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    • 32. 发明授权
    • System for the photoelectrochemical etching of silicon in an anhydrous
environment
    • 在无水环境下进行硅光电化学蚀刻的系统
    • US5431766A
    • 1995-07-11
    • US278658
    • 1994-09-02
    • Eric K. PropstPaul A. Kohl
    • Eric K. PropstPaul A. Kohl
    • C25F3/12C25F3/14H01L21/3063C23F1/02
    • H01L21/3063C25F3/12C25F3/14
    • The photoelectrochemical oxidation and dissolution of silicon (Si) is performed in the absence of water and oxygen. Etch rates and photocurrents in an anhydrous HF-acetonitrile (MeCN) solution are directly proportional to light intensity up to at least 600 mW/cm2, producing a spatially selective etch rate of greater than 4 .mu.m/min. Four electron transfer reactions per silicon molecule occur with a quantum yield greater than 3.3 due to electron injection from high energy reaction intermediates. Further, the electrochemical oxidation of p-doped silicon in HF-MeCN results in the formation of porous silicon which electroluminescence in an aqueous solution. In an aprotic electrolyte, where tetrabutylammonium tetrafluoroborate (TBAFB) is used as both the supporting electrolyte and source of fluoride in MeCN, photo-induced etching of n-doped silicon occurs at quantum efficiency of 1.9. This indicates that the oxidation and dissolution mechanism of Si in MeCN can occur without protons.
    • 硅(Si)的光电化学氧化和溶解在没有水和氧的情况下进行。 在无水HF-乙腈(MeCN)溶液中的蚀刻速率和光电流与高达至少600mW / cm 2的光强度成正比,产生大于4μm/ min的空间选择性蚀刻速率。 由于高能反应中间体的电子注入,每硅分子发生四个电子转移反应,其量子产率大于3.3。 此外,p-doped硅在HF-MeCN中的电化学氧化导致在水溶液中电致发光的多孔硅的形成。 在非质子电解质中,使用四丁基铵四氟硼酸盐(TBAFB)作为MeCN中的支持电解质和氟化物源,对n掺杂硅的光致蚀刻以量子效率为1.9发生。 这表明Si在MeCN中的氧化和溶解机理不会发生质子。