专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明申请

US20060012921A1 Carriage assembly of a hard disk drive 失效
标题翻译：一个硬盘驱动器的支架装配
公开(公告)号：US20060012921A1
公开(公告)日：2006-01-19
申请号：US10990139
申请日：2004-11-16
申请人： Takashi Kubota , Kenji Kobae
发明人： Takashi Kubota , Kenji Kobae
IPC分类号： G11B5/48 , G11B21/16 , G11B5/55 , G11B21/08
CPC分类号： H05K3/361 , G11B5/4833 , G11B5/484 , G11B5/4846 , G11B5/486 , H05K1/056 , H05K3/0058 , H05K3/328 , H05K3/386 , H05K2201/0969 , H05K2201/2009 , H05K2201/2036 , H05K2203/0285
摘要： A carriage assembly of a hard disk drive is constructed so that the bonding of flying leads of a long tail suspension circuit board and bonding terminals of a flexible printed circuit board can be carried out uniformly and reliably, and the problem of the flying leads breaking when the flying leads are pulled off the bonding terminals does not occur. The flexible printed circuit board is attached to a reinforced part by an adhesive in which spacers with a substantially equal particle diameter are mixed, and the flying leads and the bonding terminals are bonded together by ultrasonic bonding by applying ultrasonic vibration in a state where the flying leads are pressed onto the bonding terminals. In addition, an insulating film is provided on an opposite surface of the flying leads to the surface bonded to the bonding terminals, and during the ultrasonic bonding, ultrasonic vibration is applied in a state where the flying leads are pressed via the insulating film onto the bonding terminals.
摘要翻译：构造硬盘驱动器的托架组件，使得长尾悬挂电路板的飞行引线和柔性印刷电路板的接合端子的接合能够均匀可靠地进行，并且飞行的问题导致断开的问题飞行引线被拔出不会发生接合端子。柔性印刷电路板通过粘合剂附着到增强部分，其中混合具有基本相同粒径的间隔物，并且飞行引线和接合端子通过超声波接合通过在飞行引线被压在接合端子上。另外，在与引导接合端子接合的表面的飞线的相对面上设置绝缘膜，在超声波接合期间，通过绝缘膜将飞行引线按压的状态下，施加超声波振动接合端子。

32. 发明授权

US07385788B2 Carriage assembly of a hard disk drive 失效
标题翻译：一个硬盘驱动器的支架装配
公开(公告)号：US07385788B2
公开(公告)日：2008-06-10
申请号：US10990139
申请日：2004-11-16
申请人： Takashi Kubota , Kenji Kobae
发明人： Takashi Kubota , Kenji Kobae
IPC分类号： G11B21/21 , G11B5/48
CPC分类号： H05K3/361 , G11B5/4833 , G11B5/484 , G11B5/4846 , G11B5/486 , H05K1/056 , H05K3/0058 , H05K3/328 , H05K3/386 , H05K2201/0969 , H05K2201/2009 , H05K2201/2036 , H05K2203/0285
摘要： A carriage assembly of a hard disk drive is constructed so that the bonding of flying leads of a long tail suspension circuit board and bonding terminals of a flexible printed circuit board can be carried out uniformly and reliably, and the problem of the flying leads breaking when the flying leads are pulled off the bonding terminals does not occur. The flexible printed circuit board is attached to a reinforced part by an adhesive in which spacers with a substantially equal particle diameter are mixed, and the flying leads and the bonding terminals are bonded together by ultrasonic bonding by applying ultrasonic vibration in a state where the flying leads are pressed onto the bonding terminals. In addition, an insulating film is provided on an opposite surface of the flying leads to the surface bonded to the bonding terminals, and during the ultrasonic bonding, ultrasonic vibration is applied in a state where the flying leads are pressed via the insulating film onto the bonding terminals.
摘要翻译：构造硬盘驱动器的托架组件，使得长尾悬挂电路板的飞行引线和柔性印刷电路板的接合端子的接合能够均匀可靠地进行，并且飞行的问题导致断开的问题飞行引线被拔出不会发生接合端子。柔性印刷电路板通过粘合剂附着到增强部分，其中混合具有基本相同粒径的间隔物，并且飞行引线和接合端子通过超声波接合通过在飞行引线被压在接合端子上。另外，在与引导接合端子接合的表面的飞线的相对面上设置绝缘膜，在超声波接合期间，通过绝缘膜将飞行引线按压的状态下，施加超声波振动接合端子。

