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1. 发明授权

US08218335B2 Spider clip for securing a circuit board within a communications module 有权
标题翻译：用于将电路板固定在通信模块内的蜘蛛夹
公开(公告)号：US08218335B2
公开(公告)日：2012-07-10
申请号：US12169157
申请日：2008-07-08
申请人： Joshua Moore , Stephen Todd Nelson , Hung Van Nguyen
发明人： Joshua Moore , Stephen Todd Nelson , Hung Van Nguyen
IPC分类号： H05K7/14 , H05K7/18
CPC分类号： G02B6/4246
摘要： A clip for securing a component, such as a circuit board, within a communications module is disclosed. The clip may include a flat base with legs extending therefrom and resilient springs disposed at terminal ends of each of the legs. The legs may be configured to frictionally secure the clip to the module. For instance, the legs may secure the clip to a top shell portion of the module. The springs may be configured to resiliently compress against corresponding contact zones on the circuit board when the top shell is mated with a bottom shell of the module such that the circuit board is secured in place within the module. Accordingly, embodiments of the invention enable the quick and simple assembly of modules without the need for fasteners and other time-consuming and/or labor-intensive solutions conventionally implemented to secure circuit boards and other components within the modules.
摘要翻译：公开了一种用于在通信模块内固定诸如电路板的部件的夹子。夹子可以包括具有从其延伸的腿部的平坦基部和设置在每个腿部的终端处的弹性弹簧。腿可以被配置为将夹子摩擦地固定到模块。例如，腿部可以将夹子固定到模块的顶部外壳部分。当顶壳与模块的底壳配合使得电路板固定在模块内的适当位置时，弹簧可被配置成弹性压缩电路板上相应的接触区域。因此，本发明的实施例能够快速和简单地组装模块，而不需要通常实施的紧固件和其他耗时和/或劳动密集型解决方案来确保模块内的电路板和其它部件。

2. 发明授权

US08202011B2 Printed circuit board assembly carrier for an optical electrical device 有权
标题翻译：用于光电器件的印刷电路板组装架
公开(公告)号：US08202011B2
公开(公告)日：2012-06-19
申请号：US12245976
申请日：2008-10-06
申请人： Joshua Moore
发明人： Joshua Moore
IPC分类号： G02B6/36 , G02B6/42 , H04B10/00
CPC分类号： G02B6/4201 , G02B6/4245 , G02B6/4256 , G02B6/4261 , G02B6/4277 , G02B6/428 , G02B6/4281 , G02B6/4283 , H04Q1/00 , H04Q1/20
摘要： A printed circuit board assembly (PCBA) carrier for enclosing an optical transceiver PCBA. The PCBA carrier includes a base portion including one or more first connection members, the base portion being configured to receive an optical transceiver PCBA and a top portion including one or more second connection members configured to couple to the first connection members to thereby secure the top portion to the base portion, the top portion being configured to reside above the optical transceiver PCBA when the first and second connection members are coupled. The PCBA carrier is further configured to enclose the optical transceiver PCBA when the base and top portions are coupled to provide a solid structure for the optical transceiver PCBA without the need for a separate optical transceiver module housing.
摘要翻译：用于封装光收发器PCBA的印刷电路板组件（PCBA）载体。所述PCBA载体包括包括一个或多个第一连接构件的基部，所述基部构造成接收光学收发器PCBA和顶部，所述顶部包括一个或多个第二连接构件，所述第二连接构件被配置为联接到所述第一连接构件，从而固定所述顶部所述顶部配置为当所述第一和第二连接构件联接时位于所述光收发器PCBA上方。 PCBA载体还被配置为当基部和顶部部分耦合时包围光收发器PCBA，以为光收发器PCBA提供实体结构，而不需要单独的光收发器模块外壳。

