专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明授权

US08222618B2 Method and apparatus for processing a microsample 有权
标题翻译：用于处理微样品的方法和装置
公开(公告)号：US08222618B2
公开(公告)日：2012-07-17
申请号：US13007272
申请日：2011-01-14
申请人： Mitsuo Tokuda , Muneyuki Fukuda , Yasuhiro Mitsui , Hidemi Koike , Satoshi Tomimatsu , Hiroyasu Shichi , Hideo Kashima , Kaoru Umemura
发明人： Mitsuo Tokuda , Muneyuki Fukuda , Yasuhiro Mitsui , Hidemi Koike , Satoshi Tomimatsu , Hiroyasu Shichi , Hideo Kashima , Kaoru Umemura
IPC分类号： A61N5/00
CPC分类号： H04L29/06 , G01N23/225 , H01J37/256 , H01J37/3056 , H01J2237/20 , H01J2237/202 , H01J2237/31745 , H04L67/16 , H04L69/329
摘要： An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.
摘要翻译：本发明的目的是实现一种用于处理和观察微分样品的方法和装置，其能够以高分辨率，高精度和高产量在水平和垂直方向观察晶片的截面而不分裂任何作为样品的晶片。在本发明的装置中，在一个真空容器中包括聚焦离子束光学系统和电子光学系统，并且通过用带电粒子束的成形处理分离包含样品的所需区域的微小样品，并且在那里被包括用于提取分离的微小样本的操纵器和用于独立于晶片样品台驱动操纵器的操纵器控制器。

32. 发明授权

US07550750B2 Method and apparatus for processing a micro sample 有权
公开(公告)号：US07550750B2
公开(公告)日：2009-06-23
申请号：US11706355
申请日：2007-02-15
申请人： Mitsuo Tokuda , Muneyuki Fukuda , Yasuhiro Mitsui , Hidemi Koike , Satoshi Tomimatsu , Hiroyasu Shichi , Hideo Kashima , Kaoru Umemura
发明人： Mitsuo Tokuda , Muneyuki Fukuda , Yasuhiro Mitsui , Hidemi Koike , Satoshi Tomimatsu , Hiroyasu Shichi , Hideo Kashima , Kaoru Umemura
IPC分类号： G21K5/00 , H01J37/08
CPC分类号： H04L29/06 , G01N23/225 , H01J37/256 , H01J37/3056 , H01J2237/20 , H01J2237/202 , H01J2237/31745 , H04L67/16 , H04L69/329
摘要： An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.

33. 发明授权

US07465945B2 Method and apparatus for processing a micro sample 有权
标题翻译：用于处理微量样品的方法和设备
公开(公告)号：US07465945B2
公开(公告)日：2008-12-16
申请号：US11783001
申请日：2007-04-05
申请人： Mitsuo Tokuda , Muneyuki Fukuda , Yasuhiro Mitsui , Hidemi Koike , Satoshi Tomimatsu , Hiroyasu Shichi , Hideo Kashima , Kaoru Umemura
发明人： Mitsuo Tokuda , Muneyuki Fukuda , Yasuhiro Mitsui , Hidemi Koike , Satoshi Tomimatsu , Hiroyasu Shichi , Hideo Kashima , Kaoru Umemura
IPC分类号： A61N5/00
CPC分类号： H04L29/06 , G01N23/225 , H01J37/256 , H01J37/3056 , H01J2237/20 , H01J2237/202 , H01J2237/31745 , H04L67/16 , H04L69/329
摘要： An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.
摘要翻译：本发明的目的是实现一种用于处理和观察微分样品的方法和装置，其能够以高分辨率，高精度和高产量在水平和垂直方向观察晶片的截面而不分裂任何作为样品的晶片。在本发明的装置中，在一个真空容器中包括聚焦离子束光学系统和电子光学系统，并且通过用带电粒子束的成形处理分离包含样品的所需区域的微小样品，并且在那里被包括用于提取分离的微小样本的操纵器和用于独立于晶片样品台驱动操纵器的操纵器控制器。

34. 发明申请

US20070181831A1 Method and apparatus for processing a micro sample 有权
公开(公告)号：US20070181831A1
公开(公告)日：2007-08-09
申请号：US11783001
申请日：2007-04-05
申请人： Mitsuo Tokuda , Muneyuki Fukuda , Yasuhiro Mitsui , Hidemi Koike , Satoshi Tomimatsu , Hiroyasu Shichi , Hideo Kashima , Kaoru Umemura
发明人： Mitsuo Tokuda , Muneyuki Fukuda , Yasuhiro Mitsui , Hidemi Koike , Satoshi Tomimatsu , Hiroyasu Shichi , Hideo Kashima , Kaoru Umemura
IPC分类号： H01J37/08
CPC分类号： H04L29/06 , G01N23/225 , H01J37/256 , H01J37/3056 , H01J2237/20 , H01J2237/202 , H01J2237/31745 , H04L67/16 , H04L69/329
摘要： An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.

