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31. 发明申请

US20070047213A1 Circuit board with multiple layer interconnect and method of manufacture 有权
标题翻译：具有多层互连和制造方法的电路板
公开(公告)号：US20070047213A1
公开(公告)日：2007-03-01
申请号：US11215509
申请日：2005-08-30
申请人： Mark D. Johnson , Michael G. Kelly , Jeffrey P. Tobin , William H. Sisson
发明人： Mark D. Johnson , Michael G. Kelly , Jeffrey P. Tobin , William H. Sisson
IPC分类号： H05K7/00
CPC分类号： H05K3/32 , H05K1/0263 , H05K1/117 , H05K3/1241 , H05K3/245 , H05K3/305 , H05K2203/0126 , H05K2203/1469 , H05K2203/1476
摘要： A circuit board includes a substrate defining a substantially planar surface, a first electrical component, a second electrical component, and an interconnect. The first electrical component is coupled to the substrate. The second electrical component is spaced from the first electrical component and is coupled to the substrate. The interconnect is formed on the substantially planar surface of the substrate and extends between the first electrical component and the second electrical component. The interconnect is formed by at least two layers of a conductive material.
摘要翻译：电路板包括限定基本平坦表面的基板，第一电气部件，第二电气部件和互连。第一电气部件耦合到基板。第二电气部件与第一电气部件间隔开并且耦合到基板。互连形成在基板的基本上平坦的表面上并且在第一电气部件和第二电部件之间延伸。互连由至少两层导电材料形成。

32. 发明授权

US06469007B2 Serotonergic agents 失效
标题翻译：血清素能药物
公开(公告)号：US06469007B2
公开(公告)日：2002-10-22
申请号：US10010575
申请日：2001-11-13
申请人： Wayne E. Childers , Michael G. Kelly , Sharon J. Rosenzweig-Lipson
发明人： Wayne E. Childers , Michael G. Kelly , Sharon J. Rosenzweig-Lipson
IPC分类号： A61K31496
CPC分类号： C07D405/12
摘要： Novel piperazine derivatives are provided having the formula wherein R1 is cyano, nitro, trifluoromethyl or halogen, or pharmaceutically acceptable acid addition salts thereof, which are useful as 5-HT1A receptor antagonists.
摘要翻译：提供了新颖的哌嗪衍生物，其具有R 1为氰基，硝基，三氟甲基或卤素的化学式，或其药学上可接受的酸加成盐，其可用作5-HT 1A受体拮抗剂。

33. 发明授权

US4595628A Soil repellent fluorinated esters of multi-ring anhydride systems 失效
标题翻译：多环酐系统的防污氟化酯
公开(公告)号：US4595628A
公开(公告)日：1986-06-17
申请号：US635764
申请日：1984-07-30
申请人： Michael G. Kelly , Willi R. Steckelberg
发明人： Michael G. Kelly , Willi R. Steckelberg
IPC分类号： C07C69/76 , C07C67/00 , C07C67/26 , C07C227/00 , C07C227/18 , C07C229/62 , C07C231/00 , C07C231/12 , C07C233/18 , C07C253/00 , C07C255/14 , C07C301/00 , C07C303/40 , C07C311/09 , C07C313/00 , C07C315/04 , C07C317/44 , C07C323/62 , D06M13/213 , B05D5/00 , D06M13/20
CPC分类号： C07C69/76 , C07C67/26 , D06M13/213 , Y10S8/04 , Y10S8/21 , Y10T428/2938 , Y10T428/2969 , Y10T442/2287
摘要： Fluorinated esters based on multi-ring anhydride systems are disclosed which have excellent anti-soiling properties, durability and resistance to laundering. The compounds are represented by the formula ##STR1## wherein n is 2 or 3, Q is a linking group such as --CO--, --O--, or (C.sub.a H.sub.2a+2-n --(O.sub.2 C).sub.n, R.sub.f is a fluorinated radical, and R is derived from an epoxide such as ethylene oxide or epichlorohydrin. Also disclosed are polyester and nylon fibers having these compounds incorporated therein, and a process for producing such soil-repellent fibers.
摘要翻译：公开了具有优异的防污性能，耐久性和耐洗涤性的基于多环酐系的氟化酯。化合物由下式表示：其中n为2或3，Q为连接基团，例如-CO - ， - O-或（C 2 H 2 + 2 - 正 - （O 2 C）n），Rf为氟化基团并且R衍生自环氧化物如环氧乙烷或表氯醇，还公开了其中掺入这些化合物的聚酯和尼龙纤维，以及制备这种防污纤维的方法。

