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    • 33. 发明授权
    • Exposure apparatus and method responsive to light beam wavelength
variation
    • 响应于光束波长变化的曝光装置和方法
    • US5963324A
    • 1999-10-05
    • US729190
    • 1996-10-11
    • Minoru Murata
    • Minoru Murata
    • H01L21/027G01B9/02G03F7/20
    • G01B9/0207G01B9/02067G03F7/70691
    • An exposure apparatus is provided with temperature sensors (25 and 26) to measure temperatures of air around laser beams from a reticle-side laser interferometer (22a) and a wafer-side laser interferometer (23a), together with an environmental sensor (31) for measuring an atmospheric pressure, humidity, and so forth. A main control system (13) as a host CPU instructs a reticle stage control system (27) and a wafer stage control system (28) to move a reticle and a wafer, respectively (step 201). During the reticle and wafer moving period, measured values by the temperature sensors (25 and 26) and the environmental sensor (31) are read, and a variation of the laser wavelength due to a change in the environmental data is corrected (step 202), and during subsequent scanning exposure, position control of the reticle and wafer stages is effected by using the corrected laser wavelength. Thus, the laser wavelength of the laser interferometers is corrected without an increase in the cost or a reduction of the throughput.
    • 曝光装置设置有温度传感器(25和26),用于测量来自标线片侧激光干涉仪(22a)和晶片侧激光干涉仪(23a)的激光束周围的空气与环境传感器(31)的温度, 用于测量大气压力,湿度等。 作为主机CPU的主控制系统(13)指示分划板台控制系统(27)和晶片台控制系统(28)分别移动光罩和晶片(步骤201)。 在标线片和晶片移动期间,读取温度传感器(25,26)和环境传感器(31)的测量值,校正由于环境数据变化引起的激光波长的变化(步骤202) 并且在随后的扫描曝光期间,通过使用校正的激光波长来实现掩模版和晶片台的位置控制。 因此,校正激光干涉仪的激光波长,而不增加成本或降低生产量。
    • 40. 发明授权
    • Physical quantity sensor having multiple through holes
    • 物理量传感器具有多个通孔
    • US07337670B2
    • 2008-03-04
    • US11649254
    • 2007-01-04
    • Minoru MurataKenichi YokoyamaMakoto Asai
    • Minoru MurataKenichi YokoyamaMakoto Asai
    • G01P15/00
    • G01C19/5719G01P15/125
    • A semiconductor physical quantity sensor includes: a substrate; a semiconductor layer supported on the substrate; a trench disposed in the semiconductor layer; and a movable portion disposed in the semiconductor layer and separated from the substrate by the trench. The movable portion includes a plurality of through-holes, each of which penetrates the semiconductor layer in a thickness direction. The movable portion is capable of displacing on the basis of a physical quantity applied to the movable portion so that the physical quantity is detected by a displacement of the movable portion. The movable portion has a junction disposed among the through-holes. The junction has a trifurcate shape.
    • 半导体物理量传感器包括:基板; 支撑在基板上的半导体层; 设置在所述半导体层中的沟槽; 以及可移动部分,其设置在所述半导体层中并且通过所述沟槽与所述衬底分离。 可动部包括在厚度方向上贯穿半导体层的多个贯通孔。 可移动部分能够基于施加到可移动部分的物理量来移位,使得通过可移动部分的位移来检测物理量。 可动部分具有设置在通孔中的接合部。 交界处有三叉形。