专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明申请

US20080268134A1 ELECTRODE WITH INCREASED STABILITY AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：具有增加的稳定性的电极及其制造方法
公开(公告)号：US20080268134A1
公开(公告)日：2008-10-30
申请号：US11924763
申请日：2007-10-26
申请人： Dao Min Zhou , Jerry Ok , Neil Hamilton Talbot , Brian V. Mech , James Singleton Little , Robert J. Greenberg
发明人： Dao Min Zhou , Jerry Ok , Neil Hamilton Talbot , Brian V. Mech , James Singleton Little , Robert J. Greenberg
IPC分类号： H01M4/04
CPC分类号： A61N1/0543 , A61N1/36046
摘要： The present invention provides an implantable electrode with increased stability having a clustered structure wherein the surface of the electrode is covered with a material comprising openings which are filled with sticks or posts.The present invention provides an implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material.The present invention provides a method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer.The present invention provides A method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying a polymer layer on the metal layer; applying photoresist layer on the polymer layer; patterning the photoresist layer providing openings; electroplating the openings with metal; and removing the photoresist layer.
摘要翻译：本发明提供具有增加的稳定性的可植入电极，其具有聚集结构，其中电极的表面被包括填充有棒或柱的开口的材料覆盖。本发明提供了具有增加的稳定性的可植入电极，其中电极的表面包括填充有用导电或绝缘材料填充的棒的网状网格。本发明提供一种具有增加的稳定性的电极的制造方法，包括：在基底层上沉积金属层; 在金属层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 去除留下空间的光致抗蚀剂层; 并用聚合物填充空间。本发明提供了一种制造具有增加的稳定性的电极的方法，包括：在基底层上沉积金属层; 在金属层上施加聚合物层; 在聚合物层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 并除去光致抗蚀剂层。

32. 发明申请

US20080082147A1 External Coil Assembly for Implantable Medical Prostheses 有权
标题翻译：用于植入式医疗假体的外部线圈组件
公开(公告)号：US20080082147A1
公开(公告)日：2008-04-03
申请号：US11924423
申请日：2007-10-25
申请人： Rongqing Dai , Dao Min Zhou , Robert J. Greenberg , John Gord
发明人： Rongqing Dai , Dao Min Zhou , Robert J. Greenberg , John Gord
IPC分类号： A61N1/02
CPC分类号： A61N1/37229 , A61N1/36046 , A61N1/3787
摘要： Methods and devices for inductively coupled implants on the human or animal body are disclosed. An external coil assembly to be used with the implant has a transmitting coil and one or more receiving coils. The number of the receiving coils, their distance from the transmitting coil and their shape is chosen to reduce the influence of a noise signal received by the external coil assembly.
摘要翻译：公开了用于人体或动物体上的电感耦合植入物的方法和装置。与植入物一起使用的外部线圈组件具有发射线圈和一个或多个接收线圈。选择接收线圈的数量，它们与发射线圈的距离及其形状，以减少由外部线圈组件接收的噪声信号的影响。

33. 发明授权

US10159832B2 Electrode with increased stability and method of manufacturing the same 有权
公开(公告)号：US10159832B2
公开(公告)日：2018-12-25
申请号：US11924763
申请日：2007-10-26
申请人： Dao Min Zhou , Jerry Ok , Neil Hamilton Talbot , Brian V. Mech , James Singleton Little , Robert J. Greenberg
发明人： Dao Min Zhou , Jerry Ok , Neil Hamilton Talbot , Brian V. Mech , James Singleton Little , Robert J. Greenberg
IPC分类号： C25D5/02 , A61N1/05 , A61N1/36
摘要： The present invention provides an implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material. The present invention further provides a method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer.

