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    • 31. 发明申请
    • METHOD OF PREPARING A PLAN-VIEW TRANSMISSION ELECTRON MICROSCOPE SAMPLE USED IN AN INTEGRATED CIRCUIT ANALYSIS
    • 制备在一体化电路分析中使用的平面传输电子显微镜样品的方法
    • US20170053778A1
    • 2017-02-23
    • US15241284
    • 2016-08-19
    • Qiang ChenYanping Shi
    • Qiang ChenYanping Shi
    • H01J37/302H01J37/285H01J37/305
    • G01N1/286G01N1/28H01J37/26H01J2237/31745
    • The present invention discloses a preparation method of plan-view TEM sample used in an integrated circuit analysis. The method comprises the steps of: providing a carrying slice, and fixing a chip containing a targeted structure sample and the carrying slice on a sample holder in a horizontal direction, and putting them in a process chamber of a FIB apparatus; cutting off a piece of chip structure containing a target structure sample by adopting a FIB; and welding the piece of chip structure on the flat and clean side of the carrying slice by using a nano-manipulator; after being taken out from the process chamber of the FIB apparatus, the carrying slice welded with the chip structure is adjusted to vertical direction, and is put in the process chamber of the FIB apparatus again; transferring and welding the chip structure on the TEM copper grid by using the nano-manipulator; and removing one layer or multiple layers above the preset target layer from the surface layer of the chip by using the FIB to obtain the desired plan-view TEM sample.
    • 本发明公开了在集成电路分析中使用的平面图TEM样品的制备方法。 该方法包括以下步骤:提供携带片,并将含有目标结构样品的芯片和携带片在水平方向上固定在样品架上,并将其放入FIB装置的处理室中; 通过FIB切断含有目标结构样品的芯片结构; 并通过使用纳米机械手将芯片结构焊接在承载片的平坦且干净的一侧; 在从FIB装置的处理室中取出之后,将与芯片结构焊接的承载片调整到垂直方向,并再次放入FIB装置的处理室中; 通过使用纳米操纵器将TEM芯片上的芯片结构转移和焊接; 并且通过使用FIB从芯片的表面层去除预设目标层上方的一层或多层以获得所需的平面图TEM样品。
    • 32. 发明授权
    • Image recognition device, image recognition method, and integrated circuit
    • 图像识别装置,图像识别方法和集成电路
    • US08897578B2
    • 2014-11-25
    • US13817631
    • 2012-08-29
    • Zhongyang HuangYang HuaShuicheng YanQiang ChenRyouichi Kawanishi
    • Zhongyang HuangYang HuaShuicheng YanQiang ChenRyouichi Kawanishi
    • G06K9/62G06K9/34G06K9/74G06T7/00G06K9/46
    • G06T7/0081G06K9/4642G06K9/4676
    • An image recognition device that improves the accuracy of generic object recognition compared with conventional technologies by reducing the influence of the position, size, background clutter and the like of an object that is targeted to be recognized in the input image by the generic object recognition. The image recognition device performs a generic object recognition and includes: a segmenting unit configured to segment an input image into a plurality of regions in accordance with meanings extracted from content of the input image; a generating unit configured to compute feature data for each of the plurality of regions and generate feature data of the input image reflecting the computed feature data; and a checking unit configured to check whether or not a recognition-target object is present in the input image in accordance with the feature data of the input image.
    • 一种图像识别装置,通过减少通过通用对象识别在目标被识别的对象的位置,大小,背景杂波等的影响,与传统技术相比,提高了通用对象识别的准确性。 图像识别装置执行通用对象识别,包括:分割单元,被配置为根据从输入图像的内容中提取的含义将输入图像分割成多个区域; 生成单元,被配置为计算所述多个区域中的每一个的特征数据,并且生成反映所计算的特征数据的所述输入图像的特征数据; 以及检查单元,被配置为根据输入图像的特征数据来检查输入图像中是否存在识别对象物体。
    • 33. 发明授权
    • Electronic device with cooling module
    • 带冷却模块的电子设备
    • US08644019B2
    • 2014-02-04
    • US13337256
    • 2011-12-26
    • Qiang Chen
    • Qiang Chen
    • H05K7/20
    • G06F1/181G06F1/20
    • An electronic device includes a housing. A motherboard is arranged in a first end of the housing. A hard disk drive area is arranged at a second end of the housing. A cooling module is arranged at the housing between the motherboard and the hard disk drive area. The cooling module includes a chassis and a semiconductor chilling plate received in the chassis. An outside airflow flows through the hard disk drive area, and then flows through the semiconductor chilling plate to be cooled. The cooled airflow is driven to flow through the motherboard.
