专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08267599B2 Optical subassembly grounding in an optoelectronic module 有权
标题翻译：光电子组件中的光子组件接地
公开(公告)号：US08267599B2
公开(公告)日：2012-09-18
申请号：US12575186
申请日：2009-10-07
申请人： Hung V. Nguyen , Yongshan Zhang , Joshua Moore
发明人： Hung V. Nguyen , Yongshan Zhang , Joshua Moore
IPC分类号： G02B6/36
CPC分类号： G02B6/4246 , G02B6/4201 , G02B6/4255 , G02B6/4267 , G02B6/4277 , G02B6/428 , G02B6/4284
摘要： Optical subassembly grounding in an optoelectronic module. In one example embodiment, a conductive OSA grounding gasket assembly includes a top gasket and a bottom gasket. The top gasket includes a top shell surface and a top OSA surface. The top shell surface is configured to be in direct physical contact with a conductive top shell of an optoelectronic module. The top OSA surface is configured to make direct physical contact with a conductive housing of an OSA. The bottom gasket includes a bottom OSA surface and a bottom shell surface. The bottom OSA surface is configured to be in direct physical contact with the conductive housing of the OSA. The bottom shell surface is configured to make direct physical contact with a conductive bottom shell of the optoelectronic module.
摘要翻译：光电子组件中的光子组件接地。在一个示例性实施例中，导电OSA接地衬垫组件包括顶垫片和底垫片。顶部垫圈包括顶部壳体表面和顶部OSA表面。顶壳表面被配置为与光电模块的导电顶壳直接物理接触。顶部OSA表面被配置为与OSA的导电外壳直接物理接触。底部垫圈包括底部OSA表面和底部壳体表面。底部OSA表面被配置为与OSA的导电外壳直接物理接触。底壳表面被配置成与光电子模块的导电底壳直接物理接触。

2. 发明申请

US20110081120A1 OPTICAL SUBASSEMBLY GROUNDING IN AN OPTOELECTRONIC MODULE 有权
标题翻译：光电子模块中的光学接收
公开(公告)号：US20110081120A1
公开(公告)日：2011-04-07
申请号：US12575186
申请日：2009-10-07
申请人： Hung V. Nguyen , Yongshan Zhang , Joshua Moore
发明人： Hung V. Nguyen , Yongshan Zhang , Joshua Moore
IPC分类号： G02B6/36
CPC分类号： G02B6/4246 , G02B6/4201 , G02B6/4255 , G02B6/4267 , G02B6/4277 , G02B6/428 , G02B6/4284
摘要： Optical subassembly grounding in an optoelectronic module. In one example embodiment, a conductive OSA grounding gasket assembly includes a top gasket and a bottom gasket. The top gasket includes a top shell surface and a top OSA surface. The top shell surface is configured to be in direct physical contact with a conductive top shell of an optoelectronic module. The top OSA surface is configured to make direct physical contact with a conductive housing of an OSA. The bottom gasket includes a bottom OSA surface and a bottom shell surface. The bottom OSA surface is configured to be in direct physical contact with the conductive housing of the OSA. The bottom shell surface is configured to make direct physical contact with a conductive bottom shell of the optoelectronic module.
摘要翻译：光电子组件中的光子组件接地。在一个示例性实施例中，导电OSA接地衬垫组件包括顶垫片和底垫片。顶部垫圈包括顶部壳体表面和顶部OSA表面。顶壳表面被配置为与光电模块的导电顶壳直接物理接触。顶部OSA表面被配置为与OSA的导电外壳直接物理接触。底部垫圈包括底部OSA表面和底部壳体表面。底部OSA表面被配置为与OSA的导电外壳直接物理接触。底壳表面被配置成与光电子模块的导电底壳直接物理接触。

