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31. 发明申请

US20070224800A1 PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件的生产方法
公开(公告)号：US20070224800A1
公开(公告)日：2007-09-27
申请号：US11689133
申请日：2007-03-21
申请人： Kei Miyoshi
发明人： Kei Miyoshi
IPC分类号： H01L21/44 , H01L21/31 , H01L21/469
CPC分类号： H01L24/83 , C08G77/12 , C08G77/20 , C08L83/04 , H01L24/29 , H01L24/85 , H01L24/92 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/83192 , H01L2224/8385 , H01L2224/85 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01024 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , C08L83/00 , H01L2924/0715 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A method for producing a semiconductor device that uses a silicone-based die bonding material with high heat resistance and a low elastic modulus is provide. The method includes the steps of: applying a heat-curable silicone-based die bonding material to a substrate, placing a semiconductor element on the coated surface of the substrate, heating and curing the heat-curable silicone-based die bonding material, removing low molecular weight siloxane components adhered to the semiconductor element, and subsequently conducting wire bonding. The adverse effects of low molecular weight siloxanes are suppressed, and highly reliable wire bonding is attained.
摘要翻译：提供一种制造使用具有高耐热性和低弹性模量的硅酮模片接合材料的半导体器件的方法。该方法包括以下步骤：将可热固化的硅氧烷基管芯接合材料施加到基板上，将半导体元件放置在基板的涂覆表面上，加热和固化可热固化的硅酮基管芯接合材料，去除低分子量的硅氧烷组分粘附到半导体元件上，随后导电引线键合。低分子量硅氧烷的不良影响被抑制，可获得高可靠性的引线接合。

32. 发明授权

US6040361A Organopolysiloxane compositions 失效
标题翻译：有机聚硅氧烷组合物
公开(公告)号：US6040361A
公开(公告)日：2000-03-21
申请号：US193850
申请日：1998-11-18
申请人： Hironao Fujiki , Kei Miyoshi , Hironobu Muramatsu
发明人： Hironao Fujiki , Kei Miyoshi , Hironobu Muramatsu
IPC分类号： C08K5/00 , C08K9/10 , C08L83/07 , C08G77/08
CPC分类号： C08K5/0025 , C08K9/10
摘要： More than about 9/10 (by weight as a platinum group metal atom) of the necessary amount of a platinum group metal catalyst enclosed in a compound having a melting or softening point of 40-200.degree. C., less than about 1/10 (by weight as a platinum group metal atom) of the necessary amount of a platinum group metal catalyst, and an addition reaction retarder are blended in an organopolysiloxane composition comprising an organopolysiloxane containing alkenyl or hydroxyl radicals and an organohydrogenpolysiloxane. The composition has improved shelf stability, an increased pot life, good curing capability, and fast curing upon heating.
摘要翻译：大于+ E，fra 9/10 + EE（以铂族金属原子计的重量）所需量的铂族金属催化剂，其包含在熔点或软化点为40-200℃的化合物中，将必要量的铂族金属催化剂的小于约+ E，1/10 + EE（作为铂族金属原子的重量）和加成反应延迟剂共混在包含含有烯基的有机聚硅氧烷或羟基自由基和有机氢聚硅氧烷。该组合物具有改善的贮存稳定性，适用期延长，固化能力好，加热快速固化。

33. 发明授权

US5561184A Room temperature curable silicone composition 失效
标题翻译：室温固化硅酮组合物
公开(公告)号：US5561184A
公开(公告)日：1996-10-01
申请号：US246614
申请日：1994-05-20
申请人： Kei Miyoshi , Yoshifumi Harada
发明人： Kei Miyoshi , Yoshifumi Harada
IPC分类号： C09J183/04 , C08K5/5419 , C08L83/04 , C08L83/06 , C09J7/02 , C09J183/05 , C08K3/26
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/46
摘要： A room temperature curable silicone composition, comprising (A) 100 parts by weight of an organopolysiloxane each of both ends of which has one hydroxyl group, (B) 0.2 to 40 parts by weight of at least one compound selected from the group consisting of hydrolyzable silanes having 2 to 4 hydrolyzable groups and their partial hydrolysis-condensation products, (C) 1 to 100 parts by weight of a modified diorganopolysiloxane of which both ends have at least one group selected from the group consisting of a hydrogen atom, a substituted monovalent hydrocarbon group and alkoxy group having 1 to 10 carbon atoms, an unsubstituted hydrocarbon group and alkoxy group having 1 to 10 carbon atoms, and a hydroxyl group and that has a silicon-bonded modifying group made up of a substituted or unsubstituted monovalent organic group with 6 or more carbon atoms, and (D) a filler and a cured product thereof. A cured product good in peeling properties can be obtained.
摘要翻译：一种室温固化性有机硅组合物，其包含（A）100重量份的两末端具有一个羟基的有机聚硅氧烷，（B）0.2〜40重量份的至少一种选自可水解的具有2至4个可水解基团的硅烷及其部分水解缩合产物，（C）1至100重量份的改性二有机基聚硅氧烷，其两端具有至少一个选自氢原子，取代的一价具有1-10个碳原子的烃基和烷氧基，未取代的烃基和具有1-10个碳原子的烷氧基，和羟基，并且具有由取代或未取代的一价有机基团构成的与硅键合的改性基团与 6个或更多个碳原子，和（D）填料及其固化产物。可以得到剥离性良好的固化物。

