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    • 32. 发明申请
    • Dual doped gates
    • 双掺杂栅极
    • US20050032295A1
    • 2005-02-10
    • US10931410
    • 2004-08-31
    • Howard Rhodes
    • Howard Rhodes
    • H01L21/265H01L21/8238
    • H01L21/2652H01L21/823842H01L21/823892
    • A method of forming an integrated circuit dual gate structure using only one mask is disclosed. In one embodiment, a substrate is prepared for the fabrication of a dual gate structure, a first gate structure having an NWELL is formed without using a mask, and a second gate structure having a PWELL is formed using only one mask. In an alternate embodiment, a substrate is prepared for the fabrication of a dual gate structure, a first gate structure having a PWELL is formed without using a mask, and a second gate structure having an NWELL is formed using only one mask.
    • 公开了仅使用一个掩模形成集成电路双栅极结构的方法。 在一个实施例中,制备用于制造双栅极结构的衬底,在不使用掩模的情况下形成具有NWELL的第一栅极结构,并且仅使用一个掩模形成具有PWELL的第二栅极结构。 在替代实施例中,准备用于制造双栅极结构的衬底,在不使用掩模的情况下形成具有PWELL的第一栅极结构,并且仅使用一个掩模形成具有NWELL的第二栅极结构。
    • 33. 发明授权
    • Multiple species sputtering for improved bottom coverage and improved
sputter rate
    • 用于改善底部覆盖和改善溅射速率的多种溅射
    • US6083358A
    • 2000-07-04
    • US53354
    • 1998-04-01
    • P. J. IrelandHoward RhodesSujit SharanSukesh SandhuTim O'BrienTim Johnson
    • P. J. IrelandHoward RhodesSujit SharanSukesh SandhuTim O'BrienTim Johnson
    • C23C14/04C23C14/35H01L21/762H01L21/768C23C14/34
    • C23C14/35C23C14/046H01L21/762H01L21/76877
    • An improved sputtering process increases the perpendicularity of the sputtered flux to the target surface by bombarding the target with both low and high mass ions, with low mass ions predominating, packing the target with both low and high mass implanted ions, and causing target atoms ejected as a result of high mass incident ions to have a higher probability of perpendicular or near perpendicular ejection. An alternative improved sputtering process bombards the target with both low and high mass ions, with high mass ions predominating, resulting in a higher sputter rate than achievable with either the high or low mass species alone. Including in either process as the high or the low mass species a species having a lower ionization energy than a standard species allows a reduced pressure plasma, resulting in less scattering of the sputtered flux. A low ionization energy species may also be employed to assist in striking a plasma before sputtering by a single species during deposition.
    • 改进的溅射工艺通过以低质量离子和高质量离子轰击靶,通过以低质量离子为主来增加溅射通量对目标表面的垂直度,用低质量和高质量注入离子填充目标,并引起目标原子喷出 作为高质量入射离子的结果具有更高的垂直或近似垂直喷射的概率。 一种替代的改进的溅射工艺用低和高质量离子轰击靶,以高质量离子为主,导致比单独使用高质量或低质量物质可实现的更高的溅射速率。 在任一过程中,作为高质量或低质量物质,具有比标准物质更低的电离能的物质允许减压等离子体,导致溅射通量的较少散射。 也可以使用低电离能种来在沉积期间通过单一物质在溅射之前帮助击打等离子体。
    • 39. 发明申请
    • RESONATOR FOR THERMO OPTIC DEVICE
    • 热电偶装置谐振器
    • US20080089647A1
    • 2008-04-17
    • US11951796
    • 2007-12-06
    • Gurtej SandhuGuy BlalockHoward Rhodes
    • Gurtej SandhuGuy BlalockHoward Rhodes
    • G02B6/26
    • G02B6/132G02B6/12004G02B6/12007G02B6/136G02F1/011G02F1/0147G02F2203/15
    • A resonator for thermo optic devices is formed in the same process steps as a waveguide and is formed in a depression of a lower cladding while the waveguide is formed on a surface of the lower cladding. Since upper surfaces of the resonator and waveguide are substantially coplanar, the aspect ratio, as between the waveguide and resonator in an area where the waveguide and resonator front one another, decreases thereby increasing the bandwidth of the resonator. The depression is formed by photomasking and etching the lower cladding before forming the resonator and waveguide. Pluralities of resonators are also taught that are formed in a plurality of depressions of the lower cladding. To decrease resonator bandwidth, waveguide(s) are formed in the depression(s) of the lower cladding while the resonator is formed on the surface. Thermo optic devices formed with these resonators are also taught.
    • 用于热光器件的谐振器以与波导相同的工艺步骤形成,并且形成在下包层的凹陷中,同时波导形成在下包层的表面上。 由于谐振器和波导的上表面基本上是共面的,因此在波导和谐振器彼此前向的区域中的波导和谐振器之间的纵横比减小,从而增加了谐振器的带宽。 在形成谐振器和波导之前,通过光掩模和蚀刻下部包层形成凹陷。 还教导了形成在下部包层的多个凹部中的多个谐振器。 为了减小谐振器带宽,当在表面上形成谐振器时,在下包层的凹陷中形成波导。 还教导了用这些谐振器形成的热光器件。