33. 发明授权

US07367108B2 Method of bonding flying leads 失效
标题翻译：拼接飞线的方法
公开(公告)号：US07367108B2
公开(公告)日：2008-05-06
申请号：US11391362
申请日：2006-03-29
申请人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
发明人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
IPC分类号： B23K20/10
CPC分类号： B23K20/10 , B23K2101/32 , H05K3/26 , H05K3/328 , Y10T29/49027 , Y10T29/4903
摘要： A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality of substrate pads disposed in parallel and a bonding tool applies ultrasonic vibration to the flying leads to bond the respective substrate pads and the flying leads. Bonding is carried out using a bonding tool in which (at least one contact member) a plurality of contact members that contact(s) the flying leads and apply (applies) the ultrasonic vibration thereto are (is) rotatably supported. The bonding tool is moved in a direction so as to cross the flying leads disposed in parallel with the plurality of contact members (at least one contact member) rolling while in contact with the flying leads, and the ultrasonic vibration is applied from the plurality of contact members (at least one contact member) to the flying leads to ultrasonically bond the respective flying leads to the substrate pads.
摘要翻译：结合飞行引线的方法在飞行引线和衬底焊盘之间产生可靠的结合，并且可以使用焊接工具有效地结合多个飞行引线和多个衬底焊盘。飞行引线分别与平行设置的多个基板焊盘对准，并且焊接工具对飞行引线施加超声波振动以将相应的基板焊盘和飞行引线接合。使用接合工具进行接合，其中（至少一个接触构件）多个接触飞行引线并且施加（施加）超声波振动的接触构件被可旋转地支撑。接合工具沿与多个接触构件（至少一个接触构件）平行布置的飞行导线与飞行导线接触的方向移动，并且从多个接触构件对飞行的接触构件（至少一个接触构件）导致将相应的飞行引线超声波地结合到衬底焊盘。

34. 发明授权

US07134588B2 Bonding tool for ultrasonic bonding and method of ultrasonic bonding 失效
公开(公告)号：US07134588B2
公开(公告)日：2006-11-14
申请号：US11019623
申请日：2004-12-23
申请人： Kenji Kobae , Takashi Kubota
发明人： Kenji Kobae , Takashi Kubota
IPC分类号： B23K1/06 , B23K5/20 , B32B37/00
CPC分类号： H01L24/81 , B23K20/10 , B23K20/106 , B23K2101/42 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/81205 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2224/0401
摘要： Changes in the form of a pressure welding part of a bonding tool for ultrasonic bonding due to abrasion of the pressure welding part and/or accumulation of foreign matter, such as plating material, on the pressure welding part during use of the bonding tool are prevented, so that the bonding tool can carry out ultrasonic bonding stably. A plurality of protrusions with curved outer surfaces are formed on the pressure welding part that contacts the bonded part during ultrasonic bonding. The protrusions can be formed with spherical outer surfaces by forming concave grooves in a grid in an end surface of the bonding tool and then sandblasting the end surface of the bonding tool.

35. 发明申请

US20060012920A1 Carriage assembly of a hard disk drive and method of manufacturing the same 失效
标题翻译：硬盘驱动器的支架组装及其制造方法
公开(公告)号：US20060012920A1
公开(公告)日：2006-01-19
申请号：US10997005
申请日：2004-11-24
申请人： Kenji Kobae , Takashi Kubota
发明人： Kenji Kobae , Takashi Kubota
IPC分类号： G11B5/48
CPC分类号： G11B5/486 , G11B5/4833 , G11B5/4846 , H05K1/056 , H05K3/363 , H05K2201/0394 , H05K2201/0969 , H05K2203/0285 , Y10T29/49025 , Y10T29/49027 , Y10T29/4903
摘要： A carriage assembly of a hard disk drive, and a manufacturing apparatus for the same are not susceptible to problems such as flying leads breaking and resin residue being deposited on bonding terminals when the flying leads of a long tail suspension circuit board are pulled off the bonding terminals of a flexible printed circuit board. The flying leads of the long tail suspension circuit board and the bonding terminals of the flexible printed circuit board are ultrasonically bonded together by placing an ultrasonic tool in contact with opposite surfaces of the flying leads to the surfaces that are bonded to the bonding terminals and applying ultrasonic vibration from the ultrasonic tool in a state where the flying leads are pressed onto the bonding terminals. Coating layers composed of a thermally meltable metal that melts at a lower temperature than the material forming the bonding surfaces are respectively formed on the opposite surfaces of the flying leads.
摘要翻译：硬盘驱动器的托架组件及其制造装置不容易受到长尾悬挂电路板的飞行引线从接合处脱离而导致断线和树脂残留物沉积在接合端子上的问题柔性印刷电路板的端子。将长尾悬挂电路板的飞线和柔性印刷电路板的接合端子超声波接合在一起，将超声波工具与飞行引线的相对表面接触到与接合端子接合的表面并施加超声波振动来自超声波工具，其中飞行引线被压在接合端子上。由在比形成接合面的材料低的温度下熔化的可热熔融金属组成的涂层分别形成在飞线的相对表面上。