3. 发明授权

US08083415B2 Line-side out-of-band electrical interface for optoelectronic modules 有权
标题翻译：用于光电子模块的线路侧带外电接口
公开(公告)号：US08083415B2
公开(公告)日：2011-12-27
申请号：US12181484
申请日：2008-07-29
申请人： Joshua Moore , Greta Light
发明人： Joshua Moore , Greta Light
IPC分类号： G02B6/38
CPC分类号： G02B6/4201 , G02B6/4261 , G02B6/4281 , G02B6/4283 , G02B6/4292 , H05K1/147 , H05K1/189 , H05K2201/10121 , H05K2201/10446
摘要： Electrical connections from the printed circuit board (“PCB”) of an optoelectronic device through the front or line-side of the device enable a microcontroller or other component on the PCB to electrically communicate with an optical connector or other line-side device. The electrical connections can be integrated within a lead frame and trace structure providing mechanical support for the electrical connections and the PCB, with each electrical connection including a PCB-side contact and a line-side contact supported by the integrated structure. Alternately, the electrical connections can be integrated within one or more flex circuits. The optical connector can include traces and contacts configured to be electrically coupled to corresponding line-side contacts when the optical connector is received within the device.
摘要翻译：通过光电器件的印刷电路板（“PCB”）通过器件的前面或线路侧的电气连接使得微控制器或PCB上的其他部件能够与光学连接器或其他线路侧器件电连通。电连接可以集成在引线框架内，并且轨迹结构为电气连接和PCB提供机械支撑，每个电气连接包括一个PCB侧触点和由一体化结构支撑的线路侧接触。或者，电连接可以集成在一个或多个柔性电路内。光学连接器可以包括迹线和触点，其构造成当光学连接器被接收在装置内时被电耦合到相应的线侧触点。

4. 发明授权

US07643720B2 Optoelectronic module retention mechanism 有权
标题翻译：光电模块保持机制
公开(公告)号：US07643720B2
公开(公告)日：2010-01-05
申请号：US11738373
申请日：2007-04-20
申请人： Daehwan Daniel Kim , Joshua Moore
发明人： Daehwan Daniel Kim , Joshua Moore
IPC分类号： G02B6/00 , G02B6/42 , H01R13/62 , H01R4/48
CPC分类号： H01R13/639
摘要： A retention mechanism for an electronic or optoelectronic module. In one example embodiment, an optoelectronic module retention clip includes a base, a pair of arms extending from the base, and a protrusion extending from each arm. Each protrusion is configured to engage a complementary structure defined in a de-latch slide and a complementary structure defined in an optoelectronic module shell so as to prevent motion of the de-latch slide relative to the shell when the optoelectronic module retention clip is attached to the optoelectronic module.
摘要翻译：一种用于电子或光电子模块的保持机构。在一个示例性实施例中，光电子模块保持夹包括基部，从基部延伸的一对臂和从每个臂延伸的突起。每个突起构造成接合限定在解锁滑动件中的互补结构和限定在光电子模块壳体中的互补结构，以便当光电子模块保持夹附接到...时，防止解锁滑块相对于壳体的运动光电模块。

5. 发明申请

US20090148106A1 LINE-SIDE OUT-OF-BAND ELECTRICAL INTERFACE FOR OPTOELECTRONIC MODULES 有权
标题翻译：用于光电模块的线路边带电接口
公开(公告)号：US20090148106A1
公开(公告)日：2009-06-11
申请号：US12181484
申请日：2008-07-29
申请人： Joshua Moore , Greta Light
发明人： Joshua Moore , Greta Light
IPC分类号： G02B6/36 , H05K1/00
CPC分类号： G02B6/4201 , G02B6/4261 , G02B6/4281 , G02B6/4283 , G02B6/4292 , H05K1/147 , H05K1/189 , H05K2201/10121 , H05K2201/10446
摘要： Electrical connections from the printed circuit board (“PCB”) of an optoelectronic device through the front or line-side of the device enable a microcontroller or other component on the PCB to electrically communicate with an optical connector or other line-side device. The electrical connections can be integrated within a lead frame and trace structure providing mechanical support for the electrical connections and the PCB, with each electrical connection including a PCB-side contact and a line-side contact supported by the integrated structure. Alternately, the electrical connections can be integrated within one or more flex circuits. The optical connector can include traces and contacts configured to be electrically coupled to corresponding line-side contacts when the optical connector is received within the device.
摘要翻译：通过光电器件的印刷电路板（“PCB”）通过器件的前面或线路侧的电气连接使得微控制器或PCB上的其他部件能够与光学连接器或其他线路侧器件电连通。电连接可以集成在引线框架内，并且轨迹结构为电气连接和PCB提供机械支撑，每个电气连接包括一个PCB侧触点和由一体化结构支撑的线路侧接触。或者，电连接可以集成在一个或多个柔性电路内。光学连接器可以包括迹线和触点，其构造成当光学连接器被接收在装置内时被电耦合到相应的线侧触点。