34. 发明授权

US4472466A Soil repellent fluorinated esters of multi-ring anhydride systems 失效
标题翻译：多环酐系统的防污氟化酯
公开(公告)号：US4472466A
公开(公告)日：1984-09-18
申请号：US355800
申请日：1982-03-08
申请人： Michael G. Kelly , Willi R. Steckelberg
发明人： Michael G. Kelly , Willi R. Steckelberg
IPC分类号： C07C69/76 , C07C67/00 , C07C67/26 , C07C227/00 , C07C227/18 , C07C229/62 , C07C231/00 , C07C231/12 , C07C233/18 , C07C253/00 , C07C255/14 , C07C301/00 , C07C303/40 , C07C311/09 , C07C313/00 , C07C315/04 , C07C317/44 , C07C323/62 , D06M13/213 , B05D5/00 , C07C147/107 , C07C149/40
CPC分类号： C07C69/76 , C07C67/26 , D06M13/213 , Y10S8/04 , Y10S8/21 , Y10T428/2938 , Y10T428/2969 , Y10T442/2287
摘要： Fluorinated esters based on multi-ring anhydride systems are disclosed which have excellent anti-soiling properties, durability and resistance to laundering. The compounds are represented by the formula ##STR1## wherein n is 2 or 3, Q is a linking group such as --CO--, --O--, or (C.sub.a H.sub.2a+2-n --(O.sub.2 C).sub.n, R.sub.f is a fluorinated radical, and R is derived from an epoxide such as ethylene oxide or epichlorohydrin. Also disclosed are polyester and nylon fibers having these compounds incorporated therein, and a process for producing such soil-repellent fibers.
摘要翻译：公开了具有优异的防污性能，耐久性和耐洗涤性的基于多环酐系的氟化酯。化合物由下式表示：其中n为2或3，Q为连接基团，例如-CO - ， - O-或（C 2 H 2 + 2 - 正 - （O 2 C）n），Rf为氟化基团并且R衍生自环氧化物如环氧乙烷或表氯醇，还公开了其中掺入这些化合物的聚酯和尼龙纤维，以及制备这种防污纤维的方法。

35. 发明授权

US4332326A Plastic netting for load unitization 失效
标题翻译：塑料网用于负载整合
公开(公告)号：US4332326A
公开(公告)日：1982-06-01
申请号：US139131
申请日：1980-04-10
申请人： Michael G. Kelly , Eugene R. Pastien
发明人： Michael G. Kelly , Eugene R. Pastien
IPC分类号： B65D71/00 , B65D77/08 , B65D6/08 , B65D19/00 , B65D85/62
CPC分类号： B65D71/0096 , B65D2571/0003
摘要： An improved wrapping material for palletized loads which are tension wrapped is disclosed. A plastic net material comprising the plurality of sets of strands, the strands of at least one said set being substantially parallel, is oriented along said one said set to have a stretch factor of less than 15% in the oriented direction. This net is used for wrapping about pelletized loads and gives substantially improved results over known plastic net materials used in tension wrapping of palletized loads.
摘要翻译：公开了一种用于被张紧包装的码垛负载的改进的包装材料。一种塑料网材料，其包括多组股线，所述至少一个所述套组的股线基本上平行，沿着所述一个所述组定向，以在取向方向上具有小于15％的拉伸系数。该网用于围绕颗粒状负载包装，并且对于用于堆垛货物的张力包裹的已知塑料网材料提供了显着改进的结果。