35. 发明申请

US20050211927A1 Method and apparatus for processing a micro sample 有权
公开(公告)号：US20050211927A1
公开(公告)日：2005-09-29
申请号：US11127240
申请日：2005-05-12
申请人： Mitsuo Tokuda , Muneyuki Fukuda , Yasuhiro Mitsui , Hidemi Koike , Satoshi Tomimatsu , Hiroyasu Shichi , Hideo Kashima , Kaoru Umemura
发明人： Mitsuo Tokuda , Muneyuki Fukuda , Yasuhiro Mitsui , Hidemi Koike , Satoshi Tomimatsu , Hiroyasu Shichi , Hideo Kashima , Kaoru Umemura
IPC分类号： G01N1/32 , G01N1/28 , G01N23/225 , G01Q10/00 , G01Q30/02 , G01Q30/04 , G01Q30/16 , G01Q30/20 , H01J37/20 , H01J37/256 , H01J37/28 , H01J37/30 , H01J37/305 , H01J37/317 , H01L21/66 , H04L29/06 , H04L29/08 , A61N5/00 , G21K7/00
CPC分类号： H04L29/06 , G01N23/225 , H01J37/256 , H01J37/3056 , H01J2237/20 , H01J2237/202 , H01J2237/31745 , H04L67/16 , H04L69/329
摘要： An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.

36. 发明申请

US20050186010A1 Cutting plotter, cutting plotter driving control device, cut target medium supporting sheet, cut target medium, cutting pen, method of manufacturing paper product, and method of generating cut data 有权
标题翻译：切割机，切割机驱动控制装置，切割目标介质支撑片材，切割目标介质，切割笔，纸制品的制造方法和产生切割数据的方法
公开(公告)号：US20050186010A1
公开(公告)日：2005-08-25
申请号：US11036047
申请日：2005-01-18
申请人： Takeya Shibata , Yuzuru Sekiguchi , Michiharu Nishijima , Tsutomu Tsuji , Hidemi Koike , Yutaka Saegusa , Kousuke Watanabe , Takayuki Tanigawa , Toshihiro Houhara , Shinichi Mukasa , Kenji Yamamoto
发明人： Takeya Shibata , Yuzuru Sekiguchi , Michiharu Nishijima , Tsutomu Tsuji , Hidemi Koike , Yutaka Saegusa , Kousuke Watanabe , Takayuki Tanigawa , Toshihiro Houhara , Shinichi Mukasa , Kenji Yamamoto
IPC分类号： B26D5/00 , B26D7/01 , B26D7/26 , B26F1/38 , B41J11/26
CPC分类号： B26F1/3813 , B26D5/00 , B26D7/015 , B26D7/2628 , B26D2007/0087 , B26D2007/2678 , Y10T83/0348 , Y10T83/162 , Y10T83/538
摘要： A cut target medium driving type cutting plotter, in which a cut target medium to be cut is driven in a first direction and a cutting unit is driven in a second direction perpendicular to the first direction, thereby moving the cutting unit in a two-dimensional direction relative to the cut target medium to make the cutting unit to be selectively brought into press contact with and separated from the cut target medium to cut the cut target medium in a desired shape, the cut target medium driving type cutting plotter includes a cut target medium supporting sheet to removably support the cut target medium on a surface opposite to the cutting unit. Preferably, the cut target medium is driven in the first direction together with the cut target medium supporting sheet, and the cut target medium supported on the cut target medium supporting sheet is cut by the cutting unit.
摘要翻译：一种切割目标介质驱动型切割机，其中待切割的切割目标介质沿第一方向被驱动，并且切割单元沿与第一方向垂直的第二方向被驱动，从而将切割单元以二维相对于切割目标介质的方向，使得切割单元选择性地与切割的目标介质压接并分离，以将切割的目标介质切割成期望的形状，切割的目标介质驱动型切割机包括切割目标中等支撑片材，以可拆卸地支撑与切割单元相对的表面上的切割目标介质。优选地，切割目标介质与切割的目标介质支撑片材一起沿第一方向被驱动，并且被切割的目标介质支撑片材上支撑的切割目标介质被切割单元切割。

