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    • 32. 发明授权
    • Method for exposing a pattern on an object by a charged particle beam
    • 通过带电粒子束曝光物体上的图案的方法
    • US5349197A
    • 1994-09-20
    • US953073
    • 1992-09-29
    • Kiichi SakamotoHiroshi Yasuda
    • Kiichi SakamotoHiroshi Yasuda
    • H01J37/302
    • H01J37/3174B82Y10/00B82Y40/00H01J37/3026H01J2237/31776
    • A method for exposing a pattern of a semiconductor device on an object comprises the steps of extracting block exposure data from design data the semiconductor device, extracting variable exposure data from the design data, extracting fine exposure data from the variable exposure data such that the fine exposure data comprises exposure data for fine elemental patterns that have a size smaller than a predetermined threshold size below which exposure by a variable shaped beam is difficult, extracting mask data indicative of a construction of a beam shaping mask used for shaping the beam based upon the block exposure data, variable exposure data and the fine exposure data, such that the mask data includes information about location, size and shape of apertures formed on the beam shaping mask for shaping the beam, fabricating the beam shaping mask based upon the mask data, and exposing the device pattern by selectively passing the beam through one of the block apertures, the variable exposure aperture and the fine aperture based upon block exposure data, the variable exposure data and the fine exposure data.
    • 一种用于在对象上露出半导体器件的图案的方法包括以下步骤:从设计数据中提取块曝光数据,半导体器件,从设计数据中提取可变曝光数据,从可变曝光数据中提取精细曝光数据,使得精细 曝光数据包括具有小于预定阈值尺寸的细小元素图案的曝光数据,在预定阈值尺寸以下,由可变形波束进行曝光是困难的,提取表示基于用于成形光束的光束成形掩模的结构的掩模数据 块曝光数据,可变曝光数据和精细曝光数据,使得掩模数据包括关于形成在用于成形光束的光束整形掩模上的孔的位置,尺寸和形状的信息,基于掩模数据制造光束整形掩模, 并且通过选择性地将光束通过块孔之一,可变曝光来暴露设备图案 基于块曝光数据,可变曝光数据和精细曝光数据的光圈和精细光圈。
    • 34. 发明授权
    • Charged particle beam lithography system and method
    • 带电粒子束光刻系统及方法
    • US5173582A
    • 1992-12-22
    • US585777
    • 1990-09-20
    • Kiichi SakamotoHiroshi YasudaAkio Yamada
    • Kiichi SakamotoHiroshi YasudaAkio Yamada
    • H01J37/317
    • B82Y10/00B82Y40/00H01J37/3174H01J2237/15H01J2237/30411H01J2237/31776
    • A charged particle beam lithography system includes a beam source of a charged particle beam, a beam shaping aperture for providing a predetermined cross section to the charged particle beam, a first focusing system for focusing the charged particle beam on a first crossover point located on the optical axis, a second focusing system provided between the first crossover point and an object for focusing the charged particle beam on a second crossover point located on the optical axis, a beam deflection system for deflecting the electron beam such that the beam is displaced on the surface of the object, a stage for supporting the object, a mask provided in a vicinity of said first focusing system, and an addressing system for selectively deflecting the charged particle beam such that the charged particle beam is passed through a selected aperture on the mask. The addressing system includes an electrostatic deflector for variable shaping of the charged particle beam and an electromagnetic deflector for deflecting the charged particle beam such that the charged particle beam is selectively passed through a selected one of the plurality of apertures except for the predetermined aperture.
