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31. 发明授权

US08283573B2 Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board 有权
标题翻译：多层印刷电路板及制造多层印刷电路板的方法
公开(公告)号：US08283573B2
公开(公告)日：2012-10-09
申请号：US12694322
申请日：2010-01-27
申请人： Motoo Asai , Dongdong Wang , Takahiro Mori
发明人： Motoo Asai , Dongdong Wang , Takahiro Mori
IPC分类号： H05K1/11
CPC分类号： H05K3/423 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/036 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/385 , H05K3/387 , H05K3/388 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09736 , H05K2201/09881 , H05K2203/0315 , H05K2203/0733 , H05K2203/0773 , H05K2203/1476 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A multi-layer printed circuit board including a core structure including resin layers and conductor circuits sandwiched by the resin layers, the core structure having a first surface and a second surface on an opposite side of the first surface, a first conductor layer including conductor circuits formed on the first surface of the core structure, and a second conductor layer including conductor circuits formed on the second surface of the core structure. The core structure includes a first via hole and a second via hole, the first via hole and the second via hole sandwich one or more conductor circuits in the core substrate and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and the second conductor layers, and the first via hole and the second via hole are deviated from each other in a vertical direction.
摘要翻译：一种多层印刷电路板，包括由树脂层和由树脂层夹在的导体电路的芯结构，芯结构具有在第一表面的相对侧的第一表面和第二表面，第一导体层包括导体电路形成在芯结构的第一表面上，以及第二导体层，包括形成在芯结构的第二表面上的导体电路。芯结构包括第一通孔和第二通孔，第一通孔和第二通孔夹着芯基板中的一个或多个导体电路并垂直定位，以形成电连接各个导体电路的通孔的第一和第二导体层，并且第一通孔和第二通孔在垂直方向上彼此偏离。

32. 发明授权

US08253939B2 Particle counter 有权
标题翻译：粒子计数器
公开(公告)号：US08253939B2
公开(公告)日：2012-08-28
申请号：US12627551
申请日：2009-11-30
申请人： Akira Arakawa , Takahiro Mori , Tsunehiro Inoue
发明人： Akira Arakawa , Takahiro Mori , Tsunehiro Inoue
IPC分类号： G01N21/00
CPC分类号： G01N21/53 , G01N15/1429 , G01N21/85 , G01N21/94 , G01N2015/1486
摘要： The present invention provides a particle counter capable of sensitively determining the contamination level of a light transmission window. The particle counter according to the present invention includes: a light source 281 for emitting light through a light incident window 24 to a measurement area 40 in a vacuum state or in an approximately vacuum state; a scattered light detector 32 for detecting scattered light through a detection window 30, the scattered light being generated when a light is delivered to the measurement area 40; a vacuum gauge 12 for measuring the pressure of the measurement area 40; a signal processor 13 for converting a detection signal of the scattered light into an electrical signal; and a contamination level determiner 19 for determining the contamination level of the transmission window from the time average of the electrical signal and the pressure.
摘要翻译：本发明提供一种能够敏感地确定光透射窗的污染水平的粒子计数器。根据本发明的粒子计数器包括：用于在真空状态或近似真空状态下将光通过光入射窗24发射到测量区域40的光源281; 用于检测通过检测窗30的散射光的散射光检测器32，当光被传送到测量区域40时产生的散射光; 用于测量测量区域40的压力的真空计12; 用于将散射光的检测信号转换为电信号的信号处理器13; 以及污染水平确定器19，用于根据电信号和压力的时间平均值确定透射窗的污染水平。

33. 发明申请

US20120186867A1 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 有权
标题翻译：多层印刷电路板及制造多层印刷电路板的方法
公开(公告)号：US20120186867A1
公开(公告)日：2012-07-26
申请号：US13432471
申请日：2012-03-28
申请人： Motoo ASAI , Dongdong Wang , Takahiro Mori
发明人： Motoo ASAI , Dongdong Wang , Takahiro Mori
IPC分类号： H05K1/11
CPC分类号： H05K3/423 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/036 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/385 , H05K3/387 , H05K3/388 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09736 , H05K2201/09881 , H05K2203/0315 , H05K2203/0733 , H05K2203/0773 , H05K2203/1476 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A multi-layer printed circuit board including a first insulating layer, a first conductor layer having circuits on one surface of the first insulating layer, a second conductor layer having circuits on the opposite surface of the first insulating layer, a second insulating layer on the second conductor and first insulating layers, and a third conductor layer having circuits on the second insulating layer on the opposite side of the second conductor layer. The first and second insulating layers have first and second via holes formed in openings of the first and second insulating layers and made of conductive materials filling the openings such that circuits in the first and third conductor layers are connected to one or more circuits in the second conductor layer, and the first and second via holes have bottom ends facing the second conductor layer and top ends larger than the bottom ends.
摘要翻译：一种多层印刷电路板，包括第一绝缘层，在第一绝缘层的一个表面上具有电路的第一导体层，在第一绝缘层的相对表面上具有电路的第二导体层，第二绝缘层，第二导体和第一绝缘层，以及在第二导体层的相对侧的第二绝缘层上具有电路的第三导体层。第一和第二绝缘层具有形成在第一和第二绝缘层的开口中的第一和第二通孔，并由填充开口的导电材料制成，使得第一和第三导体层中的电路连接到第二和第二绝缘层中的一个或多个电路导体层，第一和第二通孔具有面向第二导体层的底端，并且顶端大于底端。

