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    • 1. 发明授权
    • Method for fabricating a segmented AMG EPROM where only every fourth bit
line contacts a select transistor in a row of segment select transistors
    • 用于制造分段AMG EPROM的方法,其中只有每第四位线接到一行段选择晶体管中的选择晶体管
    • US5460990A
    • 1995-10-24
    • US285650
    • 1994-08-03
    • Albert M. Bergemont
    • Albert M. Bergemont
    • G11C16/04H01L21/8247H01L27/115
    • H01L27/11521G11C16/0491H01L27/115
    • The current driven by the segment select transistors of an alternate-metal, virtual-ground (AMG) electrically programmable read-only-memory (EPROM), is increased by eliminating the even numbered segment select transistors in every other row of segment select transistors, and the odd numbered segment select transistors in the remaining rows, and by changing the current path through the segment so that the current flows from a segment select transistor in one row of segment select transistors to a segment select transistor in an adjacent row of transistors. By eliminating every other segment select transistor in each row of transistors, the maximum pitch of the segment select transistors can be substantially increased, thereby providing the required programming current, while at the same time maintaining the required isolation between adjacent segment select transistors.
    • 由替代金属虚拟地(AMG)电可编程只读存储器(EPROM)的段选择晶体管驱动的电流通过消除每隔一行的段选择晶体管中的偶数段选择晶体管而增加, 以及剩余行中的奇数段选择晶体管,并且通过改变通过该段的电流路径,使得电流从一行段选择晶体管中的段选择晶体管流到相邻行晶体管中的段选择晶体管。 通过消除晶体管每行中的每个其它段选择晶体管,可以大幅增加段选择晶体管的最大间距,从而提供所需的编程电流,同时保持相邻段选择晶体管之间所需的隔离。
    • 4. 发明授权
    • Contactless, 5V, high speed EPROM/flash EPROM array utilizing cells
programmed using source side injection
    • 接触5V,高速EPROM /闪存EPROM阵列使用源注射编程的细胞
    • US5212541A
    • 1993-05-18
    • US687281
    • 1991-04-18
    • Albert M. Bergemont
    • Albert M. Bergemont
    • H01L21/8247H01L27/115H01L29/788H01L29/792
    • H01L27/115H01L29/7885
    • The present invention provides a 5V only, EPROM memory cell structure that is utilizable in high speed UV-erasable or flash EPROM contactless arrays and that uses source side injection for programming. The EPROM cell structure comprises spaced-apart N-type source and drain regions that define a channel region in a P-type substrate. A first layer of insulating material overlies the channel region. A polysilicon (poly 1) floating gate is formed on the first insulating layer and overlies a first portion of the channel region that extends from the drain region to a point in the channel region intermediate the source and drain regions thereby defining a second portion of the channel region that extends from the intermediate point to the source region and over which the floating gate does not extend. The poly 1 floating gate also includes a coupling portion that extends over the field oxide that defines the active device area in which the EPROM cell is formed. A second layer of insulating material is formed over the floating gate, including the coupling portion of the floating gate. A polysilicon (poly 2) control gate overlies the floating gate but is separated therefrom by the second insulating layer. The poly 2 control gate includes an access portion that overlies the second portion of the channel region but is separated therefrom by the first layer of insulating material. A polysilicon (poly 2) coupling line overlies the coupling portion of the floating gate but is separated therefrom by the second insulating layer. This cell structure is utilized in a contactless array that relies on shared source lines, resulting in very small cell size and relatively simple decoding.
    • 6. 发明授权
    • Fabrication of a high density stacked gate EPROM split cell with bit
line reach-through and interruption immunity
    • 高密度堆叠门EPROM分离单元的制造与位线接近和中断免疫
    • US5091327A
    • 1992-02-25
    • US545396
    • 1990-06-28
    • Albert M. Bergemont
    • Albert M. Bergemont
    • H01L21/28H01L21/8247H01L27/115H01L29/788H01L29/792
    • H01L27/11521H01L21/28273H01L29/7885Y10S438/981
    • A method for fabricating a split-gate EPROM cell utilizing stacked etch techniques is provided. In accordance with a preferred embodiment of the method, a layer of silicon dioxide is formed on a P- silicon substrate. A layer of polysilicon is formed on the silicon dioxide layer, followed by growth of an oxide/nitride/oxide (ONO) layer. The ONO and polysilicon layers are etched to define floating gates. Next, an edge of each floating gate is utilized in a self-aligned implant of buried N+ bit lines. The floating gate extends only over a first portion of the channel defined between the adjacent buried bit lines. A differential oxide layer is grown on the substrate between adjacent floating gates in a low temperature steam oxidation step. That is, the oxide formed over the exposed portion of the buried N+ bit line is thicker than the oxide formed over the exposed portion of the channel. Following formation of the differential oxide layer, a second layer of polysilicon is formed and etched to define control lines extending perpendicular to the floating gates in the conventional split-gate EPROM cell structure. The control gates are utilized in a stacked etch to complete the split-gate cells. The etch is carried out such that the oxide overlying the N+ bit lines protect the surface of the substrate, avoiding bit line interruption, while the silicon dioxide overlying the exposed portion of the channel is overetched to form a trench into the channel that extends below the junction depth of the N+ region, thereby eliminating bit line to bit line reach-through.