3. 发明授权

US07802929B2 Monolithic shell for an optical electrical device 有权
标题翻译：用于光电器件的单片壳
公开(公告)号：US07802929B2
公开(公告)日：2010-09-28
申请号：US12246092
申请日：2008-10-06
申请人： Joshua Moore , Gary Dean Sasser , Greta Light
发明人： Joshua Moore , Gary Dean Sasser , Greta Light
IPC分类号： G02B6/36
CPC分类号： G02B6/4201 , H05K9/0047 , H05K9/0049 , H05K9/0058
摘要： An optoelectronic transceiver module. The optoelectronic module is a monolithic, one-piece module shell that includes a top portion, a bottom portion, a first side portion, a second side portion, and a front portion. The top portion, bottom portion, first side portion, second side portion and the front portion define a cavity configured to enclose electro-optical circuitry. In addition, the top portion and the bottom portion are configured such that the top portion is not separable from the bottom portion. Further, the front portion defines at least one of an optical transmit port or an optical receive port.
摘要翻译：光电收发模块。光电子模块是一体的单件模块壳体，其包括顶部，底部，第一侧部分，第二侧部分和前部。顶部，底部，第一侧部分，第二侧部分和前部部分限定了构造成包围电光电路的空腔。此外，顶部和底部构造成使得顶部不能从底部分离。此外，前部限定光发送端口或光接收端口中的至少一个。

4. 发明授权

US07566246B2 Collar clip for an electronic module 有权
标题翻译：电子模块的领子夹
公开(公告)号：US07566246B2
公开(公告)日：2009-07-28
申请号：US12038689
申请日：2008-02-27
申请人： Joshua Moore , Donald A. Ice , Chris Togami
发明人： Joshua Moore , Donald A. Ice , Chris Togami
IPC分类号： H01R13/648
CPC分类号： G02B6/4201 , G02B6/4261 , G02B6/4277 , H05K9/0058
摘要： In one example embodiment, a collar clip includes a body that is sized and configured to partially encircle a shell of an optoelectronic transceiver module. Each extended element in a pair of the extended elements is separated from the other extended element in the pair by a cavity. Each cavity is configured to receive a portion of a corresponding structure of the shell.
摘要翻译：在一个示例性实施例中，套环夹具包括主体，其尺寸和构造以部分地环绕光电收发器模块的外壳。一对延伸元件中的每个延伸元件与一对空腔中的另一个延伸元件分离。每个空腔构造成接收壳体的相应结构的一部分。

5. 发明申请

US20080248683A1 OPTOELECTRONIC MODULE RETENTION MECHANISM 有权
标题翻译：光电模块保持机制
公开(公告)号：US20080248683A1
公开(公告)日：2008-10-09
申请号：US11738373
申请日：2007-04-20
申请人： Daehwan Daniel Kim , Joshua Moore
发明人： Daehwan Daniel Kim , Joshua Moore
IPC分类号： H01R13/639 , H01R13/502
CPC分类号： H01R13/639
摘要： A retention mechanism for an electronic or optoelectronic module. In one example embodiment, an optoelectronic module retention clip includes a base, a pair of arms extending from the base, and a protrusion extending from each arm. Each protrusion is configured to engage a complementary structure defined in a de-latch slide and a complementary structure defined in an optoelectronic module shell so as to prevent motion of the de-latch slide relative to the shell when the optoelectronic module retention clip is attached to the optoelectronic module.
摘要翻译：一种用于电子或光电子模块的保持机构。在一个示例性实施例中，光电子模块保持夹包括基部，从基部延伸的一对臂和从每个臂延伸的突起。每个突起构造成接合限定在解锁滑动件中的互补结构和限定在光电子模块壳体中的互补结构，以便当光电子模块保持夹附接到...时，防止解锁滑块相对于壳体的运动光电模块。

