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    • 31. 发明申请
    • Integrated Circuit Die Stacks With Rotationally Symmetric Vias
    • 具有旋转对称通孔的集成电路模块
    • US20110109381A1
    • 2011-05-12
    • US12616563
    • 2009-11-11
    • Jimmy G. Foster, SR.Kyu-Hyoun Kim
    • Jimmy G. Foster, SR.Kyu-Hyoun Kim
    • H01L25/00H01L25/065H01L21/822
    • H01L23/5384H01L21/822H01L25/0657H01L2224/16H01L2225/06527H01L2225/06541H01L2225/06555
    • An integrated circuit die stack including a first integrated circuit die mounted upon a substrate, the first die including pass-through vias (‘PTVs’) composed of conductive pathways through the first die with no connection to any circuitry on the first die; and a second integrated circuit die, identical to the first die, rotated with respect to the first die and mounted upon the first die, with the PTVs in the first die connecting signal lines from the substrate through the first die to through silicon vias (TSVs') in the second die composed of conductive pathways through the second die connected to electronic circuitry on the second die; with the TSVs and PTVs disposed upon each identical die so that the positions of the TSVs and PTVs on each identical die are rotationally symmetrical with respect to the TSVs and PTVs on the other identical die.
    • 一种集成电路管芯堆叠,其包括安装在衬底上的第一集成电路管芯,所述第一管芯包括由通过所述第一管芯的导电通路组成的通孔(“PTV”),其没有连接到所述第一管芯上的任何电路; 以及第一集成电路管芯,与第一管芯相同,相对于第一管芯旋转并安装在第一管芯上,第一管芯中的PTV将来自衬底的信号线通过第一管芯连接到硅通孔(TSV) ')在由连接到第二管芯上的电子电路的第二管芯的导电通路组成的第二管芯中; 其中TSV和PTV设置在每个相同的管芯上,使得每个相同管芯上的TSV和PTV的位置相对于另一相同管芯上的TSV和PTV旋转对称。
    • 32. 发明授权
    • Semiconductor memory device and memory system including the same
    • 半导体存储器件和包括其的存储器系统
    • US07882417B2
    • 2011-02-01
    • US11705151
    • 2007-02-12
    • Hoe-Ju ChungKyu-Hyoun Kim
    • Hoe-Ju ChungKyu-Hyoun Kim
    • G11C29/00H03M13/29
    • H03M13/29G06F11/08G06F11/1008G11C7/1006G11C29/42G11C2029/0411G11C2207/104
    • A semiconductor memory device and a memory system including the same are provided. The semiconductor memory device may include a first memory cell array block generating first data, a second memory cell array block generating second data, and first and second error detection code generators. The first error detection code generator may generate a first error detection code and may combine a portion of bits of the first error detection code with a portion of bits of a second error detection code to generate a first final error detection signal. The second error detection code generator may generate the second error detection code and may combine the remaining bits other than the portion of bits of the second error detection code with the remaining bits other than the portion of bits of the first error detection code to generate a second final error detection signal.
    • 提供一种半导体存储器件和包括该半导体存储器件的存储器系统。 半导体存储器件可以包括产生第一数据的第一存储单元阵列块,产生第二数据的第二存储单元阵列块,以及第一和第二错误检测码发生器。 第一错误检测码发生器可以产生第一错误检测码,并且可以将第一错误检测码的位的一部分与第二错误检测码的位的一部分组合以产生第一最终错误检测信号。 第二错误检测码发生器可以产生第二错误检测码,并且可以将除了第二错误检测码的位的部分之外的其余位与除第一错误检测码的位的部分之外的其余位组合以产生 第二最终错误检测信号。
    • 36. 发明申请
    • Synchronous Memory Having Shared CRC and Strobe Pin
    • 具有共享CRC和选通引脚的同步存储器
    • US20090113133A1
    • 2009-04-30
    • US11923691
    • 2007-10-25
    • Kyu-Hyoun KimPaul W. Coteus
    • Kyu-Hyoun KimPaul W. Coteus
    • G06F12/00
    • G06F13/1689G06F11/1004
    • A memory system having a memory element chip (DRAM) and a memory controller chips having a plurality of drivers and receivers and latches for transferred data. For writes clocks, write data and write for CRC (cyclic redundancy checks) is transferred to the DRAM from the memory controller and latched for error checking. The reads are clocked and the read data is received and transferred to a read data latch with also receives a clocked read strobe for verification of data integrity from DRAM. Each chip has a bi-functional pin that acts as a shared CRC pin during write and acts as a shared strobe pin during READ. Data transfers with the CRC signal and DQS signal are transferred across two paths CRC0/DQS and CRC1/DQS1. One could also transfer the CRC signal across one path with only the CRC0/DQS signal. Read operations have no CRC, and have no need for CRC because transfer errors during read can be detected by memory error correction coding (ECC). Write data provides source synchronous I/O data to said memory element chip needed for modem high speed memory communications.