36. 发明授权

US3941975A Glass panel circuit breaker 失效
标题翻译：玻璃面板断路器
公开(公告)号：US3941975A
公开(公告)日：1976-03-02
申请号：US565634
申请日：1975-04-07
申请人： Irvin Newman , Michael G. Kelly
发明人： Irvin Newman , Michael G. Kelly
IPC分类号： H02H5/10 , H03K17/725 , H03K17/94 , H05B3/00 , H05B3/84 , H05B1/02 , H05B3/06
CPC分类号： H02H5/10 , H03K17/725 , H03K17/94 , H05B3/00 , H05B3/84
摘要： A frangible panel having an electrically-energizable layer carried in an area thereof for heating the panel and main circuit means for supplying electrical power to the layer is provided with circuit breaker means operable to interrupt electrical power to the layer upon breakage of the panel. The circuit breaker means includes a fusible link connected in series with the layer and a solid-state control device connected in the main circuit in parallel with the layer. The solid-state device has a control gate which is connected to a sensing circuit surrounding the electrically-energizable layer and which is connected in the main circuit to render the solid-state control device non-conductive as long as the sensing strip is continuous and to render the solid-state control device conductive when the sensing circuit is broken. Thus, the solid-state control device connects the fusible link to ground and causes the link to blow, thereby interrupting power to the electrically-energized layer.
摘要翻译：具有在其区域中承载用于加热面板的可电激励层的易碎面板和用于向层提供电力的主电路装置设置有可在面板断裂时中断电层的电力的断路器装置。断路器装置包括与该层串联连接的熔断链路和与主电路并联连接的固态控制装置。固态器件具有控制栅极，其连接到围绕电可激励层的感测电路，并且其连接在主电路中以使固态控制器件不导电，只要感测条带是连续的，当感测电路断开时使固态控制装置导通。因此，固态控制装置将可熔接头连接到地，并使连杆发生吹气，从而中断通电层的电力。

37. 发明授权

US09040349B2 Method and system for a semiconductor device package with a die to interposer wafer first bond 有权
标题翻译：一种半导体器件封装的方法和系统，其具有管芯至插入件晶片第一接合
公开(公告)号：US09040349B2
公开(公告)日：2015-05-26
申请号：US13678046
申请日：2012-11-15
申请人： Michael G. Kelly , Ronald Patrick Huemoeller , Won Chul Do , David Jon Hiner
发明人： Michael G. Kelly , Ronald Patrick Huemoeller , Won Chul Do , David Jon Hiner
IPC分类号： H01L21/50
CPC分类号： H01L23/49827 , H01L21/486 , H01L21/50 , H01L21/561 , H01L21/6836 , H01L21/78 , H01L23/147 , H01L23/3128 , H01L23/3135 , H01L23/3675 , H01L23/49805 , H01L23/49816 , H01L23/49838 , H01L23/5384 , H01L24/13 , H01L24/75 , H01L24/81 , H01L24/97 , H01L25/0655 , H01L25/16 , H01L25/50 , H01L27/108 , H01L2221/68381 , H01L2224/13147 , H01L2224/29011 , H01L2224/73104 , H01L2224/73204 , H01L2224/73253 , H01L2224/75704 , H01L2224/75744 , H01L2224/7598 , H01L2224/81005 , H01L2224/8114 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/83192 , H01L2224/83203 , H01L2224/83862 , H01L2224/9211 , H01L2224/97 , H01L2924/12042 , H01L2924/3511 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： Methods and systems for a semiconductor device package with a die to interposer wafer first bond are disclosed and may include bonding a plurality of semiconductor die comprising electronic devices to an interposer wafer, and applying an underfill material between the die and the interposer wafer. A mold material may be applied to encapsulate the die. The interposer wafer may be thinned to expose through-silicon-vias (TSVs) and metal contacts may be applied to the exposed TSVs. The interposer wafer may be singulated to generate assemblies comprising the semiconductor die and an interposer die. The die may be placed on the interposer wafer utilizing an adhesive film. The interposer wafer may be singulated utilizing one or more of: a laser cutting process, reactive ion etching, a sawing technique, and a plasma etching process. The die may be bonded to the interposer wafer utilizing a mass reflow or a thermal compression process.
摘要翻译：公开了具有管芯到插入件晶片第一接合的半导体器件封装的方法和系统，并且可以包括将包括电子器件的多个半导体管芯结合到插入器晶片，以及在管芯和插入器晶片之间施加底部填充材料。可以应用模具材料来封装模具。内插器晶片可以被薄化以暴露通过硅通孔（TSV），并且可以将金属触点施加到暴露的TSV。内插器晶片可以被单个化以产生包括半导体管芯和插入器管芯的组件。可以使用粘合剂膜将管芯放置在插入件晶片上。可以使用激光切割工艺，反应离子蚀刻，锯切技术和等离子体蚀刻工艺中的一种或多种来切割插入器晶片。可以使用质量回流或热压缩工艺将管芯结合到插入件晶片。