37. 发明授权

US06566654B1 Inspection of circuit patterns for defects and analysis of defects using a charged particle beam 有权
标题翻译：使用带电粒子束检查缺陷的电路图案和缺陷分析
公开(公告)号：US06566654B1
公开(公告)日：2003-05-20
申请号：US09697773
申请日：2000-10-27
申请人： Ryuichi Funatsu , Shigeto Isakozawa , Hidemi Koike
发明人： Ryuichi Funatsu , Shigeto Isakozawa , Hidemi Koike
IPC分类号： G03F900
CPC分类号： H01J37/28 , H01J2237/2817 , H01J2237/3174
摘要： The present invention is intended to detect defects in a circuit pattern formed on a semiconductor wafer by a circuit pattern forming process, to facilitates the extraction and observation of the defects, to improve the accuracy of analysis of the causes of the defects, and to determine the causes of the defects and to take measures to eliminate the causes of the defects in a greatly reduced time after the formation of the defects. A method of inspecting a circuit pattern for defects and analyzing defects, comprising locating a defect in a circuit pattern formed on a wafer by using an electron beam, specifying a chip having the defect on the basis of position data on the defect, cutting out the chip from the semiconductor wafer, thinning a portion of the chip to form a thin portion, and observing the thin portion of the chip under a transmission electron microscope to determine the causes of the defect.
摘要翻译：本发明旨在通过电路图案形成处理来检测在半导体晶片上形成的电路图案中的缺陷，以便于提取和观察缺陷，提高对缺陷原因的分析准确性，并确定造成缺陷的原因，并在形成缺陷后大幅度缩短的时间内采取措施消除缺陷的原因。一种用于检查缺陷的电路图案和分析缺陷的方法，包括通过使用电子束将形成在晶片上的电路图案中的缺陷定位在缺陷上，根据缺陷的位置数据指定具有缺陷的芯片，从半导体晶片切片，使芯片的一部分变薄以形成薄的部分，并且在透射电子显微镜下观察芯片的薄部分以确定缺陷的原因。

38. 发明授权

US5216253A Ion implantation apparatus with variable width slits providing an ion beam of high purity 失效
标题翻译：离子植入装置，具有提供高纯度离子束的可变宽度片段
公开(公告)号：US5216253A
公开(公告)日：1993-06-01
申请号：US780198
申请日：1991-10-22
申请人： Hidemi Koike
发明人： Hidemi Koike
IPC分类号： C23C14/48 , H01J37/05 , H01J37/304 , H01J37/317 , H01L21/265
CPC分类号： H01J37/304 , H01J37/3171 , H01J2237/0455 , H01J2237/30472
摘要： In an ion implantation apparatus, a first slit for limiting an ion beam width is provided between an ion source and a mass separation electromagnet. An accelerator is provided behind the mass separation electromagnet. A second slit for separating the ion beam is provided between a deflector provided behind the accelerator and a wafer. The slit widths of the first and second slits are controlled by a controller which monitors an ion source acceleration voltage, a magnetic field intensity of the mass separation electromagnet, an accelerator voltage, and a magnetic field intensity of the deflector, and control the slit widths of the first and second slits based on the monitored information.
摘要翻译：在离子注入装置中，在离子源和质量分离电磁体之间设置用于限制离子束宽度的第一狭缝。在质量分离电磁体之后设置加速器。用于分离离子束的第二狭缝设置在设置在加速器后面的偏转器和晶片之间。第一和第二狭缝的狭缝宽度由监视离子源加速电压，质量分离电磁体的磁场强度，加速器电压和偏转器的磁场强度的控制器控制，并且控制狭缝宽度的第一和第二狭缝基于所监视的信息。

