,并且筒限定了至少部分地容纳头部组件的空腔。 遏制结构至少部分地包含OSA内的EMI发射。