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31. 发明申请

US20080211721A1 Antenna device and wireless device 失效
标题翻译：天线设备和无线设备
公开(公告)号：US20080211721A1
公开(公告)日：2008-09-04
申请号：US11900219
申请日：2007-09-11
申请人： Isao Ohba , Hiromichi Suzuki
发明人： Isao Ohba , Hiromichi Suzuki
IPC分类号： H01Q1/24
CPC分类号： H01Q1/243 , H01Q21/28 , H01Q21/29 , H04B7/0814
摘要： According to an aspect of the invention, there is provided an antenna device housed within a wireless device, including: a first case and a second case at least partly overlapping with each other, the first and second cases electrically connected with each other and slidable to open and close the antenna device; a first board housed within the first case; a second board housed within the second case; a first unbalanced antenna element connected to a first feeding point located in a vicinity of a first edge departing from the second case among edges of the first board when the first case and the second case are slid in a direction to open the wireless device; and a second unbalanced antenna element being connected to a second feeding point located in a vicinity of a second edge substantially perpendicular to the first edge among edges of the second board.
摘要翻译：根据本发明的一个方面，提供了一种容纳在无线设备内的天线装置，包括：第一壳体和至少部分地彼此重叠的第二壳体，第一壳体和第二壳体彼此电连接并可滑动到打开和关闭天线设备; 在第一种情况下容纳的第一板; 第二个板容纳在第二个壳体内; 当所述第一壳体和所述第二壳体沿着打开所述无线装置的方向滑动时，所述第一不平衡天线元件连接到位于所述第一侧边缘附近的第一边缘附近的第一馈电点; 以及第二不平衡天线元件，其连接到位于所述第二板的边缘之间的与所述第一边缘基本垂直的第二边缘附近的第二馈电点。

32. 发明授权

US07413930B2 Lead frame and method of manufacturing the lead frame 失效
标题翻译：引线框架和引线框架的制造方法
公开(公告)号：US07413930B2
公开(公告)日：2008-08-19
申请号：US10569577
申请日：2003-08-29
申请人： Fujio Ito , Hiromichi Suzuki , Toshio Sasaki
发明人： Fujio Ito , Hiromichi Suzuki , Toshio Sasaki
IPC分类号： H01L21/82
CPC分类号： H01L23/49541 , H01L21/4842 , H01L23/49558 , H01L2924/0002 , H01L2924/00
摘要： A plurality of inner leads, a plurality of outer leads formed in one with each of the inner lead, a bar lead of the square ring shape arranged inside a plurality of inner leads, a corner part lead which has been arranged between the inner leads of the end portion of the inner lead groups which adjoin among four inner lead groups corresponding to each side of the bar lead, and was connected with the bar lead, and a tape member joined to the tip part of each inner lead, a bar lead, and a corner part lead are included. Since the corner part lead is formed as an object for reinforcement of a frame body between adjoining inner lead groups, the rigidity of the lead frame can be increased.
摘要翻译：多个内部引线，多个外部引线，每个外部引线与内部引线中的每一个形成一个，方形环形状的引脚布置在多个内部引线内;角部引线，其设置在内部引线之间所述内引线组的与所述棒引线的每一侧相对应的四个内引线组中相邻的所述内引线组的端部与所述引线连接，以及与所述内引线的前端接合的带部件，并包括角落部分铅。由于角部引线形成为在相邻的内引线组之间加强框架体的对象，所以可以提高引线框架的刚性。