6. 发明申请

US20080232067A1 MECHANISMS FOR HEAT TRANSFER IN AN OPTICAL TRANSCEIVER MODULE AND CARD CAGE SYSTEM 有权
标题翻译：光学收发器模块和卡片系统中传输的机制
公开(公告)号：US20080232067A1
公开(公告)日：2008-09-25
申请号：US12052596
申请日：2008-03-20
申请人： Charles Steven Joiner , Joshua Moore
发明人： Charles Steven Joiner , Joshua Moore
IPC分类号： H05K7/20
CPC分类号： H05K7/20418 , H05K7/20445
摘要： Mechanisms and systems for dissipating heat from an optical transceiver module to a module card cage system. In one embodiment, a thermal conductive label having at least one raised portion is attached to a surface of the module. The raised portion is configured to contact at least a portion of the card cage to dissipate heat from the module to the card cage. In another embodiment, the card cage has a protruding depression formed on a part of its surface that is above a slot configured to receive an optical transceiver module. The protruding depression is configured to contact at least a portion of the module to dissipate heat from the module to the card cage.
摘要翻译：从光收发器模块向模块卡笼系统散热的机构和系统。在一个实施例中，具有至少一个凸起部分的导热标签附接到模块的表面。凸起部分构造成接触卡笼的至少一部分以将热量从模块散发到卡笼。在另一个实施例中，卡笼具有形成在其表面的一部分上的突出凹陷，该凹陷在配置成接收光收发器模块的槽的上方。突出的凹陷构造成接触模块的至少一部分以将热量从模块散发到卡笼。

7. 发明申请

US20080205896A1 POSITIONING PLATE FOR OPTICAL SUBASSEMBLY 有权
标题翻译：定位板用于光学分层
公开(公告)号：US20080205896A1
公开(公告)日：2008-08-28
申请号：US12039598
申请日：2008-02-28
申请人： Joshua Moore , Donald A. Ice , Chris Togami
发明人： Joshua Moore , Donald A. Ice , Chris Togami
IPC分类号： H04B10/00
CPC分类号： G02B6/4201 , G02B6/4256 , G02B6/4261
摘要： In one example, an optical subassembly positioning plate is provided that includes a substantially flat body that defines at least one edge. A port is defined in the body. The port is configured to receive and secure an optical subassembly in an x-direction and a y-direction when said optical subassembly positioning plate is positioned within an optoelectronic transceiver module. A plurality of fingers is defined along at least one edge of the body. Each of the plurality of fingers is configured to contact a shell of the optoelectronic transceiver module so as to bias a flange of the optical subassembly against a portion of the shell of the optoelectronic transceiver module such that the optical subassembly is substantially retained in a z-direction when the optical subassembly positioning plate is positioned within the optoelectronic transceiver module.
摘要翻译：在一个示例中，提供了光学子组件定位板，其包括限定至少一个边缘的基本平坦的主体。一个端口在机体中定义。端口被配置为当所述光学子组件定位板位于光电收发器模块内时，在x方向和y方向上接收和固定光学子组件。沿着身体的至少一个边缘限定多个手指。多个指状物中的每一个构造成接触光电收发器模块的壳体，以便将光学子组件的凸缘抵靠光电收发器模块的壳体的一部分偏置，使得光学子组件基本上保持在z- 光学子组件定位板位于光电收发模块内时的方向。

8. 发明申请

US20080205893A1 ANGULAR SEAM FOR AN ELECTRONIC MODULE 有权
标题翻译：电子模块的角度
公开(公告)号：US20080205893A1
公开(公告)日：2008-08-28
申请号：US12038721
申请日：2008-02-27
申请人： Joshua Moore
发明人： Joshua Moore
IPC分类号： H04B10/00
CPC分类号： G02B6/4201 , G02B6/4256 , G02B6/4261
摘要： In one example embodiment, an angular seam includes a first complementary structure defined in a first shell of an optoelectronic transceiver module, and a second complementary structure defined in a second shell of the optoelectronic transceiver module. The second complementary structure is configured to receive the first complementary structure so that an angular seam is defined that is substantially non-transmissive to electromagnetic radiation.
摘要翻译：在一个示例性实施例中，角缝包括限定在光电收发器模块的第一壳体中的第一互补结构，以及限定在光电收发器模块的第二壳体中的第二互补结构。第二互补结构被配置为接收第一互补结构，使得限定对电磁辐射基本上不透射的角缝。