    • 带电粒子束光刻系统包括带电粒子束的束源,用于向带电粒子束提供预定横截面的光束整形孔;第一聚焦系统,用于将带电粒子束聚焦在位于所述带电粒子束上的第一交越点 光轴,设置在第一交叉点和用于将带电粒子束聚焦在位于光轴上的第二交叉点上的物体之间的第二聚焦系统,用于偏转电子束的光束偏转系统,使得光束在 物体的表面,用于支撑物体的台,设置在所述第一聚焦系统附近的掩模和用于选择性地偏转带电粒子束的寻址系统,使得带电粒子束穿过掩模上的选定孔径 。 寻址系统包括用于带电粒子束的可变成形的静电偏转器和用于偏转带电粒子束的电磁偏转器,使得带电粒子束选择性地通过除了预定孔径之外的多个孔中的所选择的孔中。
    • 37. 发明授权
    • Method of exposing patttern of semiconductor devices and stencil mask
for carrying out same
    • 曝光半导体器件的模板和执行相同模板的方法
    • US5364718A
    • 1994-11-15
    • US57017
    • 1993-05-05
    • Yoshihisa OaeKiichi Sakamoto
    • Yoshihisa OaeKiichi Sakamoto
    • G03F1/20G03F7/20H01J37/302G03F9/00
    • G03F1/20G03F7/2022G03F7/70475H01J37/3026
    • A method is provided for exposing a semiconductor device pattern onto a semiconductor substrate by repeatedly exposing an adjoining arrangement of a plurality of unit patterns. The device pattern is first divided into a plurality of unit patterns. Then, a stencil mask is provided with transmitting openings having shapes conforming to the respective unit patterns. Pattern lines on the stencil mask of the unit patterns which are to be connected with each other have at least one connecting end provided with at least one protrusion having a width less than that of the corresponding pattern lines. The protrusion on the connecting end reduces errors such as interruptions or excessive broadening in an exposed pattern line due to misalignment. Also disclosed is a stencil mask for carrying out the present inventive method.
    • 提供了一种通过重复暴露多个单元图案的相邻布置来将半导体器件图案暴露于半导体衬底上的方法。 首先将装置图案划分为多个单位图案。 然后,模板掩模设置有具有符合相应单元图案的形状的透光开口。 要连接的单元图案的模板掩模上的图案线具有设置有至少一个具有小于对应图案线的宽度的突起的至少一个连接端。 连接端上的突起由于未对准而减少了暴露图案线中的中断或过度变宽的错误。 还公开了用于实施本发明的方法的模板掩模。
    • 38. 发明授权
    • Fabrication method for semiconductor devices and transparent mask for
charged particle beam
    • 半导体器件的制造方法和带电粒子束的透明掩模
    • US5036209A
    • 1991-07-30
    • US424733
    • 1989-10-20
    • Toyotaka KataokaKiichi Sakamoto
    • Toyotaka KataokaKiichi Sakamoto
    • G03F1/00G03F1/20G03F7/20H01J37/09H01J37/317
    • B82Y10/00B82Y40/00G03F1/20G03F7/2047H01J37/09H01J37/3174H01J2237/024H01J2237/15H01J2237/31776
    • A charged particle beam exposure apparatus includes a charged particle beam generator, a deflector device for deflecting the charged particle beam electromagnetically to individually illuminate small areas of a pattern forming region formed on a transparent mask, apparatus for moving the transparent mask mechanically, and the various components required for reducing the charged particle beam pattern through the mask and projecting the same onto a semiconductor device substrate to be exposed. A semiconductor device is fabricated using such apparatus by moving the mask mechanically to position a pattern forming region at a predetermined exposure position. The pattern forming region includes a plurality of small areas which can be individually selected by deflecting the charged particle beam when the pattern forming region is positioned at the exposure position. Each individual area is of a size such that the entirety thereof is exposed when the beam is deflected onto such area.
    • 在带电粒子束曝光装置中,包括用于产生带电粒子束(20)的装置(21-23),用于电磁地偏转带电粒子束(20)的偏转装置(24)并照射多个 构成形成在透明掩模(26)上的多个聚集隔板(27)的一个聚集隔板(27)的小隔板(28); 用于机械地移动透明掩模(26)的掩模移动装置和用于减小通过掩模(26)图案化的带电粒子束(20)的减少曝光装置(30-34),并将其暴露于半导体器件(35)上 ),制造半导体器件(35)的方法包括以下步骤:通过掩模移动装置将多个聚集隔板(27)中的一个聚集隔板(27)移动到预定位置; 通过所述偏转装置(24)从所述移动的聚集隔板(27)的所述多个小隔板(28)中选择一个小隔板(28); 并且通过所述还原曝光装置(30-34)减小所选择的小分区(28)并将其暴露在所述半导体器件(35)上。