6. 发明授权

US08218335B2 Spider clip for securing a circuit board within a communications module 有权
标题翻译：用于将电路板固定在通信模块内的蜘蛛夹
公开(公告)号：US08218335B2
公开(公告)日：2012-07-10
申请号：US12169157
申请日：2008-07-08
申请人： Joshua Moore , Stephen Todd Nelson , Hung Van Nguyen
发明人： Joshua Moore , Stephen Todd Nelson , Hung Van Nguyen
IPC分类号： H05K7/14 , H05K7/18
CPC分类号： G02B6/4246
摘要： A clip for securing a component, such as a circuit board, within a communications module is disclosed. The clip may include a flat base with legs extending therefrom and resilient springs disposed at terminal ends of each of the legs. The legs may be configured to frictionally secure the clip to the module. For instance, the legs may secure the clip to a top shell portion of the module. The springs may be configured to resiliently compress against corresponding contact zones on the circuit board when the top shell is mated with a bottom shell of the module such that the circuit board is secured in place within the module. Accordingly, embodiments of the invention enable the quick and simple assembly of modules without the need for fasteners and other time-consuming and/or labor-intensive solutions conventionally implemented to secure circuit boards and other components within the modules.
摘要翻译：公开了一种用于在通信模块内固定诸如电路板的部件的夹子。夹子可以包括具有从其延伸的腿部的平坦基部和设置在每个腿部的终端处的弹性弹簧。腿可以被配置为将夹子摩擦地固定到模块。例如，腿部可以将夹子固定到模块的顶部外壳部分。当顶壳与模块的底壳配合使得电路板固定在模块内的适当位置时，弹簧可被配置成弹性压缩电路板上相应的接触区域。因此，本发明的实施例能够快速和简单地组装模块，而不需要通常实施的紧固件和其他耗时和/或劳动密集型解决方案来确保模块内的电路板和其它部件。

7. 发明授权

US08202011B2 Printed circuit board assembly carrier for an optical electrical device 有权
标题翻译：用于光电器件的印刷电路板组装架
公开(公告)号：US08202011B2
公开(公告)日：2012-06-19
申请号：US12245976
申请日：2008-10-06
申请人： Joshua Moore
发明人： Joshua Moore
IPC分类号： G02B6/36 , G02B6/42 , H04B10/00
CPC分类号： G02B6/4201 , G02B6/4245 , G02B6/4256 , G02B6/4261 , G02B6/4277 , G02B6/428 , G02B6/4281 , G02B6/4283 , H04Q1/00 , H04Q1/20
摘要： A printed circuit board assembly (PCBA) carrier for enclosing an optical transceiver PCBA. The PCBA carrier includes a base portion including one or more first connection members, the base portion being configured to receive an optical transceiver PCBA and a top portion including one or more second connection members configured to couple to the first connection members to thereby secure the top portion to the base portion, the top portion being configured to reside above the optical transceiver PCBA when the first and second connection members are coupled. The PCBA carrier is further configured to enclose the optical transceiver PCBA when the base and top portions are coupled to provide a solid structure for the optical transceiver PCBA without the need for a separate optical transceiver module housing.
摘要翻译：用于封装光收发器PCBA的印刷电路板组件（PCBA）载体。所述PCBA载体包括包括一个或多个第一连接构件的基部，所述基部构造成接收光学收发器PCBA和顶部，所述顶部包括一个或多个第二连接构件，所述第二连接构件被配置为联接到所述第一连接构件，从而固定所述顶部所述顶部配置为当所述第一和第二连接构件联接时位于所述光收发器PCBA上方。 PCBA载体还被配置为当基部和顶部部分耦合时包围光收发器PCBA，以为光收发器PCBA提供实体结构，而不需要单独的光收发器模块外壳。

8. 发明授权

US08083415B2 Line-side out-of-band electrical interface for optoelectronic modules 有权
标题翻译：用于光电子模块的线路侧带外电接口
公开(公告)号：US08083415B2
公开(公告)日：2011-12-27
申请号：US12181484
申请日：2008-07-29
申请人： Joshua Moore , Greta Light
发明人： Joshua Moore , Greta Light
IPC分类号： G02B6/38
CPC分类号： G02B6/4201 , G02B6/4261 , G02B6/4281 , G02B6/4283 , G02B6/4292 , H05K1/147 , H05K1/189 , H05K2201/10121 , H05K2201/10446
摘要： Electrical connections from the printed circuit board (“PCB”) of an optoelectronic device through the front or line-side of the device enable a microcontroller or other component on the PCB to electrically communicate with an optical connector or other line-side device. The electrical connections can be integrated within a lead frame and trace structure providing mechanical support for the electrical connections and the PCB, with each electrical connection including a PCB-side contact and a line-side contact supported by the integrated structure. Alternately, the electrical connections can be integrated within one or more flex circuits. The optical connector can include traces and contacts configured to be electrically coupled to corresponding line-side contacts when the optical connector is received within the device.
摘要翻译：通过光电器件的印刷电路板（“PCB”）通过器件的前面或线路侧的电气连接使得微控制器或PCB上的其他部件能够与光学连接器或其他线路侧器件电连通。电连接可以集成在引线框架内，并且轨迹结构为电气连接和PCB提供机械支撑，每个电气连接包括一个PCB侧触点和由一体化结构支撑的线路侧接触。或者，电连接可以集成在一个或多个柔性电路内。光学连接器可以包括迹线和触点，其构造成当光学连接器被接收在装置内时被电耦合到相应的线侧触点。