34. 发明申请

US20120161062A1 FERRITE MAGNETIC MATERIAL 有权
标题翻译：铁素体磁性材料
公开(公告)号：US20120161062A1
公开(公告)日：2012-06-28
申请号：US13382220
申请日：2010-07-02
申请人： Junichi Nagaoka , Takahiro Mori , Hiroyuki Morita , Yoshihiko Minachi
发明人： Junichi Nagaoka , Takahiro Mori , Hiroyuki Morita , Yoshihiko Minachi
IPC分类号： H01F1/01
CPC分类号： H01F1/10 , C01G49/0054 , C01G51/006 , C01P2002/30 , C01P2004/61 , C01P2004/62 , C01P2006/12 , C04B35/2633 , C04B35/2641 , C04B35/6261 , C04B35/6263 , C04B35/632 , C04B2235/32 , C04B2235/3203 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3217 , C04B2235/3224 , C04B2235/3227 , C04B2235/3232 , C04B2235/3239 , C04B2235/3241 , C04B2235/3244 , C04B2235/3251 , C04B2235/3256 , C04B2235/3258 , C04B2235/3262 , C04B2235/3277 , C04B2235/3279 , C04B2235/3281 , C04B2235/3284 , C04B2235/3286 , C04B2235/3287 , C04B2235/3293 , C04B2235/3294 , C04B2235/3409 , C04B2235/3418 , C04B2235/447 , C04B2235/448 , C04B2235/5409 , C04B2235/5436 , C04B2235/5445 , C04B2235/549 , C04B2235/605 , C04B2235/6562 , C04B2235/661 , C04B2235/72 , C04B2235/726 , C04B2235/727 , C04B2235/767 , C04B2235/785 , C04B2235/786 , C04B2235/85 , C04B2235/94 , C04B2235/95 , H01F1/11
摘要： An object of the present invention is to provide a ferrite magnetic material which can provide a permanent magnet retaining high Br and HcJ as well as having high Hk/HcJ. The ferrite magnetic material according to a preferred embodiment is a ferrite magnetic material formed of hard ferrite, wherein a P content in terms of P2O5 is 0.001% by mass or more.
摘要翻译：本发明的目的是提供一种能够提供保持高Br和HcJ的永磁体以及具有高Hk / HcJ的铁氧体磁性材料。根据优选实施方案的铁氧体磁性材料是由硬质铁氧体形成的铁氧体磁性材料，其中以P 2 O 5计的P含量为0.001质量％以上。

35. 发明申请

US20110192637A1 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 有权
标题翻译：多层印刷电路板及制造多层印刷电路板的方法
公开(公告)号：US20110192637A1
公开(公告)日：2011-08-11
申请号：US13089378
申请日：2011-04-19
申请人： Motoo ASAI , Dongdong Wang , Takahiro Mori
发明人： Motoo ASAI , Dongdong Wang , Takahiro Mori
IPC分类号： H05K1/03
CPC分类号： H05K3/423 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/036 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/385 , H05K3/387 , H05K3/388 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09736 , H05K2201/09881 , H05K2203/0315 , H05K2203/0733 , H05K2203/0773 , H05K2203/1476 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A multi-layer printed circuit board includes a core structure including resin layers and conductor circuits sandwiched by the resin layers, the core structure having first and second surfaces, a first conductor layer including conductor circuits on the first surface of the core structure, and a second conductor layer including conductor circuits on the second surface of the core structure. The core structure includes first and via holes, and the first and second via holes include a metal filling up to the respective top of openings in the resin layers, respectively, sandwich one or more conductor circuits in the core structure and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and second conductor layers, and the first and second via holes are deviated from each other in a vertical direction.
摘要翻译：多层印刷电路板包括：包括树脂层的芯结构和被树脂层夹持的导体电路，所述芯结构具有第一和第二表面，在芯结构的第一表面上包括导体电路的第一导体层，以及第二导体层，包括在芯结构的第二表面上的导体电路。芯结构包括第一和通孔，并且第一和第二通孔分别包括在树脂层中分别填充到各个开口顶部的金属，将一个或多个导体电路夹在芯结构中并垂直定位以形成电连接第一和第二导体层的各个导体电路的通孔以及第一和第二通孔在垂直方向上彼此偏离。