34. 发明授权

US08548597B2 External coil assembly for implantable medical prostheses 有权
标题翻译：用于可植入医用假体的外部线圈组件
公开(公告)号：US08548597B2
公开(公告)日：2013-10-01
申请号：US11529809
申请日：2006-09-29
申请人： Rongqing Dai , Dao Min Zhou , Robert J. Greenberg , John Gord
发明人： Rongqing Dai , Dao Min Zhou , Robert J. Greenberg , John Gord
IPC分类号： A61N1/378
CPC分类号： A61N1/37229 , A61N1/36046 , A61N1/3787
摘要： Methods and devices for inductively coupled implants on the human or animal body are disclosed. An external coil assembly to be used with the implant has a transmitting coil and one or more receiving coils. The number of the receiving coils, their distance from the transmitting coil and their shape is chosen to reduce the influence of a noise signal received by the external coil assembly.
摘要翻译：公开了用于人体或动物体上的电感耦合植入物的方法和装置。与植入物一起使用的外部线圈组件具有发射线圈和一个或多个接收线圈。选择接收线圈的数量，它们与发射线圈的距离及其形状，以减少由外部线圈组件接收的噪声信号的影响。

35. 发明授权

US07904148B2 Biocompatible bonding method and electronics package suitable for implantation 有权
标题翻译：生物相容性接合方法和电子封装适合植入
公开(公告)号：US07904148B2
公开(公告)日：2011-03-08
申请号：US11517860
申请日：2006-09-07
申请人： Robert J. Greenberg , Neil Talbot , Jerry Ok , Jordan Neysmith , Dao Min Zhou
发明人： Robert J. Greenberg , Neil Talbot , Jerry Ok , Jordan Neysmith , Dao Min Zhou
IPC分类号： A61N1/00
CPC分类号： A61N1/3758 , A61N1/0543 , A61N1/36046 , A61N1/375 , H01L21/563 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L24/81 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13169 , H01L2224/13178 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81469 , H01L2224/81478 , H01L2224/81815 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1461 , H05K1/028 , H05K1/0306 , H05K1/09 , H05K1/111 , H05K1/113 , H05K1/115 , H05K1/189 , H05K3/10 , H05K3/188 , H05K3/305 , H05K3/321 , H05K3/328 , H05K3/3436 , H05K3/361 , H05K3/4015 , H05K3/4038 , H05K3/4084 , H05K3/423 , H05K3/4644 , H05K3/4652 , H05K3/4691 , H05K13/0469 , H05K2201/09127 , H05K2201/1028 , H05K2201/10287 , H05K2201/10295 , H05K2201/10977 , H05K2203/05 , H05K2203/06 , H05K2203/0733 , H05K2203/09 , H05K2203/107 , H05K2203/1446 , H01L2924/00 , H01L2224/05599
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
摘要翻译：本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复对某些无意识的个人。密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。所得到的电子装置是生物相容的并且适合长期植入生物体组织。

36. 发明申请

US20080319493A1 Biocompatible electroplated interconnection bonding method and electronics package suitable for implantation 有权
标题翻译：生物相容性电镀互连接合方法和电子封装适合植入
公开(公告)号：US20080319493A1
公开(公告)日：2008-12-25
申请号：US11821327
申请日：2007-06-21
申请人： Dao Min Zhou , James Singleton Little , Robert J. Greenberg
发明人： Dao Min Zhou , James Singleton Little , Robert J. Greenberg
IPC分类号： A61N1/00 , H05K3/46
CPC分类号： H05K3/361 , A61N1/02 , A61N1/36046 , C25D3/567 , C25D3/62 , C25D5/02 , C25D5/18 , C25D5/56 , H05K3/32 , H05K2203/0723
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue. The present invention is directed to a device comprising a substrate containing at least one contact, a flexible assembly containing at least one pad, and electroplated bonding between said contact and said pad that bonds said substrate and said flexible assembly together. The present invention is directed to a method of bonding for implantation a substrate to a flexible assembly, said method comprising the steps of: aligning said substrate and said flexible assembly, whereby there is a common alignment for a contact on said substrate and contact pads on said flexible assembly, and electroplating bonding between said contacts and said pads, thereby bonding said flexible assembly to said substrate.
摘要翻译：本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得的电子封装，其适于植入生物组织，例如用于视网膜或皮层电极阵列，以使视力恢复到某些非目标人士。电气密封的电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。所得到的电子装置是生物相容的并且适合长期植入生物体组织。本发明涉及一种装置，其包括含有至少一个接触件的基板，包含至少一个焊盘的柔性组件以及在所述接触件和所述焊盘之间的电镀接合，将所述基板和所述柔性组件接合在一起。本发明涉及一种用于将衬底植入到柔性组件中的接合方法，所述方法包括以下步骤：对准所述衬底和所述柔性组件，由此存在用于所述衬底上的接触和所述衬底上的接触焊盘的共同对准所述柔性组件，以及所述触头和所述焊盘之间的电镀接合，从而将所述柔性组件粘合到所述衬底上。