9. 发明授权

US08267599B2 Optical subassembly grounding in an optoelectronic module 有权
标题翻译：光电子组件中的光子组件接地
公开(公告)号：US08267599B2
公开(公告)日：2012-09-18
申请号：US12575186
申请日：2009-10-07
申请人： Hung V. Nguyen , Yongshan Zhang , Joshua Moore
发明人： Hung V. Nguyen , Yongshan Zhang , Joshua Moore
IPC分类号： G02B6/36
CPC分类号： G02B6/4246 , G02B6/4201 , G02B6/4255 , G02B6/4267 , G02B6/4277 , G02B6/428 , G02B6/4284
摘要： Optical subassembly grounding in an optoelectronic module. In one example embodiment, a conductive OSA grounding gasket assembly includes a top gasket and a bottom gasket. The top gasket includes a top shell surface and a top OSA surface. The top shell surface is configured to be in direct physical contact with a conductive top shell of an optoelectronic module. The top OSA surface is configured to make direct physical contact with a conductive housing of an OSA. The bottom gasket includes a bottom OSA surface and a bottom shell surface. The bottom OSA surface is configured to be in direct physical contact with the conductive housing of the OSA. The bottom shell surface is configured to make direct physical contact with a conductive bottom shell of the optoelectronic module.
摘要翻译：光电子组件中的光子组件接地。在一个示例性实施例中，导电OSA接地衬垫组件包括顶垫片和底垫片。顶部垫圈包括顶部壳体表面和顶部OSA表面。顶壳表面被配置为与光电模块的导电顶壳直接物理接触。顶部OSA表面被配置为与OSA的导电外壳直接物理接触。底部垫圈包括底部OSA表面和底部壳体表面。底部OSA表面被配置为与OSA的导电外壳直接物理接触。底壳表面被配置成与光电子模块的导电底壳直接物理接触。

10. 发明申请

US20110081120A1 OPTICAL SUBASSEMBLY GROUNDING IN AN OPTOELECTRONIC MODULE 有权
标题翻译：光电子模块中的光学接收
公开(公告)号：US20110081120A1
公开(公告)日：2011-04-07
申请号：US12575186
申请日：2009-10-07
申请人： Hung V. Nguyen , Yongshan Zhang , Joshua Moore
发明人： Hung V. Nguyen , Yongshan Zhang , Joshua Moore
IPC分类号： G02B6/36
CPC分类号： G02B6/4246 , G02B6/4201 , G02B6/4255 , G02B6/4267 , G02B6/4277 , G02B6/428 , G02B6/4284
摘要： Optical subassembly grounding in an optoelectronic module. In one example embodiment, a conductive OSA grounding gasket assembly includes a top gasket and a bottom gasket. The top gasket includes a top shell surface and a top OSA surface. The top shell surface is configured to be in direct physical contact with a conductive top shell of an optoelectronic module. The top OSA surface is configured to make direct physical contact with a conductive housing of an OSA. The bottom gasket includes a bottom OSA surface and a bottom shell surface. The bottom OSA surface is configured to be in direct physical contact with the conductive housing of the OSA. The bottom shell surface is configured to make direct physical contact with a conductive bottom shell of the optoelectronic module.
摘要翻译：光电子组件中的光子组件接地。在一个示例性实施例中，导电OSA接地衬垫组件包括顶垫片和底垫片。顶部垫圈包括顶部壳体表面和顶部OSA表面。顶壳表面被配置为与光电模块的导电顶壳直接物理接触。顶部OSA表面被配置为与OSA的导电外壳直接物理接触。底部垫圈包括底部OSA表面和底部壳体表面。底部OSA表面被配置为与OSA的导电外壳直接物理接触。底壳表面被配置成与光电子模块的导电底壳直接物理接触。

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