36. 发明申请

US20110036626A1 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 有权
标题翻译：多层印刷电路板及制造多层印刷电路板的方法
公开(公告)号：US20110036626A1
公开(公告)日：2011-02-17
申请号：US12913258
申请日：2010-10-27
申请人： Motoo ASAI , Dongdong Wang , Takahiro Mori
发明人： Motoo ASAI , Dongdong Wang , Takahiro Mori
IPC分类号： H05K1/11
CPC分类号： H05K3/423 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/036 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/385 , H05K3/387 , H05K3/388 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09736 , H05K2201/09881 , H05K2203/0315 , H05K2203/0733 , H05K2203/0773 , H05K2203/1476 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A multi-layer printed circuit board including a first insulating layer, a first conductor layer having conductor circuits on one surface of the first insulating layer, a second conductor layer having conductor circuits on the opposite surface of the first insulating layer, a second insulating layer on the second conductor and first insulating layers, and a third conductor layer having conductor circuits on the second insulating layer on the opposite side of the second conductor layer. The first and second insulating layers have first and second via holes which are formed in openings of the first and second insulating layers and made of conductive materials filled to the top of the openings such that conductor circuits in the first and third conductor layers are connected to one or more conductor circuits in the second conductor layer, and the first and second via holes are tapering toward the second conductor layer.
摘要翻译：一种多层印刷电路板，包括第一绝缘层，在第一绝缘层的一个表面上具有导体电路的第一导体层，在第一绝缘层的相对表面上具有导体电路的第二导体层，第二绝缘层在第二导体和第一绝缘层上的第二绝缘层和在第二导体层的相对侧的第二绝缘层上具有导体电路的第三导体层。第一绝缘层和第二绝缘层具有第一和第二通孔，其形成在第一和第二绝缘层的开口中，并由填充到开口顶部的导电材料制成，使得第一和第三导体层中的导体电路连接到第二导体层中的一个或多个导体电路，以及第一和第二通孔朝向第二导体层逐渐变细。

37. 发明授权

US07859315B2 Driver circuit 有权
标题翻译：驱动电路
公开(公告)号：US07859315B2
公开(公告)日：2010-12-28
申请号：US12330110
申请日：2008-12-08
申请人： Akira Nakamori , Takahiro Mori , Tomoyuki Yamazaki
发明人： Akira Nakamori , Takahiro Mori , Tomoyuki Yamazaki
IPC分类号： H03B1/00
CPC分类号： H03K17/168 , H03K17/163 , H03K2217/0036
摘要： A driver circuit facilitates reducing noises and losses and improving the driving performances thereof without connecting a series circuit of capacitor and a resistor to the gate of IGBT. The driver circuit includes a slope setting circuit that sets the gate voltage waveform of IGBT; and an operational amplifier that includes a non-inverting input terminal, to which an output voltage V* from slope setting circuit is inputted, and an inverting input terminal, to which a divided voltage Vgsf divided by resistors is inputted; and the operational amplifier outputs an output voltage Vout, proportional to the difference between the output voltage V* and the divided voltage Vgsf, to the gate of IGBT.
摘要翻译：驱动电路有助于降低噪声和损耗，并提高其驱动性能，而无需将电容器和电阻器的串联电路连接到IGBT的栅极。驱动电路包括设置IGBT栅极电压波形的斜坡设定电路; 以及运算放大器，其包括输入来自斜坡设定电路的输出电压V *的非反相输入端子和输入了由电阻器分压的分压电压Vgsf的反相输入端子; 并且运算放大器将与输出电压V *和分压Vgsf之间的差成比例的输出电压Vout输出到IGBT的栅极。