37. 发明授权

US09220169B2 Biocompatible electroplated interconnection electronics package suitable for implantation 有权
标题翻译：生物相容性电镀互连电子封装适合植入
公开(公告)号：US09220169B2
公开(公告)日：2015-12-22
申请号：US11821327
申请日：2007-06-21
申请人： Dao Min Zhou , James Singleton Little , Robert J. Greenberg
发明人： Dao Min Zhou , James Singleton Little , Robert J. Greenberg
IPC分类号： A61N1/36 , H05K3/36 , A61N1/02 , C25D3/62 , C25D5/02 , C25D5/18 , C25D5/56 , H05K3/32 , C25D3/56
CPC分类号： H05K3/361 , A61N1/02 , A61N1/36046 , C25D3/567 , C25D3/62 , C25D5/02 , C25D5/18 , C25D5/56 , H05K3/32 , H05K2203/0723
摘要： Device is a hermetically sealed electronics package bonded to an electrode or flexible circuit that is suitable for implantation such as for a retinal or cortical electrode array. The hermetically sealed electronics package is bonded to the electrode or flexible circuit by electroplating a biocompatible material, such as platinum or gold, forming a plated connection, bonding the flexible circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation. The device comprises a substrate containing a contact, a flexible assembly containing a pad, and electroplated bonding between said contact and said pad that bonds said substrate and said flexible assembly together.
摘要翻译：器件是密封的电子封装，其结合到适合于植入的电极或柔性电路，例如用于视网膜或皮质电极阵列。电气密封的电子封装通过电镀生物相容性材料（例如铂或金）而结合到电极或柔性电路上，形成电镀连接，将柔性电路接合到电子封装。所得到的电子器件是生物相容的并且适用于长期植入。该装置包括含有接触件的基板，包含焊盘的柔性组件以及在所述接触件和所述焊盘之间的电镀接合，将所述基板和所述柔性组件接合在一起。

38. 发明授权

US08034229B2 Process for cathodic protection of electrode material 有权
标题翻译：电极材料阴极保护工艺
公开(公告)号：US08034229B2
公开(公告)日：2011-10-11
申请号：US12708358
申请日：2010-02-18
申请人： Dao Min Zhou , Amy Hines , James Singleton Little , Robert J. Greenberg
发明人： Dao Min Zhou , Amy Hines , James Singleton Little , Robert J. Greenberg
IPC分类号： C23F13/04
CPC分类号： C23F13/00 , A61N1/05 , A61N1/08 , C23F13/02
摘要： The invention is a process for cathodic protection of electrodes wherein negative bias is applied on the electrode. The negative bias is obtained by asymmetric current pulse, which is obtained by negative phase pulsing with higher amplitude than that of the anodic phase. The asymmetric current pulse is obtained by negative phase pulsing with wider pulse width than that of the anodic phase. The asymmetric current pulse may also be obtained by negative phase pulsing with both higher amplitude and wider pulse width than that of the anodic phase. The invention further relates to a process for cathodic protection of electrodes, wherein negative bias is applied on the electrode, and the negative bias is obtained by asymmetric current pulse, where the asymmetric current pulse is obtained by negative phase pulsing with wider pulse width than that of the anodic phase. The wider pulse width is obtained by pulse trains.
摘要翻译：本发明是用于对电极进行负偏压的电极的阴极保护方法。通过不对称电流脉冲获得负偏压，其通过负相脉冲以比阳极相高的幅度获得。非对称电流脉冲通过脉冲宽度大于阳极相的脉冲宽度相位来获得。也可以通过负相位脉冲获得不对称电流脉冲，同时具有比阳极相更高的幅度和更宽的脉冲宽度。本发明还涉及一种用于对电极进行阴极保护的方法，其中对电极施加负偏压，并且通过不对称电流脉冲获得负偏压，其中通过具有较宽脉冲宽度的负相脉冲获得非对称电流脉冲，的阳极相。通过脉冲串获得更宽的脉冲宽度。