    • 具有存储元件芯片(DRAM)的存储器系统和具有用于传送数据的多个驱动器和接收器以及锁存器的存储器控​​制器芯片。 对于写时钟,写入数据和写入CRC(循环冗余校验)从存储器控制器传送到DRAM,并锁存进行错误检查。 读取被计时,并且读取的数据被接收并被传送到读取数据锁存器,同时还接收用于从DRAM确认数据完整性的时钟读选通脉冲。 每个芯片都有一个双功能引脚,在写入期间充当共享的CRC引脚,并在读取期间充当共享的选通引脚。 具有CRC信号和DQS信号的数据传输通过两个路径CRC0 / DQS和CRC1 / DQS1传送。 也可以通过CRC0 / DQS信号在一个路径上传送CRC信号。 读操作没有CRC,并且不需要CRC,因为可以通过存储器纠错编码(ECC)来检测读取期间的传输错误。 写入数据将源同步I / O数据提供给调制解调器高速存储器通信所需的所述存储器元件芯片。
    • 38. 发明申请
    • Memory system having point-to-point (PTP) and point-to-two-point (PTTP) links between devices
    • 在设备之间具有点到点(PTP)和点到两点(PTTP)链路的存储器系统
    • US20070133247A1
    • 2007-06-14
    • US11603648
    • 2006-11-22
    • Jae-Jun LeeJoo-Sun ChoiKyu-Hyoun KimKwang-Soo Park
    • Jae-Jun LeeJoo-Sun ChoiKyu-Hyoun KimKwang-Soo Park
    • G11C5/06
    • G11C5/063
    • A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second secondary memories. A first connection element, such as a connector or solder, connects the memory module to a mother board. A second connection element, such as a connector or solder, connects at least one other of the first and second primary and first and second secondary memories to the mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link.
    • 存储器系统具有第一和第二主存储器以及分别耦合到第一和第二主存储器的第一和第二辅助存储器,耦合器包括至少一个点到点连接。 存储器模块包括第一和第二主要和第一和第二辅助存储器中的至少两个。 诸如连接器或焊料的第一连接元件将存储器模块连接到母板。 诸如连接器或焊料的第二连接元件将第一和第二初级和第二和第二辅助存储器中的至少一个连接到母板。 第一存储器模块上的至少一个存储器耦合到至少一个其他存储器。 存储器系统还包括存储器控制器,其通过点对二点链接连接到主存储器。
    • 40. 发明授权
    • Delay-Locked Loop (DLL) capable of directly receiving external clock signals
    • 能够直接接收外部时钟信号的延迟锁定环(DLL)
    • US07057433B2
    • 2006-06-06
    • US10774933
    • 2004-02-09
    • Guen-Hee ChoKyu-Hyoun Kim
    • Guen-Hee ChoKyu-Hyoun Kim
    • H03L7/00
    • H03L7/0814
    • A delay-locked loop (DLL) capable of directly receiving external clock signals is provided. The DLL comprises a level selector, a control signal generator, and an internal clock signal generator. The level selector receives an external clock signal, and directly outputs the external clock signal, or changes a level of the external clock signal and outputs a changed external clock signal, in response to a control signal. The control signal generator generates the control signal. The internal clock signal generator receives an output signal of the level selector and the external clock signal, and generates an internal clock signal synchronized to a phase of an output signal of the level selector.
    • 提供能够直接接收外部时钟信号的延迟锁定环(DLL)。 DLL包括电平选择器,控制信号发生器和内部时钟信号发生器。 电平选择器接收外部时钟信号,并且响应于控制信号直接输出外部时钟信号,或改变外部时钟信号的电平并输出改变的外部时钟信号。 控制信号发生器产生控制信号。 内部时钟信号发生器接收电平选择器和外部时钟信号的输出信号,并且产生与电平选择器的输出信号的相位同步的内部时钟信号。