34. 发明授权

US07595113B2 LED devices and silicone resin composition therefor 有权
标题翻译： LED器件及其有机硅树脂组合物
公开(公告)号：US07595113B2
公开(公告)日：2009-09-29
申请号：US11137358
申请日：2005-05-26
申请人： Kei Miyoshi
发明人： Kei Miyoshi
IPC分类号： C08G77/08
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , H01L23/296 , H01L33/56 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/73265 , Y10T428/31663 , C08L83/00 , C08L2666/52 , H01L2924/00
摘要： LED devices encapsulated with silicone resin compositions comprising (A) a silicone resin having at least two alkenyl groups bonded to silicon atoms in a molecule, (B) an organohydrogensilane and/or organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicon atoms in a molecule, and (C) an addition reaction catalyst which cure into transparent products having heat resistance and discoloration resistance.
摘要翻译：用硅氧烷树脂组合物封装的LED装置，其包含（A）在分子中具有至少两个与硅原子键合的烯基的有机硅树脂，（B）分子中具有至少两个与硅原子键合的氢原子的有机氢硅烷和/或有机氢聚硅氧烷，和（C）加成反应催化剂，其固化成具有耐热性和耐变色性的透明产品。

35. 发明申请

US20080213578A1 HEAT CONDUCTIVE SILICONE GREASE COMPOSITION AND CURED PRODUCT THEREOF 审中-公开
标题翻译：导热硅脂润滑脂组合物及其固化产品
公开(公告)号：US20080213578A1
公开(公告)日：2008-09-04
申请号：US11776124
申请日：2007-07-11
申请人： Akihiro Endo , Kei Miyoshi , Kunihiro Yamada
发明人： Akihiro Endo , Kei Miyoshi , Kunihiro Yamada
IPC分类号： B32B27/04 , C08K3/08 , C08K3/28 , C08K3/22 , B05D3/02
CPC分类号： C09K5/14 , C08G77/12 , C08G77/14 , C08G77/18 , C08G77/20 , C08K3/22 , C08K5/5419 , C08K5/56 , C08K2201/001 , C08L83/00 , C08L83/04 , C10M169/044 , C10M2201/041 , C10M2201/05 , C10M2201/061 , C10M2201/062 , C10M2227/04 , C10M2229/04 , C10M2229/0405 , C10M2229/043 , C10M2229/044 , C10N2210/07 , C10N2220/022 , C10N2230/02 , C10N2230/08 , C10N2240/20 , C10N2240/202 , C10N2250/10 , H01L23/3737 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/01322 , Y10T428/263 , Y10T428/31663
摘要： Provided is a heat conductive silicone grease composition, including: an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, an alkoxysilane containing specific substituent groups, an organohydrogenpolysiloxane containing 2 or more SiH groups within each molecule, a heat conductive filler, a platinum-based catalyst, and an addition reaction retarder. The heat conductive silicone grease composition exhibits high thermal conductivity, has excellent fluidity prior to curing and therefore exhibits favorable workability, is capable of filling fine indentations and therefore reduces contact resistance, and is also able to prevent oil separation and bleeding of the heat conductive material following curing, meaning the composition exhibits excellent heat radiation performance and reliability. Also, the heat conductive silicone grease composition exhibits improved durability under conditions of high temperature and high humidity, and thereby exhibits further improved reliability during actual use.
摘要翻译：本发明提供一种导热硅脂组合物，其包含：含有2个以上与各原子中的硅原子键合的烯基的有机聚硅氧烷，具有特定结构的有机聚硅氧烷，25℃下的运动粘度为10〜10,000mm

