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    • 32. 发明授权
    • Color sensor and electronic device having the same
    • 彩色传感器和具有相同的电子设备
    • US08502131B2
    • 2013-08-06
    • US12498662
    • 2009-07-07
    • Atsushi Hirose
    • Atsushi Hirose
    • H01J40/14
    • G01N21/255G09G3/3406G09G3/3413G09G2320/0626G09G2320/0666G09G2360/144G09G2360/145H01L27/144H01L27/14621H01L27/14623H01L27/14685
    • A color sensor with a plurality of optical sensors in which the number of terminals for connection with the outside can be reduced. The color sensor includes a plurality of optical sensors each provided with a photoelectric conversion element and an optical filter over a light-transmitting substrate. The optical filters in the plurality of optical sensors have light-transmitting characteristics different from each other. The plurality of optical sensors is mounted over an interposer including a plurality of terminal electrodes for electrical connection with an external device. The interposer includes a wiring having a plurality of branches for electrical connection between the terminal electrode for inputting a high power supply potential to the plurality of optical sensors and a wiring having a plurality of branches for electrical connection between the terminal electrode for inputting a low power supply potential to the plurality of optical sensors.
    • 具有多个光学传感器的颜色传感器,其中可以减少与外部连接的端子的数量。 颜色传感器包括多个光学传感器,每个光传感器在光透射基板上设置有光电转换元件和滤光器。 多个光学传感器中的滤光器具有彼此不同的透光特性。 多个光学传感器安装在包括用于与外部设备电连接的多个端子电极的插入器上。 插入器包括具有多个分支的布线,用于在用于向多个光学传感器输入高电源电位的端子电极之间进行电连接;以及布线,具有用于在用于输入低功率的端子电极之间进行电连接的多个分支 向多个光学传感器供应电位。
    • 36. 发明授权
    • Photoelectric conversion device having a reference voltage generation circuit with a resistor and a second diode element and electronic device having the same
    • 具有具有电阻器和第二二极管元件的参考电压产生电路的光电转换装置和具有该参考电压产生电路的电子装置
    • US08053717B2
    • 2011-11-08
    • US12465335
    • 2009-05-13
    • Jun KoyamaAtsushi Hirose
    • Jun KoyamaAtsushi Hirose
    • H01J40/14
    • H03F3/08
    • The photoelectric conversion device includes a photoelectric conversion circuit for outputting photocurrent generated in a photoelectric conversion element as output voltage subjected to logarithmic compression by a first diode element, a reference voltage generation circuit for outputting reference voltage subjected to logarithmic compression by a second diode element in accordance with the amount of current flowing to a resistor, an arithmetic circuit for outputting an output signal obtained by amplifying a difference between the output voltage output from the photoelectric conversion circuit and the reference voltage output from the reference voltage generation circuit, and an output circuit for outputting current corresponding to the logarithmically-compressed output voltage output from the photoelectric conversion circuit by the output signal.
    • 光电转换装置包括用于输出在光电转换元件中产生的光电流作为由第一二极管元件进行对数压缩的输出电压的光电转换电路,用于输出由第二二极管元件进行对数压缩的参考电压的参考电压产生电路 根据流向电阻器的电流量,输出通过放大从光电转换电路输出的输出电压与从基准电压产生电路输出的参考电压之间的差而获得的输出信号的运算电路,以及输出电路 用于输出与通过输出信号从光电转换电路输出的对数压缩输出电压相对应的电流。
    • 37. 发明授权
    • Method for manufacturing a semiconductor device
    • 半导体器件的制造方法
    • US07759629B2
    • 2010-07-20
    • US12043640
    • 2008-03-06
    • Shunpei YamazakiAtsushi HiroseKoji OnoHotaka Maruyama
    • Shunpei YamazakiAtsushi HiroseKoji OnoHotaka Maruyama
    • H01L31/18
    • H01L27/14665H01L27/1214H01L27/1266H01L27/14603H03F3/08
    • A semiconductor device is manufactured through steps in which a photoelectric conversion element and an amplifier circuit are formed over a first substrate with a release layer interposed therebetween, and the photoelectric conversion element and the amplifier circuit are separated from the first substrate. Output characteristics of the amplifier circuit are improved and the semiconductor device with high reliability is obtained. A manufacturing method of such semiconductor device includes steps of forming a metal layer having an opening portion over a substrate, forming an insulating layer over the entire surface of the substrate including the opening portion and the metal layer, forming a photoelectric conversion layer in a region which overlaps with the metal layer and is a layer over the insulating layer, forming an amplifier circuit, which amplifies an output current of the photoelectric conversion element by using a thin film transistor, in the opening portion in the metal layer, forming a protective layer over the photoelectric conversion element and the amplifier circuit, and separating the photoelectric conversion element and the amplifier circuit, together with the insulating layer, from the substrate through laser irradiation to the metal layer.