33. 发明授权

US07397114B2 Semiconductor integrated circuit device and method of manufacturing the same 有权
标题翻译：半导体集成电路器件及其制造方法
公开(公告)号：US07397114B2
公开(公告)日：2008-07-08
申请号：US11362732
申请日：2006-02-28
申请人： Yoshinori Miyaki , Hiromichi Suzuki , Tsuyoshi Kaneda
发明人： Yoshinori Miyaki , Hiromichi Suzuki , Tsuyoshi Kaneda
IPC分类号： H01L23/495
CPC分类号： H01L24/32 , H01L21/565 , H01L23/3114 , H01L23/49582 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/29 , H01L2224/29007 , H01L2224/29101 , H01L2224/29111 , H01L2224/2929 , H01L2224/29339 , H01L2224/29393 , H01L2224/32014 , H01L2224/32245 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48455 , H01L2224/48465 , H01L2224/48599 , H01L2224/48664 , H01L2224/49 , H01L2224/49171 , H01L2224/73265 , H01L2224/743 , H01L2224/78 , H01L2224/78303 , H01L2224/83464 , H01L2224/83801 , H01L2224/85 , H01L2224/85181 , H01L2224/85464 , H01L2224/92 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/078 , H01L2924/10162 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/01026 , H01L2924/3512 , H01L2924/00012
摘要： A semiconductor integrated circuit device is provided which includes a wire having a diameter equal to or less than 30 μm, and a connected member molded by a resin. The connected member includes a metal layer including a palladium layer provided at a portion to which said wire is connected. A solder containing Pb as a main composition metal is provided at a portion outside a portion molded by the resin.
摘要翻译：提供一种半导体集成电路器件，其包括直径等于或小于30μm的线，以及由树脂模制的连接部件。连接构件包括金属层，该金属层包括设置在所述导线所连接的部分处的钯层。在由树脂成型的部分的外侧设置包含Pb作为主要成分金属的焊料。

34. 发明授权

US07374973B2 Manufacturing method of semiconductor device and manufacturing method of lead frame 失效
标题翻译：半导体器件的制造方法和引线框架的制造方法
公开(公告)号：US07374973B2
公开(公告)日：2008-05-20
申请号：US11181929
申请日：2005-07-15
申请人： Fujio Ito , Hiromichi Suzuki , Akihiko Kameoka , Junpei Kusukawa , Yoshitaka Takezawa
发明人： Fujio Ito , Hiromichi Suzuki , Akihiko Kameoka , Junpei Kusukawa , Yoshitaka Takezawa
IPC分类号： H01L21/00
CPC分类号： H01L21/56 , H01L21/4821 , H01L23/3107 , H01L23/49558 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160 to 300° C. (preferably 180 to 300° C.) for a total of more than 2 minutes in the atmosphere which has oxygen, crosslinkage density becoming high in resin of adhesives, a low molecular compound volatilizes and jumps out outside, therefore as a result, since a low molecular compound does not remain in resin of adhesives, the generation of copper migration can be prevented.
摘要翻译：旨在提高半导体器件的可靠性。通过加热引线框架，在用带子制备引线框架之后，直到进行树脂模制，在160-300℃（优选180-300℃）的温度下，总共超过2分钟具有氧的气氛，粘合剂树脂中的交联密度变高，低分子化合物挥发并跳出外部，因此，由于低分子化合物不会残留在粘合剂的树脂中，所以可以防止铜迁移的产生。