36. 发明申请

US20080099139A1 Method for sealing microcomponent 审中-公开
标题翻译：密封微量组件的方法
公开(公告)号：US20080099139A1
公开(公告)日：2008-05-01
申请号：US11898467
申请日：2007-09-12
申请人： Kei Miyoshi , Naoki Yamahawa
发明人： Kei Miyoshi , Naoki Yamahawa
IPC分类号： B32B7/14
CPC分类号： H01L23/3121 , H01L23/296 , H01L33/54 , H01L2924/0002 , H01L2924/09701 , H01L2924/19041 , H01L2933/005 , H01L2924/00
摘要： A microcomponent on a substrate is sealed with a liquid silicone composition in the cured state by forming a channel or recess in a substrate, placing a microcomponent at the center of the channel-delimited region or recess, applying a droplet of liquid silicone composition so that the droplet is delimited by the perimeter of the channel or recess and held in a convex shape by the surface tension of the liquid, and curing the liquid silicone composition.
摘要翻译：在固化状态下，通过在衬底中形成通道或凹槽将基底上的微组件密封在液态硅氧烷组合物上，将微量组分置于通道界定区域或凹槽的中心，施加液体硅氧烷组合物液滴使得液滴由通道或凹槽的周边界定，并通过液体的表面张力保持为凸形，并固化液体硅酮组合物。

37. 发明授权

US07323250B2 Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor device 有权
标题翻译：可固化硅树脂组合物，光半导体用密封材料和光半导体装置
公开(公告)号：US07323250B2
公开(公告)日：2008-01-29
申请号：US11087599
申请日：2005-03-24
申请人： Eiichi Tabei , Kei Miyoshi
发明人： Eiichi Tabei , Kei Miyoshi
IPC分类号： B32B9/04 , C08L83/04
CPC分类号： H01L23/296 , C08G77/045 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08K5/13 , C08K5/3435 , C08L83/04 , H01L2924/0002 , Y10T428/31663 , C08L83/00 , C08L2666/28 , H01L2924/00
摘要： Provided is a curable silicone resin composition including (A) a siloxane-based compound containing at least 2 addition reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) a hydrosilylation reaction catalyst, (D) a phenol-based antioxidant, and (E) a hindered amine compound. Also provided are an optical semiconductor sealing material including such a composition, and an optical semiconductor device that has been sealed with such a composition. The curable silicone composition generates a cured product with high hardness and strength, excellent transparency, and excellent light transmittance and photostability particularly in the short wavelength region.
摘要翻译：提供一种可固化的有机硅树脂组合物，其包含（A）在每个分子内含有至少2个加成反应性碳 - 碳双键的硅氧烷基化合物，（B）含有至少2个与硅原子键合的氢原子的硅氧烷基化合物每个分子，（C）氢化硅烷化反应催化剂，（D）苯酚类抗氧化剂和（E）受阻胺化合物。还提供了包括这种组合物的光学半导体密封材料和已经用这种组合物密封的光学半导体器件。可固化硅氧烷组合物产生具有高硬度和强度，优异的透明度和优异的透光率和光稳定性的固化产物，特别是在短波长区域。

38. 发明申请

US20070149834A1 HEAT CONDUCTIVE SILICONE GREASE COMPOSITIONS 有权
标题翻译：导热硅脂润滑脂组合物
公开(公告)号：US20070149834A1
公开(公告)日：2007-06-28
申请号：US11616185
申请日：2006-12-26
申请人： Akihiro Endo , Kei Miyoshi , Kunihiro Yamada , Hiroaki Kizaki
发明人： Akihiro Endo , Kei Miyoshi , Kunihiro Yamada , Hiroaki Kizaki
IPC分类号： A23J7/00 , C10L1/16
CPC分类号： C10M169/02 , C08G77/14 , C08G77/18 , C08G77/20 , C08K3/013 , C08K5/5419 , C08L83/04 , C10M111/04 , C10M2201/0416 , C10M2201/0606 , C10M2201/0616 , C10M2201/0626 , C10M2201/1013 , C10M2203/0213 , C10M2203/102 , C10M2227/04 , C10M2227/045 , C10M2229/0415 , C10M2229/0425 , C10M2229/0435 , C10M2229/0445 , C10M2229/0455 , C10M2229/0465 , C10M2229/0485 , C10N2210/01 , C10N2210/02 , C10N2210/03 , C10N2210/04 , C10N2210/08 , C10N2220/022 , C10N2220/082 , C10N2230/08 , C10N2240/20 , C10N2240/201 , C10N2240/202 , C10N2250/10 , H01L23/3737 , H01L2924/0002 , C08L2666/44 , C08L2666/54 , H01L2924/00
摘要： Provided is a heat conductive silicone grease composition, including: (A) 100 parts by volume of an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, (B) 0.1 to 50 parts by volume of an alkoxysilane with a specific structure, and (C) 100 to 2,500 parts by volume of a heat conductive filler. The composition exhibits high thermal conductivity, retains excellent fluidity meaning the composition exhibits favorable workability, and is capable of filling fine indentations, thereby reducing contact resistance and providing excellent heat radiation performance. Also, the durability, under conditions of high temperature and high humidity, of the composition is improved, thereby improving the reliability of the composition during actual use. Heat generated by a heat-generating body can be dissipated into a heat-radiating body by sandwiching the composition between the heat-generating body and the heat-radiating body.
摘要翻译：提供一种导热硅脂组合物，其包括：（A）100体积％的具有特定结构并且在25℃下的运动粘度为10至10,000mm 2的有机聚硅氧烷，（B）0.1〜50体积份的具有特定结构的烷氧基硅烷，（C）100〜2,500体积份的导热性填料。该组合物显示出高导热性，保持了优异的流动性，这意味着组合物表现出良好的加工性，并且能够填充细小的凹痕，从而降低接触电阻并提供优异的散热性能。此外，在高温高湿条件下的组合物的耐久性得到改善，从而提高了实际使用中组合物的可靠性。由发热体产生的热量可以通过将组合物夹在发热体和散热体之间而散发到散热体中。