36. 发明授权

US07670873B2 Method of flip-chip mounting 有权
标题翻译：倒装芯片安装方法
公开(公告)号：US07670873B2
公开(公告)日：2010-03-02
申请号：US11435851
申请日：2006-05-18
申请人： Kimio Nakamura , Kenji Kobae , Takashi Kubota
发明人： Kimio Nakamura , Kenji Kobae , Takashi Kubota
IPC分类号： H01L21/00 , H01L21/44
CPC分类号： H01L24/75 , H01L24/83 , H01L24/90 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/75304 , H01L2224/75744 , H01L2224/83139 , H01L2224/8314 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/3511 , H01L2924/00
摘要： A method of flip-chip mounting can reliably and stably mount a semiconductor chip to a mounting substrate while avoiding problems such as damage to the semiconductor chip due to a difference in thermal expansion coefficients between the semiconductor chip and the mounting substrate. The method of flip-chip mounting a semiconductor chip supports a mounting substrate on a stage in a state where a resin material has been supplied onto a chip mounting surface of the mounting substrate and presses the semiconductor chip toward the mounting substrate using a pressure/heat applying head to bond the semiconductor chip to the mounting substrate and thermally harden the resin material. A concave part is provided in a support surface of the stage that supports the semiconductor chip, and the semiconductor chip is bonded to the mounting substrate by pressing the semiconductor chip toward the mounting substrate using the pressure/heat applying head in a state where the mounting substrate is bent toward the concave part.
摘要翻译：一种倒装芯片安装方法可以可靠且稳定地将半导体芯片安装到安装基板，同时避免由于半导体芯片和安装基板之间的热膨胀系数的差异而导致对半导体芯片的损坏等问题。半导体芯片的倒装芯片的安装方法在将树脂材料供给到安装基板的芯片安装面上的状态下，将载置基板支撑在载台上，并使用压力/热量将半导体芯片朝向安装基板施加头部以将半导体芯片粘合到安装基板上并使树脂材料热硬化。在支撑半导体芯片的载物台的支撑面上设置有凹部，半导体芯片通过使用压力/加热头将半导体芯片压向安装基板而与安装基板接合，基板向凹部弯曲。

37. 发明授权

US07356907B2 Method of manufacturing a carriage assembly of a hard disk drive 失效
标题翻译：制造硬盘驱动器的托架组件的方法
公开(公告)号：US07356907B2
公开(公告)日：2008-04-15
申请号：US10997005
申请日：2004-11-24
申请人： Kenji Kobae , Takashi Kubota
发明人： Kenji Kobae , Takashi Kubota
IPC分类号： G11B5/127 , H04R31/00
CPC分类号： G11B5/486 , G11B5/4833 , G11B5/4846 , H05K1/056 , H05K3/363 , H05K2201/0394 , H05K2201/0969 , H05K2203/0285 , Y10T29/49025 , Y10T29/49027 , Y10T29/4903
摘要： A method of manufacturing a cartridge assembly of a hard disk drive, including a step of forming a part of a wiring circuit into flying leads and a step of forming a coating layer on the respective opposite surfaces of the bonding surfaces of the flying leads, which will be connected to bonding terminals of a flexible printed circuit board. The method also includes a step of placing an ultrasonic tool in contact with the opposite surfaces of the flying leads via the coating layers, and applying ultrasonic vibration from the ultrasonic tool in a state where the flying leads are pressed onto the bonding terminals to ultrasonically bond the flying leads and the bonding terminals together. Additionally, the method includes a step of heating and melting the coating layers to smooth surfaces of the coating layers that have been roughened by contact with the ultrasonic tool during ultrasonic bonding.
摘要翻译：一种制造硬盘驱动器的盒组件的方法，包括将布线电路的一部分形成为飞行引线的步骤以及在飞线的接合表面的相应相对表面上形成涂层的步骤，其中将连接到柔性印刷电路板的接合端子。该方法还包括将超声波工具经由涂层与飞线的相对表面接触的步骤，以及在将飞行引线按压到接合端子上以超声波接合的状态下从超声波工具施加超声波振动飞线和接合端子在一起。此外，该方法包括以下步骤：在超声波接合期间，通过与超声波工具的接触使加热和熔化涂层以平滑已经被粗糙化的涂层的表面。