35. 发明申请

US20080087996A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20080087996A1
公开(公告)日：2008-04-17
申请号：US11858880
申请日：2007-09-20
申请人： Yoshinori MIYAKI , Hiromichi Suzuki
发明人： Yoshinori MIYAKI , Hiromichi Suzuki
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L23/3107 , H01L21/4821 , H01L23/49503 , H01L23/49541 , H01L23/49582 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/29007 , H01L2224/29111 , H01L2224/2919 , H01L2224/32014 , H01L2224/32245 , H01L2224/43 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48664 , H01L2224/73265 , H01L2224/78301 , H01L2224/83192 , H01L2224/838 , H01L2224/85181 , H01L2224/85464 , H01L2224/92 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/01026 , H01L2924/00012 , H01L2924/3512
摘要： An object of the invention is to improve a reliability of a semiconductor device. The semiconductor device comprises a semiconductor chip, a tab having an outside dimension smaller than that of the semiconductor chip, a plurality of wires, a plurality of inner leads which extend around the semiconductor chip and have, on a wire bonding portion to which a wire is bonded, a Pd plated layer, a resin sealant, and a plurality of outer leads having a Pd plated layer formed on the surface thereof. The inner leads, outer leads and tab are each made of a Cu alloy. Inside the resin sealant, a strike plated layer having on the surface thereof a pure Cu layer has been formed to expose it from a region of each of the inner leads other than the wire bonding portion. The strike plated layer is therefore bonded to the resin sealant, making it possible to improve the adhesion between the resin and the lead, thereby improving the reliability of the semiconductor device.
摘要翻译：本发明的目的是提高半导体器件的可靠性。半导体器件包括半导体芯片，具有比半导体芯片小的外形尺寸的突片，多个引线，围绕半导体芯片延伸的多个内引线，并且在引线接合部分上具有线 Pd镀层，树脂密封剂和在其表面上形成有Pd镀层的多个外引线。内部引线，外部引线和突片均由Cu合金制成。在树脂密封剂的内部，形成有表面具有纯Cu层的冲击镀层，以从引线接合部以外的各个内部引线的区域露出。因此，冲击镀层结合到树脂密封剂上，可以提高树脂和引线之间的粘附性，从而提高半导体器件的可靠性。

36. 发明申请

US20080081657A1 Portable wireless apparatus 失效
标题翻译：便携式无线设备
公开(公告)号：US20080081657A1
公开(公告)日：2008-04-03
申请号：US11657756
申请日：2007-01-25
申请人： Hiromichi Suzuki , Hiroyuki Hotta , Takashi Amano
发明人： Hiromichi Suzuki , Hiroyuki Hotta , Takashi Amano
IPC分类号： H04M1/00 , H01Q1/24
CPC分类号： H01Q1/243 , H01Q9/42 , H01Q21/28
摘要： According to an aspect of the invention, a portable wireless apparatus comprises a first housing and a second housing. The first housing comprises a first board having a first feeding portion; and a first antenna element connected to the first feeding portion and provided on a side of a first surface of the first board. The second housing foldably connected to the first housing comprises a second board having a surface opposite to the first surface of the first board when the second hosing is unfolded with respect to the first housing. The second board comprises a second feeding portion. A second antenna element is connected to the second feeding portion and provided on a side of the surface of the second board.
摘要翻译：根据本发明的一个方面，便携式无线装置包括第一壳体和第二壳体。第一壳体包括具有第一馈送部分的第一板; 以及连接到所述第一馈送部分并设置在所述第一板的第一表面的一侧上的第一天线元件。可折叠地连接到第一壳体的第二壳体包括具有与第一板的第一表面相对的表面的第二板，当第二焊接相对于第一壳体展开时。第二板包括第二进料部分。第二天线元件连接到第二馈电部分并且设置在第二板的表面的一侧。

37. 发明申请

US20070241985A1 Unbalanced power feeding antenna device for making radio communications 失效
标题翻译：用于制造无线电通信的不平衡馈电天线装置
公开(公告)号：US20070241985A1
公开(公告)日：2007-10-18
申请号：US11497737
申请日：2006-08-02
申请人： Hiromichi Suzuki , Isao Ohba , Takayuki Shibuya , Yusuke Okada , Kenji Matsuzaki
发明人： Hiromichi Suzuki , Isao Ohba , Takayuki Shibuya , Yusuke Okada , Kenji Matsuzaki
IPC分类号： H01Q1/50
CPC分类号： H01Q1/50
摘要： An antenna device which is connected to a radio module performing radio communications with a system using a first band and a system using a second band, has an antenna element which transmits/receives radio signals in the first and second bands. The antenna device has first and second matching circuits corresponding to the first and second bands, and also disposes a switching circuit between the first and second bands and the radio module. A first filter circuit is connected between the first matching circuit and the antenna element. The first filter circuit passes the radio signal in the first band and also attenuates the radio signal in the second band. Meanwhile, a second filter circuit is connected between the second matching circuit and the antenna element. The second filter circuit passes the radio signal in the second band and also attenuates the radio signal in the first band.
摘要翻译：连接到与使用第一频带的系统进行无线电通信的无线电模块和使用第二频带的系统的天线装置具有在第一和第二频带中发送/接收无线电信号的天线单元。天线装置具有对应于第一和第二频带的第一和第二匹配电路，并且还在第一和第二频带与无线电模块之间配置切换电路。第一滤波电路连接在第一匹配电路和天线元件之间。第一滤波器电路通过第一频带中的无线电信号，并且还使第二频带中的无线电信号衰减。同时，第二滤波电路连接在第二匹配电路和天线元件之间。第二滤波器电路通过第二频带中的无线电信号，并且还使第一频带中的无线电信号衰减。