39. 发明授权

US08156852B2 Cutting plotter, cutting plotter driving control device, cut target medium supporting sheet, cut target medium, cutting pen, method of manufacturing paper product, and method of generating cut data 有权
标题翻译：切割机，切割机驱动控制装置，切割目标介质支撑片材，切割目标介质，切割笔，纸制品的制造方法和产生切割数据的方法
公开(公告)号：US08156852B2
公开(公告)日：2012-04-17
申请号：US11036047
申请日：2005-01-18
申请人： Takeya Shibata , Yuzuru Sekiguchi , Michiharu Nishijima , Tsutomu Tsuji , Hidemi Koike , Yutaka Saegusa , Kousuke Watanabe , Takayuki Tanigawa , Toshihiro Houhara , Shinichi Mukasa , Kenji Yamamoto
发明人： Takeya Shibata , Yuzuru Sekiguchi , Michiharu Nishijima , Tsutomu Tsuji , Hidemi Koike , Yutaka Saegusa , Kousuke Watanabe , Takayuki Tanigawa , Toshihiro Houhara , Shinichi Mukasa , Kenji Yamamoto
IPC分类号： B26D5/20 , B26F1/38
CPC分类号： B26F1/3813 , B26D5/00 , B26D7/015 , B26D7/2628 , B26D2007/0087 , B26D2007/2678 , Y10T83/0348 , Y10T83/162 , Y10T83/538
摘要： A cut target medium driving type cutting plotter, where a cut target medium to be cut is driven in a first direction and a cutting unit is driven in a second direction perpendicular to the first direction, thereby moving the cutting unit in a two-dimensional direction relative to the cut target medium to make the cutting unit to be selectively brought into press contact with and separated from the cut target medium to cut the cut target medium in a desired shape, the cut target medium driving type cutting plotter includes a cut target medium supporting sheet to removably support the cut target medium on a surface opposite to the cutting unit. Preferably, the cut target medium is driven in the first direction together with the cut target medium supporting sheet, and the cut target medium supported on the cut target medium supporting sheet is cut by the cutting unit.
摘要翻译：一种切割目标介质驱动型切割机，其中待切割的切割目标介质沿第一方向被驱动，并且切割单元沿与第一方向垂直的第二方向被驱动，从而沿着二维方向移动切割单元相对于切割目标介质，切割单元选择性地与切割的目标介质压接并分离，以将切割的目标介质切割成期望的形状，切割目标介质驱动型切割机包括切割目标介质支撑片可拆卸地支撑与切割单元相对的表面上的切割目标介质。优选地，切割目标介质与切割的目标介质支撑片材一起沿第一方向被驱动，并且被切割的目标介质支撑片材上支撑的切割目标介质被切割单元切割。

40. 发明授权

US5783830A Sample evaluation/process observation system and method 失效
标题翻译：样本评估/过程观察系统和方法
公开(公告)号：US5783830A
公开(公告)日：1998-07-21
申请号：US873788
申请日：1997-06-12
申请人： Hiroshi Hirose , Hidemi Koike , Shigeto Isakozawa , Yuji Sato , Mikio Ichihashi , Motohide Ukiana
发明人： Hiroshi Hirose , Hidemi Koike , Shigeto Isakozawa , Yuji Sato , Mikio Ichihashi , Motohide Ukiana
IPC分类号： H01J37/305 , H01J37/20
CPC分类号： H01J37/3056 , H01J37/265 , H01J2237/20 , H01J2237/26
摘要： A sample evaluation/process observation system includes a common sample stage which accommodates a plurality of samples to be processed. The common sample stage is provided with a processing/observing notch and also with a movement mechanism. The movement mechanism functions to sequentially move the plurality of samples to the notch to cause the samples to be exposed to a predetermined processing beam and observing beam. The system further includes a beam processing device in which the common sample stage can be mounted and which functions to irradiate the predetermined processing beam on the plurality of samples through the notch to thereby sequentially perform beam processing operation over the samples. The system further includes a beam observation device in which the common sample stage can be mounted and which functions to irradiate the predetermined observing beam on the plurality of samples through the notch to sequentially observe and evaluate shapes of the plurality of samples. A mark is formed on one sample by a focused ion beam device so that positioning of the mark realizes automatic processing of a part of the sample to be processed. Further, the common sample stage is used in a high-acceleration transmission electron microscope and a high-acceleration scanning electron microscope and focused ion beam device.
摘要翻译：样本评估/过程观察系统包括容纳多个待处理样本的公共样本阶段。公共样品台具有处理/观察凹口，并且还具有移动机构。移动机构用于将多个样本顺序地移动到凹口，以使样本暴露于预定的处理束和观察波束。该系统还包括其中可以安装公共样本台的束处理装置，并且其功能是通过凹口对多个采样上的预定处理光束照射，从而顺序地对采样进行光束处理操作。该系统还包括其中可以安装公共样品台的束观察装置，并且其功能是通过凹口将多个样品上的预定观察光束照射，以依次观察和评估多个样品的形状。通过聚焦离子束装置在一个样品上形成标记，使得标记的定位实现待处理样品的一部分的自动处理。此外，普通样品台用于高加速度透射电子显微镜和高加速度扫描电子显微镜和聚焦离子束装置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式