会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 32. 发明授权
    • Manufacturing method for solar cell
    • 太阳能电池制造方法
    • US08460965B2
    • 2013-06-11
    • US13124529
    • 2009-10-15
    • Hirohisa TakahashiSatoru IshibashiKyuzo Nakamura
    • Hirohisa TakahashiSatoru IshibashiKyuzo Nakamura
    • H01L21/00
    • H01L31/02366H01L31/022466H01L31/1884Y02E10/50
    • A manufacturing method for a solar cell including an upper electrode extracting an electrode at an incident light side, the upper electrode including a transparent conductive film, a basic structural element of the transparent conductive film being any one of an indium (In), a zinc (Zn), and tin (Sn), the manufacturing method including: a step A forming a texture on a front surface of a transparent substrate using a wet etching method, the transparent conductive film being formed on the transparent substrate, wherein in the step A, when the texture is formed, a metal thin film is formed on the transparent substrate, and an anisotropic etching is performed with the metal thin film being a mask.
    • 一种太阳能电池的制造方法,其特征在于,包括在入射光侧提取电极的上部电极,所述上部电极包括透明导电膜,所述透明导电膜的基本结构元素为铟(In),锌 (Zn)和锡(Sn),所述制造方法包括:步骤A,其使用湿式蚀刻方法在透明基板的正面上形成纹理,所述透明导电膜形成在所述透明基板上,其中,在所述工序 如图A所示,当形成纹理时,在透明基板上形成金属薄膜,以金属薄膜为掩模进行各向异性蚀刻。
    • 34. 发明授权
    • Method for forming tantalum nitride film
    • 形成氮化钽膜的方法
    • US08105468B2
    • 2012-01-31
    • US11885341
    • 2006-03-03
    • Narishi GonoheSatoru ToyodaHarunori UshikawaTomoyasu KondoKyuzo Nakamura
    • Narishi GonoheSatoru ToyodaHarunori UshikawaTomoyasu KondoKyuzo Nakamura
    • C23C14/00C23C14/34
    • H01L21/76859C23C16/34H01L21/28562H01L21/76843
    • A tantalum nitride film-forming method comprises the steps of introducing, into a vacuum chamber, a raw gas consisting of a coordination compound constituted by elemental Ta having a coordinated ligand represented by the general formula: N═(R,R′) (in the formula, R and R′ may be the same or different and each represents an alkyl group having 1 to 6 carbon atoms) to thus adsorb the gas on a substrate; then introducing an NH3 gas and then activated H radicals derived from a reactant gas into a vacuum chamber to thus remove the R(R′) groups bonded to the nitrogen atom present in the reaction product through cleavage, and to thus form a tantalum nitride film rich in tantalum atoms. The resulting tantalum nitride film has a low resistance, low contents of C and N atoms, and a high compositional ratio: Ta/N, can ensure sufficiently high adherence to the distributing wire-forming film and can thus be useful as a barrier film. Moreover, tantalum particles are implanted in the resulting film according to the sputtering technique to thus further enrich the film with tantalum.
    • 氮化钽膜形成方法包括以下步骤:将真空气体引入真空室中,所述原料气体由具有由以下通式表示的配位配体的元素Ta组成的配位化合物组成:N =(R,R')(在 式R和R'可以相同或不同,各自表示碳原子数为1〜6的烷基),从而将气体吸附在基板上; 然后引入NH 3气体,然后将来自反应气体的H自由基活化到真空室中,从而通过裂解除去与反应产物中存在的氮原子键合的R(R')基团,从而形成氮化钽膜 富含钽原子。 所得到的氮化钽膜具有低电阻,C原子和N原子含量低,组成比高:Ta / N可以确保足够高的附着线分布线形成膜,因此可用作阻挡膜。 此外,根据溅射技术将钽颗粒注入到所得的膜中,从而进一步用钽富集膜。
    • 38. 发明申请
    • VACUUM VAPOR PROCESSING APPARATUS
    • 真空蒸汽加工设备
    • US20100012035A1
    • 2010-01-21
    • US12440635
    • 2007-09-10
    • Hiroshi NagataKyuzo NakamuraTakeo KatouAtsushi NakatsukaIchirou MukaeMasami ItouRyou YoshiizumiYoshinori Shingaki
    • Hiroshi NagataKyuzo NakamuraTakeo KatouAtsushi NakatsukaIchirou MukaeMasami ItouRyou YoshiizumiYoshinori Shingaki
    • C23C14/14C23C14/24
    • C23C14/24H01F41/0293
    • There is provided a vacuum evaporating apparatus which is suitable for performing a process in which a metal vapor atmosphere is formed in a processing chamber, the metal atoms in this metal vapor atmosphere are caused to be adhered to the surface of an object to be processed, and the metal atoms adhered to the surface of the object to be processed are diffused into grain boundary phases thereof. The apparatus comprises: a processing furnace (11); at least one processing box (4) disposed inside the processing furnace; and a heating means (2) provided inside the processing furnace so as to enclose the processing box. An evacuating means is provided which, after housing the processing box inside the processing furnace in a state in which the object to be processed (S) and the metal evaporating material (V) are disposed in the processing box, reduces the processing furnace and the processing box to a predetermined pressure and keep them at that pressure. The heating means is operated in the reduced pressure to evaporate the metal evaporating material while increasing the object to be processed to a predetermined temperature. The evaporated metal atoms are supplied to the surface of the object to be processed.
    • 提供了一种真空蒸发装置,其适于进行在处理室中形成金属蒸汽气氛的过程,使金属蒸气气氛中的金属原子粘附到待处理物体的表面, 并且附着在待处理物体表面的金属原子扩散到其晶界相。 该装置包括:加工炉(11); 设置在处理炉内的至少一个处理箱(4) 以及设置在处理炉内部以包围处理盒的加热装置(2)。 本发明提供一种排气装置,其特征在于,处理炉内处理箱内处理箱体(S)和金属蒸发材料(V)的状态被设置在处理箱内时,将加工炉和 处理箱到预定的压力并保持在该压力下。 加热装置在减压下操作以蒸发金属蒸发材料,同时将待处理物体增加到预定温度。 蒸发的金属原子被供应到待处理物体的表面。