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    • 37. 发明授权
    • Operating a programmable integrated circuit with functionally equivalent configuration bitstreams
    • 操作具有功能等效配置比特流的可编程集成电路
    • US08519741B1
    • 2013-08-27
    • US13543508
    • 2012-07-06
    • James KarpMichael J. Hart
    • James KarpMichael J. Hart
    • H03K19/173
    • H03K19/1776G06F17/5054H03K19/17736
    • Approaches for operating a programmable integrated circuit (IC) are disclosed. One configuration bitstream of two or more configuration bitstreams is selected. Each configuration bitstream implements a functionally equivalent circuit on the programmable IC and programs a respective subset of pass gates of the programmable IC. Each subset of pass gates programmed by the configuration bitstreams is disjoint from each other subset of pass gates. The programmable IC, which is defect-free, is configured with the selected configuration bitstream. The defect-free programmable IC is then operated for a period of time. The selecting, configuring and operating are repeated, and for successive selecting operations, different ones of the configuration bitstreams are selected.
    • 公开了用于操作可编程集成电路(IC)的方法。 选择两个或多个配置比特流的一个配置比特流。 每个配置比特流在可编程IC上实现功能上等效的电路,并对可编程IC的相应子集的通道进行编程。 由配置比特流编程的每个通道的子集与传递门的每个其他子集不相交。 无缺陷的可编程IC配置有所选配置比特流。 然后,无缺陷的可编程IC运行一段时间。 重复选择,配置和操作,并且对于连续选择操作,选择不同的配置比特流。
    • 38. 发明授权
    • Diffusion regions having different depths
    • 具有不同深度的扩散区域
    • US08299564B1
    • 2012-10-30
    • US12559457
    • 2009-09-14
    • Yun WuBei ZhuZhiyuan WuMichael J. Hart
    • Yun WuBei ZhuZhiyuan WuMichael J. Hart
    • H01L21/336H01L21/8234
    • H01L21/823807H01L21/823814
    • Formation of transistors, such as, e.g., PMOS transistors, with diffusion regions having different depths for equalization of performance among transistors of an integrated circuit is described. Shallow-trench isolation structures are formed in a substrate formed at least in part of silicon for providing the transistors with at least substantially equivalent channel widths and lengths. A series of masks and etches is performed to form first recesses and second recesses defined in the silicon having different depths and respectively associated with first and second transistors. The second recesses are deeper than the first recesses. A silicon germanium film is formed in the first recesses and the second recesses. The silicon germanium film in the second recesses is thicker than the silicon germanium film in the first recesses, in order to increase performance of the second transistor so it is closer to the performance of the first transistor.
    • 描述了具有扩散区域的诸如PMOS晶体管的晶体管的形成,其具有用于集成电路的晶体管之间的性能均衡的不同深度。 浅沟槽隔离结构形成在至少部分硅中形成的衬底中,用于为晶体管提供至少基本相当的沟道宽度和长度。 执行一系列掩模和蚀刻以形成在具有不同深度并且分别与第一和第二晶体管相关联的硅中限定的第一凹部和第二凹部。 第二凹部比第一凹部更深。 在第一凹部和第二凹部中形成硅锗膜。 第二凹部中的硅锗膜比第一凹部中的硅锗膜厚,以便增加第二晶体管的性能,使得其更接近于第一晶体管的性能。
    • 40. 发明授权
    • Memory array having improved radiation immunity
    • 具有改善的辐射抗扰性的存储阵列
    • US08981491B1
    • 2015-03-17
    • US13439706
    • 2012-04-04
    • Michael J. HartJames Karp
    • Michael J. HartJames Karp
    • H01L27/085
    • H01L27/0207G11C5/005G11C11/4125H01L27/1104
    • A memory array having improved radiation immunity is described. The memory array comprises a plurality of memory elements, each memory element having an p-type transistor formed in an n-type region; and a plurality of p-wells, each p-well having an n-type transistor coupled to a corresponding p-type transistor to form a memory element of the plurality of memory elements; wherein each p-well provides a p-n junction to dissipate minority charge in a portion of the n-type region occupied by a corresponding p-type transistor and associated with at least two adjacent memory elements. A method of implementing a memory array is also described.
    • 描述了具有改善的辐射抗扰性的存储器阵列。 存储器阵列包括多个存储元件,每个存储元件具有形成在n型区域中的p型晶体管; 和多个p阱,每个p阱具有耦合到相应的p型晶体管的n型晶体管,以形成多个存储元件的存储元件; 其中每个p阱提供p-n结以消散由相应的p型晶体管占据并与至少两个相邻的存储元件相关联的n型区域的一部分中的少数电荷。 还描述了实现存储器阵列的方法。