39. 发明授权

US07638032B2 Process for cathodic protection of electrode materials 有权
标题翻译：电极材料阴极保护工艺
公开(公告)号：US07638032B2
公开(公告)日：2009-12-29
申请号：US11924349
申请日：2007-10-25
申请人： Dao Min Zhou , Amy Hines , James Singleton Little , Robert J. Greenberg
发明人： Dao Min Zhou , Amy Hines , James Singleton Little , Robert J. Greenberg
IPC分类号： C23F13/04
CPC分类号： C23F13/00 , A61N1/05 , A61N1/08 , C23F13/02
摘要： The present invention relates to a process for cathodic protection of electrode or electrode materials wherein negative bias is applied on the electrode. the negative bias is obtained by asymmetric current pulse. The asymmetric current pulse is obtained by performing negative phase with higher amplitude. The asymmetric current pulse is obtained by performing negative phase with wider pulse width than that of the anodic phase. The asymmetric current pulse is obtained by performing negative phase with higher amplitude and with wider pulse width than that of the anodic phase. The present invention further relates to a process for cathodic protection of electrode or electrode materials, wherein negative bias is applied on the electrode, wherein the negative bias is obtained by asymmetric current pulse, wherein the asymmetric current pulse is obtained by performing negative phase with wider pulse width than that of the anodic phase. The wider pulse width is obtained by pulse trains.
摘要翻译：本发明涉及对电极或电极材料进行阴极保护的方法，其中负电极施加在电极上。负偏压通过不对称电流脉冲获得。通过执行具有较高振幅的负相来获得非对称电流脉冲。通过执行具有比阳极相宽的脉冲宽度的负相来获得非对称电流脉冲。通过执行具有更高幅度和宽于脉冲宽度的阳极相的负相位获得非对称电流脉冲。本发明还涉及一种用于对电极或电极材料进行阴极保护的方法，其中在电极上施加负偏压，其中通过不对称电流脉冲获得负偏压，其中非对称电流脉冲通过执行具有更宽的负相脉冲宽度大于阳极相。通过脉冲串获得更宽的脉冲宽度。

40. 发明申请

US20080314506A1 Biocompatible Electroplated Interconnection Bonding Method and Electronics Package Suitable for Implantation 有权
标题翻译：生物相容性电镀互连接合方法和适用于植入的电子封装
公开(公告)号：US20080314506A1
公开(公告)日：2008-12-25
申请号：US11924722
申请日：2007-10-26
申请人： Dao Min Zhou , James Singleton Little , Robert J. Greenberg
发明人： Dao Min Zhou , James Singleton Little , Robert J. Greenberg
IPC分类号： C25D5/00
CPC分类号： H05K3/361 , A61N1/02 , A61N1/36046 , C25D3/567 , C25D3/62 , C25D5/02 , C25D5/18 , C25D5/56 , H05K3/32 , H05K2203/0723
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue. The present invention is directed to a device comprising a substrate containing at least one contact, a flexible assembly containing at least one pad, and electroplated bonding between said contact and said pad that bonds said substrate and said flexible assembly together. The present invention is directed to a method of bonding for implantation a substrate to a flexible assembly, said method comprising the steps of: aligning said substrate and said flexible assembly, whereby there is a common alignment for a contact on said substrate and contact pads on said flexible assembly, and electroplating bonding between said contacts and said pads, thereby bonding said flexible assembly to said substrate.
摘要翻译：本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得的电子封装，其适于植入生物组织，例如用于视网膜或皮层电极阵列，以使视力恢复到某些非目标人士。电气密封的电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。所得到的电子装置是生物相容的并且适合长期植入生物体组织。本发明涉及一种装置，其包括含有至少一个接触件的基板，包含至少一个焊盘的柔性组件以及在所述接触件和所述焊盘之间的电镀接合，将所述基板和所述柔性组件接合在一起。本发明涉及一种用于将衬底植入到柔性组件中的接合方法，所述方法包括以下步骤：对准所述衬底和所述柔性组件，由此存在用于所述衬底上的接触和所述衬底上的接触焊盘的共同对准所述柔性组件，以及所述触头和所述焊盘之间的电镀接合，从而将所述柔性组件粘合到所述衬底上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式