    • 通过在第一基板上形成有光电转换元件和放大电路的步骤制造半导体器件,并且将光电转换元件和放大电路与第一基板分离。 改善放大电路的输出特性,获得高可靠性的半导体器件。 这种半导体器件的制造方法包括以下步骤:在衬底上形成具有开口部分的金属层,在包括开口部分和金属层的衬底的整个表面上形成绝缘层,在区域中形成光电转换层 其与金属层重叠并且是绝缘层上的层,形成放大器电路,其在金属层的开口部分中使用薄膜晶体管放大光电转换元件的输出电流,形成保护层 通过光电转换元件和放大器电路,并且通过激光照射将光电转换元件和放大器电路与绝缘层一起从基板分离到金属层。
    • 38. 发明授权
    • Electronic device comprising a first and second photodiode wherein a reference potential is supplied to the first photodiode
    • 电子器件包括第一和第二光电二极管,其中参考电位被提供给第一光电二极管
    • US07671320B2
    • 2010-03-02
    • US12328978
    • 2008-12-05
    • Atsushi HiroseTatsuya Arao
    • Atsushi HiroseTatsuya Arao
    • H01L31/00
    • H01L27/1443G01J1/1626G01J1/4228G01J1/44
    • The semiconductor device includes a first photodiode, a second photodiode which is shielded from light, a first circuit group including a voltage follower circuit, a second circuit group, and a compensation circuit, in which an output from the first photodiode is inputted to the voltage follower circuit of the first circuit group, an output from the first circuit group is inputted to the compensation circuit, and an output from the second photodiode is inputted to the compensation circuit through the second circuit group. By adding or subtracting these inputs in the compensation circuit, an output fluctuation due to temperature of the first photodiode is removed. Note that a reference potential is supplied to the first photodiode so that an open circuit voltage is outputted, and a potential is supplied to the second photodiode so that a forward bias is applied to the second photodiode.
    • 半导体器件包括第一光电二极管,屏蔽光的第二光电二极管,包括电压跟随器电路,第二电路组和补偿电路的第一电路组,其中第一光电二极管的输出被输入到电压 第一电路组的跟随器电路,第一电路组的输出被输入到补偿电路,并且来自第二光电二极管的输出通过第二电路组输入到补偿电路。 通过在补偿电路中增加或减去这些输入,消除由于第一光电二极管的温度引起的输出波动。 注意,参考电位被提供给第一光电二极管,使得输出开路电压,并且向第二光电二极管提供电位,使得正向偏压被施加到第二光电二极管。
    • 40. 发明申请
    • METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20080230682A1
    • 2008-09-25
    • US12043640
    • 2008-03-06
    • Shunpei YamazakiAtsushi HiroseKoji OnoHotaka Maruyama
    • Shunpei YamazakiAtsushi HiroseKoji OnoHotaka Maruyama
    • H03F3/08H01L31/18
    • H01L27/14665H01L27/1214H01L27/1266H01L27/14603H03F3/08
    • A semiconductor device is manufactured through steps in which a photoelectric conversion element and an amplifier circuit are formed over a first substrate with a release layer interposed therebetween, and the photoelectric conversion element and the amplifier circuit are separated from the first substrate. Output characteristics of the amplifier circuit are improved and the semiconductor device with high reliability is obtained. A manufacturing method of such semiconductor device includes steps of forming a metal layer having an opening portion over a substrate, forming an insulating layer over the entire surface of the substrate including the opening portion and the metal layer, forming a photoelectric conversion layer in a region which overlaps with the metal layer and is a layer over the insulating layer, forming an amplifier circuit, which amplifies an output current of the photoelectric conversion element by using a thin film transistor, in the opening portion in the metal layer, forming a protective layer over the photoelectric conversion element and the amplifier circuit, and separating the photoelectric conversion element and the amplifier circuit, together with the insulating layer, from the substrate through laser irradiation to the metal layer.
    • 通过在第一基板上形成有光电转换元件和放大电路的步骤制造半导体器件,并且将光电转换元件和放大电路与第一基板分离。 改善放大电路的输出特性,获得高可靠性的半导体器件。 这种半导体器件的制造方法包括以下步骤:在衬底上形成具有开口部分的金属层,在包括开口部分和金属层的衬底的整个表面上形成绝缘层,在区域中形成光电转换层 其与金属层重叠并且是绝缘层上的层,形成放大器电路,其在金属层的开口部分中使用薄膜晶体管放大光电转换元件的输出电流,形成保护层 通过光电转换元件和放大器电路,并且通过激光照射将光电转换元件和放大器电路与绝缘层一起从基板分离到金属层。