    • 电子设备包括壳体。 主板布置在壳体的第一端。 硬盘驱动器区域布置在壳体的第二端。 在主板和硬盘驱动器区域之间的壳体处布置有冷却模块。 冷却模块包括容纳在底盘中的底架和半导体冷却板。 外部空气流过硬盘驱动区域,然后流过要冷却的半导体冷却板。 冷却的气流被驱动流过主板。
    • 35. 发明申请
    • DIRECT CURRENT/DIRECT CURRENT CONVERTER FOR ACQUIRING STABILIZED LOW VOLTAGE AND TELEPHONE POWER SUPPLY CIRCUIT
    • 用于获取稳定的低电压和电话电源电路的直流/直流电流转换器
    • US20130202103A1
    • 2013-08-08
    • US13641968
    • 2011-01-05
    • Qiang ChenHao ChenHuijian SiGangjian Ying
    • Qiang ChenHao ChenHuijian SiGangjian Ying
    • G05F1/46
    • G05F1/46H02M3/156
    • A Direct Current/Direct Current (DC/DC) converter for acquiring stabilized low voltage and a telephone power supply circuit based on the DC/DC converter are provided by the present invention. The DC/DC converter includes a power level circuit (1), which receives a dynamic voltage input from an outside circuit; a tank circuit (2), which uses energy-storage elements to store the electric energy outputted from the power level circuit and outputs the electric energy to a load; and a feedback control circuit (3), which receives the voltage from the output and feeds it back to the input of the tank circuit so as to control the connection and disconnection of the input of the tank circuit and further to control output voltage of the tank circuit. By the technical solution of the present invention, which uses the energy-storage inductance to store energy, limits the output, and acquires a stabilized low voltage from a wider range output voltage by using a feedback circuit, the power consumption is reduced, and the impact on the telephone is reduced at the time of picking up and/or hanging up the telephone.
    • 本发明提供一种直流/直流(DC / DC)转换器,用于获取稳定的低电压和基于DC / DC转换器的电话电源电路。 DC / DC转换器包括功率电平电路(1),其接收从外部电路输入的动态电压; 储罐电路(2),其使用能量存储元件来存储从功率电平电路输出的电能并将电能输出到负载; 以及反馈控制电路(3),其从输出端接收电压并将其馈送回到储能电路的输入端,以便控制储能电路的输入的连接和断开,并进一步控制输出电压 坦克回路。 通过使用储能电感来存储能量的本发明的技术方案,通过使用反馈电路限制输出并从较宽范围的输出电压获取稳定的低电压,降低了功耗, 在拿起和/或挂断电话时,对电话的影响减小了。
    • 40. 发明授权
    • Integrated circuit ESD protection
    • 集成电路ESD保护
    • US07719025B2
    • 2010-05-18
    • US11550650
    • 2006-10-18
    • Qiang ChenGordon Ma
    • Qiang ChenGordon Ma
    • H01L29/74
    • H01L29/8618H01L27/0259H01L29/0692
    • A protective device in a semiconductor may comprise a substrate of a first conductivity type, an epitaxial layer formed on top of the substrate, a body area formed within the epitaxial layer of a second conductivity type extending from a top surface into the epitaxial layer, a first area of the first conductivity type extending from the top surface into the body area, an isolation area surrounding the first area, a ring area of the first conductivity type surrounding the isolation area, and a coupling structure for connecting the ring area with the substrate.
    • 半导体中的保护装置可以包括第一导电类型的衬底,形成在衬底顶部上的外延层,形成在从顶表面延伸到外延层中的第二导电类型的外延层内的主体区域, 第一导电类型的从顶表面延伸到体区的第一区域,围绕第一区域的隔离区域,围绕隔离区域的第一导电类型的环区域和用于将环区域与衬底连接的耦合结构 。