9. 发明授权

US07643720B2 Optoelectronic module retention mechanism 有权
标题翻译：光电模块保持机制
公开(公告)号：US07643720B2
公开(公告)日：2010-01-05
申请号：US11738373
申请日：2007-04-20
申请人： Daehwan Daniel Kim , Joshua Moore
发明人： Daehwan Daniel Kim , Joshua Moore
IPC分类号： G02B6/00 , G02B6/42 , H01R13/62 , H01R4/48
CPC分类号： H01R13/639
摘要： A retention mechanism for an electronic or optoelectronic module. In one example embodiment, an optoelectronic module retention clip includes a base, a pair of arms extending from the base, and a protrusion extending from each arm. Each protrusion is configured to engage a complementary structure defined in a de-latch slide and a complementary structure defined in an optoelectronic module shell so as to prevent motion of the de-latch slide relative to the shell when the optoelectronic module retention clip is attached to the optoelectronic module.
摘要翻译：一种用于电子或光电子模块的保持机构。在一个示例性实施例中，光电子模块保持夹包括基部，从基部延伸的一对臂和从每个臂延伸的突起。每个突起构造成接合限定在解锁滑动件中的互补结构和限定在光电子模块壳体中的互补结构，以便当光电子模块保持夹附接到...时，防止解锁滑块相对于壳体的运动光电模块。

10. 发明申请

US20090148106A1 LINE-SIDE OUT-OF-BAND ELECTRICAL INTERFACE FOR OPTOELECTRONIC MODULES 有权
标题翻译：用于光电模块的线路边带电接口
公开(公告)号：US20090148106A1
公开(公告)日：2009-06-11
申请号：US12181484
申请日：2008-07-29
申请人： Joshua Moore , Greta Light
发明人： Joshua Moore , Greta Light
IPC分类号： G02B6/36 , H05K1/00
CPC分类号： G02B6/4201 , G02B6/4261 , G02B6/4281 , G02B6/4283 , G02B6/4292 , H05K1/147 , H05K1/189 , H05K2201/10121 , H05K2201/10446
摘要： Electrical connections from the printed circuit board (“PCB”) of an optoelectronic device through the front or line-side of the device enable a microcontroller or other component on the PCB to electrically communicate with an optical connector or other line-side device. The electrical connections can be integrated within a lead frame and trace structure providing mechanical support for the electrical connections and the PCB, with each electrical connection including a PCB-side contact and a line-side contact supported by the integrated structure. Alternately, the electrical connections can be integrated within one or more flex circuits. The optical connector can include traces and contacts configured to be electrically coupled to corresponding line-side contacts when the optical connector is received within the device.
摘要翻译：通过光电器件的印刷电路板（“PCB”）通过器件的前面或线路侧的电气连接使得微控制器或PCB上的其他部件能够与光学连接器或其他线路侧器件电连通。电连接可以集成在引线框架内，并且轨迹结构为电气连接和PCB提供机械支撑，每个电气连接包括一个PCB侧触点和由一体化结构支撑的线路侧接触。或者，电连接可以集成在一个或多个柔性电路内。光学连接器可以包括迹线和触点，其构造成当光学连接器被接收在装置内时被电耦合到相应的线侧触点。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式