38. 发明授权

US08653091B2 Pyrid-2yl fused heterocyclic compounds, and compositions and uses thereof 有权
标题翻译：吡啶-2-基稠合杂环化合物及其组合物和用途
公开(公告)号：US08653091B2
公开(公告)日：2014-02-18
申请号：US12594364
申请日：2008-03-31
申请人： Zhi-Liang Wei , John Kincaid , Michael G. Kelly , Donogh John Roger O'Mahony , Carl Kaub
发明人： Zhi-Liang Wei , John Kincaid , Michael G. Kelly , Donogh John Roger O'Mahony , Carl Kaub
IPC分类号： C07D471/04 , A61K31/519 , A61P19/02 , A61P25/16 , A61P25/28 , A61P11/06 , A61P9/10 , A61P25/18 , A61P25/24
CPC分类号： C07D471/04
摘要： Fused heterocyclic compounds are provided according to formula 1a or 1b: where R1, R2, and R3 are as defined herein. Provided compounds and pharmaceutical compositions thereof are useful for the prevention and treatment of a variety of conditions in mammals including humans, including by way of non-limiting example, pain, inflammation, cognitive disorders, anxiety, depression, and others.
摘要翻译：根据式1a或1b提供稠合的杂环化合物：其中R 1，R 2和R 3如本文所定义。提供的化合物及其药物组合物可用于预防和治疗包括人在内的哺乳动物中的各种病症，包括作为非限制性实例，疼痛，炎症，认知障碍，焦虑，抑郁等。

39. 发明授权

US08508023B1 System and method for lowering contact resistance of the radio frequency (RF) shield to ground 有权
标题翻译：降低射频（RF）屏蔽接地电阻的系统和方法
公开(公告)号：US08508023B1
公开(公告)日：2013-08-13
申请号：US12817923
申请日：2010-06-17
申请人： Michael G. Kelly , John Cambas , Francis Tan , Pam Montero
发明人： Michael G. Kelly , John Cambas , Francis Tan , Pam Montero
IPC分类号： H01L23/552 , H01L23/04 , H01L23/24 , H01L21/00
CPC分类号： H01L23/552 , H01L21/561 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2224/81 , H01L2224/85 , H01L2924/00
摘要： A semiconductor device has a substrate having a plurality of metal traces. A die is electrically attached to a first surface of the substrate. A first plurality of segmented metal traces is formed around a perimeter of the first surface of the substrate, wherein an end section of the first plurality of segmented metal traces is exposed. A mold compound is used for encapsulating the semiconductor device. A first metal plating is formed on a top terminal end section of the first plurality of segmented metal traces. The first metal plating is spread to at least one of the mold compound or the exposed end sections of the first plurality of segmented metal traces. A conductive coating is applied to the mold compound, the exposed end sections of the first plurality of segmented metal traces and to the first metal plating.
摘要翻译：半导体器件具有具有多个金属迹线的衬底。模具电连接到基板的第一表面。在基板的第一表面的周边周围形成有第一多个分段金属迹线，其中暴露第一多个分段金属迹线的端部。模具化合物用于封装半导体器件。在第一多个分段金属迹线的顶部末端部分上形成第一金属电镀。第一金属电镀被扩散到第一多个分段金属迹线中的至少一个模具化合物或暴露端部。将导电涂层施加到模具化合物，第一多个分段金属迹线的暴露端部和第一金属电镀。

40. 发明授权

US08334317B2 Calcium receptor modulating agents 有权
标题翻译：钙受体调节剂
公开(公告)号：US08334317B2
公开(公告)日：2012-12-18
申请号：US12738279
申请日：2008-10-15
申请人： Thomas S. Coulter , Christopher H. Fotsch , Chiara Ghiron , Paul E. Harrington , Michael G. Kelly , Philip Miller , Gilbert M. Rishton , David J. St. Jean, Jr. , David J. Semin
发明人： Thomas S. Coulter , Christopher H. Fotsch , Chiara Ghiron , Paul E. Harrington , Michael G. Kelly , Philip Miller , Gilbert M. Rishton , David J. St. Jean, Jr. , David J. Semin
IPC分类号： A61K31/41 , A61K31/4439 , C07D401/12
CPC分类号： C07D233/64 , C07D207/335 , C07D207/48 , C07D231/12 , C07D231/16 , C07D231/22 , C07D261/08 , C07D271/06 , C07D277/28 , C07D401/04
摘要： The present invention relates generally to novel calcimimetic compounds and pharmaceutical compositions comprising them. The invention also relates to methods of treating of diseases or disorders related to the function of the calcium sensing receptor using the compounds represented in Formula I.
摘要翻译：本发明一般涉及新型的拟钙化合物和包含它们的药物组合物。本发明还涉及使用式I表示的化合物治疗与钙感受受体的功能相关的疾病或病症的方法。

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