38. 发明申请

US20070141825A1 Method of bonding flying leads 失效
标题翻译：拼接飞线的方法
公开(公告)号：US20070141825A1
公开(公告)日：2007-06-21
申请号：US11359426
申请日：2006-02-23
申请人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
发明人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
IPC分类号： H01L21/44
CPC分类号： H01L21/4853
摘要： The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: mechanically processing the board so as to form projections, which act as margins for deformation, in boding faces of the pads, on each of which the flying lead will be bonded, positioning the flying leads to correspond to the pads; and applying supersonic vibrations to a bonding tool so as to deform and crush the projections, whereby the flying leads are respectively bonded to the pads.
摘要翻译：接合飞线的方法能够有效地使飞线与板的焊盘超音速粘接，并提高其间的接合可靠性。该方法包括以下步骤：机械地处理板，以便形成凸起，其作为变形的边缘，在焊盘的焊接面中，每个引导面将被接合，将飞行引线定位成对应于垫子以及对接合工具施加超音速振动以使突起变形和压碎，由此将飞行引线分别接合到焊盘。

39. 发明授权

US08299925B2 RFID tag and manufacturing method thereof 有权
标题翻译： RFID标签及其制造方法
公开(公告)号：US08299925B2
公开(公告)日：2012-10-30
申请号：US12180117
申请日：2008-07-25
申请人： Hiroshi Kobayashi , Kenji Kobae
发明人： Hiroshi Kobayashi , Kenji Kobae
IPC分类号： G08B13/14 , H01R43/00 , B44C1/165 , H01L23/02 , H01L23/52
CPC分类号： G06K19/07745 , G06K19/072 , G06K19/07749 , G06K19/0775 , H01L24/81 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/14 , Y10T29/49018 , Y10T29/49117 , Y10T29/49155 , H01L2924/00
摘要： The RFID tag has a base sheet having a recess, a first element provided on the base sheet astride the recess, a second element which is provided between the first element and the base sheet and which is electrically connected to the first element, and a communication antenna which is provided on the base sheet and which is connected to at least any of the first element and the second element.
摘要翻译：所述RFID标签具有基片，所述基片具有凹部，所述第一元件跨越所述凹部设置在所述基片上，所述第二元件设置在所述第一元件与所述基片之间，并且与所述第一元件电连接，天线，其设置在基片上并且连接到第一元件和第二元件中的至少任一个。

40. 发明授权

US07394163B2 Method of mounting semiconductor chip 失效
标题翻译：安装半导体芯片的方法
公开(公告)号：US07394163B2
公开(公告)日：2008-07-01
申请号：US10187843
申请日：2002-07-03
申请人： Shunji Baba , Takatoyo Yamakami , Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi
发明人： Shunji Baba , Takatoyo Yamakami , Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/563 , H01L21/67092 , H01L21/67144 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75743 , H01L2224/81191 , H01L2224/81205 , H01L2224/81801 , H01L2224/83192 , H01L2224/83859 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/83885 , H01L2224/83951 , H01L2224/85444 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/05599
摘要： A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays 108 are emitted so as to harden the peripheral portion 151a of the adhesive 151 spread out between the head IC chip 11 and the suspension 12.
摘要翻译：通过用作底层填充剂的粘合剂填充芯片和基板之间的间隙来安装半导体芯片的方法，其中安装IC芯片。底部填充物的圆角被制成具有优选的形状。为了实现这一点，将具有凸块的头IC芯片放置在被底部填充胶粘剂覆盖的悬挂上，并设置有垫。接合工具按压头IC芯片并对头IC芯片施加超声波振荡，使得凸块适当地粘合到焊盘。当头部IC芯片被按压并进行超声波振荡时，发射紫外线108以使在头IC芯片11和悬架12之间展开的粘合剂151的周边部分151a硬化。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式