38. 发明申请

US20100112323A1 COMPOSITE MATERIAL 有权
标题翻译：复合材料
公开(公告)号：US20100112323A1
公开(公告)日：2010-05-06
申请号：US12595307
申请日：2008-05-29
申请人： Takahiro Mori , Yoshihiro Fukuda , Yoshinori Takahata
发明人： Takahiro Mori , Yoshihiro Fukuda , Yoshinori Takahata
IPC分类号： B32B27/38
CPC分类号： H05K1/036 , B32B27/08 , B32B27/20 , B32B27/281 , B32B27/34 , B32B27/38 , B32B2262/0269 , B32B2262/0276 , B32B2262/062 , B32B2262/10 , B32B2262/101 , B32B2262/106 , B32B2264/105 , B32B2307/21 , B32B2307/306 , B32B2307/3065 , B32B2457/00 , C08G59/44 , H05K1/0346 , H05K2201/0154 , Y10T428/263 , Y10T428/266 , Y10T428/269 , Y10T428/31511 , Y10T428/31721 , Y10T428/31725
摘要： A composite material obtained by laminating (A) a layer formed of an epoxy resin curing composition including a polyamide compound having a structure containing a phenolic hydroxyl group represented by the following formula (I) or (II) in its repeating unit and (B) a layer of a polyimide to each other. The composite material is preferably obtained by applying the epoxy resin curing composition to at least one side of a polyimide film or sheet. In formula (I), ring A and R each represent an arylene group having 6 to 18 carbon atoms, an alkylidenediarylene group having 13 to 25 carbon atoms, etc. In formula (II), ring B is an arylene group having 6 to 18 carbon atoms or an alkylidenediaryl group having 13 to 25 carbon atoms.
摘要翻译：（A）由包含具有下述式（I）或（II）表示的酚羟基的结构的聚酰胺化合物的环氧树脂固化性组合物的层叠体（A）和（B）一层聚酰亚胺彼此。复合材料优选通过将环氧树脂固化组合物施加到聚酰亚胺膜或片材的至少一侧来获得。在式（I）中，环A和R各自表示碳原子数为6〜18的亚芳基，碳原子数为13〜25的亚烷基亚芳基等。式（II）中，环B为6〜18的亚芳基碳原子或碳原子数为13〜25的亚烷基二芳基。

39. 发明申请

US20100066150A1 Seatbelt retractor 审中-公开
标题翻译：安全带卷收器
公开(公告)号：US20100066150A1
公开(公告)日：2010-03-18
申请号：US12458144
申请日：2009-07-01
申请人： Takahiro Mori , Takaaki Kimura , Hideyuki Tonbe , Masato Takao
发明人： Takahiro Mori , Takaaki Kimura , Hideyuki Tonbe , Masato Takao
IPC分类号： B60R22/34 , B60R22/46
CPC分类号： B60R22/4628 , B60R22/46 , B60R2022/4642 , B60R2022/4666
摘要： A seat belt retractor is provided with a reduced size and reduced man-hours required for installation to a vehicle body. A motor for rotating a spool of winding a seat belt and an ECU for the motor are united to form a combined motor/ECU unit. The motor/ECU unit is supported on a frame just below the spool. In this case, the motor and ECU are accommodated in a unit casing of which a casing body is flatly supported on a unit stay. The unit stay is supported by the frame.
摘要翻译：安全带卷收器具有减小的尺寸并减少安装到车身所需的工时。用于旋转卷绕安全带的卷轴和用于马达的ECU的马达被联合以形成组合的马达/ ECU单元。马达/ ECU单元支撑在阀芯正下方的框架上。在这种情况下，电动机和ECU被容纳在单元壳体中，壳体主体被平坦地支撑在单元支架上。单位支持由框架支持。

40. 发明授权

US07579300B2 Image recording material and image formation process thereof 失效
标题翻译：图像记录材料及其图像形成过程
公开(公告)号：US07579300B2
公开(公告)日：2009-08-25
申请号：US11438513
申请日：2006-05-22
申请人： Takahiro Mori
发明人： Takahiro Mori
IPC分类号： B41M5/26
CPC分类号： B41C1/1025 , B41C2201/02 , B41C2201/14 , B41C2210/04 , B41C2210/08 , B41C2210/22 , B41C2210/24 , Y10S430/146
摘要： An object of the present invention is to provide an image recording material exhibiting an excellent exposure visualization property as well as an image formation process employing the image recording material, and further to provide not only a printing plate material exhibiting excellent on-press developability and printing durability, but also an image formation process employing the printing plate material, accompanied with an excellent exposure visualization property. Also disclosed is an image recording material possessing a support and provided thereon, a thermosensitive image formation layer, wherein the thermosensitive image formation layer contains thermoplastic spherical particles having an average particle diameter of 100-500 nm, and exhibits a structural color originated with the thermoplastic spherical particles.
摘要翻译：本发明的目的是提供一种具有优异的曝光可视性的图像记录材料以及采用图像记录材料的图像形成工艺，并且不仅提供显示出优异的印刷显影性和印刷的印版材料耐久性，而且采用印版材料的图像形成方法，具有优异的曝光可视化特性。还公开了一种具有支撑并设置在其上的热敏图像形成层的图像记录材料，其中热敏图像形成层包含平均粒径为100-500nm的热塑性球形颗粒，并且表现出由热塑性塑料产生的结构颜色球形颗粒。

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