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    • 31. 发明授权
    • Solid-state imaging device
    • 固态成像装置
    • US06943389B2
    • 2005-09-13
    • US10669421
    • 2003-09-25
    • Tetsuya YamaguchiRyohei MiyagawaYoshitaka Egawa
    • Tetsuya YamaguchiRyohei MiyagawaYoshitaka Egawa
    • H01L27/146H04N5/225H04N5/335H04N5/361H04N5/369H04N5/374H01L27/148
    • H01L27/14609H01L27/14603H01L27/14643H04N5/2251H04N5/335H04N5/365H04N5/3745H04N5/37457
    • A solid-state imaging device comprises an image pickup unit having unit cells including opto-electrical converter elements, said unit cells being disposed in a two-dimensional array, a selection line made of polysilicon for selectively determining the unit cells in the same row within the image pickup unit, a read-out line made of polysilicon for reading out an electric charge accumulated in the opto-electrical converter elements of the unit cells in the same row within the image pickup unit, a signal line transmitting pixel signals produced from the unit cells in the same row within the image pickup unit, a reset line made of polysilicon for discharging the unit cells in the same row within the image pickup unit down to a desired voltage level, a driver circuit located on one side of the image pickup unit for supplying drive signals to the read-out line, the selection line, and the reset line, respectively, and a read-out auxiliary wiring disposed along at least the read-out line and electrically connected to the read-out line at a plurality of junctions, the read-out auxiliary wiring being of comparatively lower electric resistivity than the read-out line.
    • 固态成像装置包括具有包括光电转换器元件的单位单元的图像拾取单元,所述单位单元以二维阵列布置,由多晶硅制成的选择线,用于选择性地确定在同一行内的单元电池内 图像拾取单元,由多晶硅制成的读出线,用于读出积累在图像拾取单元内的同一行的单位单元的光电转换元件中的电荷;信号线, 在图像拾取单元内的相同行中的单位单元,由多晶硅制成的复位线,用于将图像拾取单元内的同一行中的单位单元放电至期望的电压电平,位于图像拾取器一侧的驱动器电路 分别向读出线,选择线和复位线提供驱动信号的单元,以及至少沿着读出线设置的读出辅助布线,以及 在多个接合处电连接到读出线,读出的辅助布线具有比读出的线更低的电阻率。
    • 35. 发明授权
    • Solid-state image pickup device
    • 固态图像拾取装置
    • US07859587B2
    • 2010-12-28
    • US11723459
    • 2007-03-20
    • Motonari KatsunoRyohei Miyagawa
    • Motonari KatsunoRyohei Miyagawa
    • H04N5/225
    • H04N5/335
    • In a solid-state image pickup device, it is difficult to match an optimum incidence angle corresponding to an image height of a pixel array region with light incidence characteristics of a camera lens, thereby causing image quality deterioration due to sensitivity shading. Respective microlenses are disposed in a two-dimensional manner, i.e., in a row and a column directions. In particular, the microlenses are disposed such that each side of a disposition region where the microlenses are disposed has a concave curve with respect to a line connecting adjacent vertexes of the disposition region. In other words, a distance AH (AV) between center points of a pair of facing sides of the disposition region is set to be smaller than a distance BH (BV) between neighboring vertexes of the disposition region.
    • 在固态图像拾取装置中,难以将与像素阵列区域的图像高度相对应的最佳入射角与相机透镜的光入射特性相匹配,从而导致由于灵敏度阴影引起的图像质量劣化。 各个微透镜以二维方式设置,即以行和列方向布置。 特别地,微透镜被布置成使得布置微透镜的布置区域的每一侧相对于连接配置区域的相邻顶点的线具有凹曲线。 换句话说,配置区域的一对相对侧的中心点之间的距离AH(AV)被设定为小于配置区域的相邻顶点之间的距离BH(BV)。
    • 36. 发明授权
    • Solid-state imaging device
    • 固态成像装置
    • US07777260B2
    • 2010-08-17
    • US12166736
    • 2008-07-02
    • Motonari KatsunoRyohei Miyagawa
    • Motonari KatsunoRyohei Miyagawa
    • H01L33/00H01L21/00
    • H01L27/14627H01L27/14623H01L27/14636
    • A solid-state imaging device includes: an imaging area in which light receiving portions are disposed; an interconnect layer disposed on the light receiving portions, the interconnect layer including metal interconnects having openings and first insulating films; inner-layer lenses formed over the interconnect layer in one-to-one relationship with the light receiving portions; a transparent second insulating film formed on the interconnect layer and the inner-layer lenses; top lenses formed on the second insulating film in one-to-one relationship with the light receiving portions, an upper face of each of the top lenses being a convexly curved face; and a transparent film on the top lenses, the transparent film being formed of a material having a refractive index smaller than a refractive index of the top lenses. In this way, a focal point of at least part of incident light can be situated above a semiconductor substrate.
    • 固态成像装置包括:配置有光接收部的摄像区域; 布置在所述光接收部分上的互连层,所述互连层包括具有开口的金属互连和第一绝缘膜; 在所述互连层上形成与所述光接收部分成一对一关系的内层透镜; 形成在所述互连层和所述内层透镜上的透明的第二绝缘膜; 与所述光接收部分成一对一关系地形成在所述第二绝缘膜上的顶部透镜,所述顶部透镜的上表面是凸曲面; 以及在顶部透镜上的透明膜,透明膜由折射率小于顶部透镜的折射率的材料形成。 以这种方式,入射光的至少一部分的焦点可以位于半导体衬底之上。
    • 38. 发明授权
    • MOS solid-state image pickup device and manufacturing method thereof
    • MOS固体摄像装置及其制造方法
    • US07755150B2
    • 2010-07-13
    • US11808042
    • 2007-06-06
    • Emi OhtsukaMikiya UchidaRyohei Miyagawa
    • Emi OhtsukaMikiya UchidaRyohei Miyagawa
    • H01L27/14
    • H01L27/14609H01L27/1463H01L27/14689
    • An N-type epitaxial layer 115, which is formed above an N-type semiconductor substrate 114 in each of a pixel region and a peripheral circuit region; a first P-type well 1 formed above the N-type epitaxial layer 115 in the pixel region; and light receiving regions 117, which are formed within the first P-type well 1 and each of which is a component of a photodiode, are included. The peripheral circuit region includes: second P-type wells 2, which are formed from a surface 200 of the peripheral circuit region to a desired depth and each of which is a component of an N-Channel MOS transistor; an N-type well 3 which is formed from the surface 200 of the peripheral circuit region to a desired depth and which is a component of a P-Channel MOS transistor; and a third P-type well 4 which is formed so as to have such a shape as to isolate the N-type well 3 from the N-type epitaxial layer 115 and which has a higher impurity concentration than that of the first P-type well 1.
    • 在像素区域和外围电路区域中的每一个中形成在N型半导体衬底114上方的N型外延层115; 形成在像素区域中的N型外延层115的上方的第一P型阱1; 并且包括形成在第一P型阱1内并且其每一个都是光电二极管的分量的光接收区域117。 外围电路区域包括:第二P型阱2,其由外围电路区域的表面200形成为期望的深度,并且每个都是N沟道MOS晶体管的一部分; N型阱3,其由外围电路区域的表面200形成为期望的深度,并且是P沟道MOS晶体管的分量; 以及第三P型阱4,其形成为具有使N型阱3与N型外延层115隔离的杂质浓度比第一P型阱高的杂质浓度 好1。