39. 发明申请

US20050213926A1 Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor device 有权
标题翻译：可固化硅树脂组合物，光半导体用密封材料和光半导体装置
公开(公告)号：US20050213926A1
公开(公告)日：2005-09-29
申请号：US11087599
申请日：2005-03-24
申请人： Eiichi Tabei , Kei Miyoshi
发明人： Eiichi Tabei , Kei Miyoshi
IPC分类号： C08L83/07 , C08K5/13 , C08K5/3435 , C08L83/05 , G02B6/00 , H01L23/29 , H01L23/31
CPC分类号： H01L23/296 , C08G77/045 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08K5/13 , C08K5/3435 , C08L83/04 , H01L2924/0002 , Y10T428/31663 , C08L83/00 , C08L2666/28 , H01L2924/00
摘要： Provided is a curable silicone resin composition including (A) a siloxane-based compound containing at least 2 addition reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) a hydrosilylation reaction catalyst, (D) a phenol-based antioxidant, and (E) a hindered amine compound. Also provided are an optical semiconductor sealing material including such a composition, and an optical semiconductor device that has been sealed with such a composition. The curable silicone composition generates a cured product with high hardness and strength, excellent transparency, and excellent light transmittance and photostability particularly in the short wavelength region.
摘要翻译：提供一种可固化的有机硅树脂组合物，其包含（A）在每个分子内含有至少2个加成反应性碳 - 碳双键的硅氧烷基化合物，（B）含有至少2个与硅原子键合的氢原子的硅氧烷基化合物每个分子，（C）氢化硅烷化反应催化剂，（D）苯酚类抗氧化剂和（E）受阻胺化合物。还提供了包括这种组合物的光学半导体密封材料和已经用这种组合物密封的光学半导体器件。可固化硅氧烷组合物产生具有高硬度和强度，优异的透明度和优异的透光率和光稳定性的固化产物，特别是在短波长区域。

40. 发明申请

US20050212008A1 LED devices and silicone resin composition therefor 有权
标题翻译： LED器件及其有机硅树脂组合物
公开(公告)号：US20050212008A1
公开(公告)日：2005-09-29
申请号：US11137358
申请日：2005-05-26
申请人： Kei Miyoshi
发明人： Kei Miyoshi
IPC分类号： H01L33/56 , H01L33/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , H01L23/296 , H01L33/56 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/73265 , Y10T428/31663 , C08L83/00 , C08L2666/52 , H01L2924/00
摘要： LED devices encapsulated with silicone resin compositions comprising (A) a silicone resin having at least two alkenyl groups bonded to silicon atoms in a molecule, (B) an organohydrogensilane and/or organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicon atoms in a molecule, and (C) an addition reaction catalyst which cure into transparent products having heat resistance and discoloration resistance.
摘要翻译：用硅氧烷树脂组合物封装的LED装置，其包含（A）在分子中具有至少两个与硅原子键合的烯基的有机硅树脂，（B）分子中具有至少两个与硅原子键合的氢原子的有机氢硅烷和/或有机氢聚硅氧烷，和（C）加成反应催化剂，其固化成具有耐热性和耐变色性的透明产品。

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