38. 发明授权

US07247576B2 Method of manufacturing a semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US07247576B2
公开(公告)日：2007-07-24
申请号：US11260182
申请日：2005-10-28
申请人： Yoshinori Miyaki , Hiromichi Suzuki , Kazunari Suzuki , Takafumi Nishita , Fujio Ito , Kunihiro Tsubosaki , Akihiko Kameoka , Kunihiko Nishi
发明人： Yoshinori Miyaki , Hiromichi Suzuki , Kazunari Suzuki , Takafumi Nishita , Fujio Ito , Kunihiro Tsubosaki , Akihiko Kameoka , Kunihiko Nishi
IPC分类号： H01L21/302
CPC分类号： H01L24/27 , H01L21/56 , H01L23/3142 , H01L23/3171 , H01L23/3192 , H01L23/49503 , H01L23/49513 , H01L23/562 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/85 , H01L2224/02166 , H01L2224/274 , H01L2224/29007 , H01L2224/2919 , H01L2224/29339 , H01L2224/32014 , H01L2224/32055 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/743 , H01L2224/83192 , H01L2224/83855 , H01L2224/85 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12044 , H01L2924/1433 , H01L2924/181 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2224/85399
摘要： The occurrence of a package crack in the back vicinity of a die pad is restrained by making the outward appearance of the die pad of a lead frame smaller than that of a semiconductor chip which is mounted on it, and also the occurrence of a package crack in the main surface vicinity of the semiconductor chip is restrained by forming a layer of organic material with good adhesion property with the resin that constitutes the package body on the final passivation film (final passivation film) that covers the top layer of conductive wirings of the semiconductor chip.
摘要翻译：通过使引线框架的管芯焊盘的外观比安装在其上的半导体芯片的外观更小，从而抑制芯片焊盘背面附近的封装裂缝的发生，并且还发生封装裂纹通过在最终钝化膜（最终钝化膜）上形成覆盖顶层导电布线的最终钝化膜（最终钝化膜）的与构成封装体的树脂具有良好粘附性的有机材料层来抑制半导体芯片附近的主表面。半导体芯片

39. 发明申请

US20060199302A1 Semiconductor device and a manufacturing method of the same 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20060199302A1
公开(公告)日：2006-09-07
申请号：US11367297
申请日：2006-03-06
申请人： Fujio Ito , Hiromichi Suzuki , Akihiko Kameoka , Yoshitaka Takezawa , Junpei Kusukawa
发明人： Fujio Ito , Hiromichi Suzuki , Akihiko Kameoka , Yoshitaka Takezawa , Junpei Kusukawa
IPC分类号： H01L21/00
CPC分类号： H01L23/49503 , H01L23/293 , H01L23/3107 , H01L23/49506 , H01L23/49548 , H01L23/49558 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/86 , H01L2224/05554 , H01L2224/32014 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor device is manufactured by adhering a fixing tape to plural leads of a lead frame comprising a copper alloy, mounting a semiconductor chip on a tab of the lead frame, electrically connecting the leads to electrodes a of the semiconductor chip via bonding wires, forming a sealing resin portion that seals the semiconductor chip, the tab, the bonding wires, the leads and the fixing tape, and cutting the lead frame. A binder layer of the fixing tape includes at least % by weight of an amine-curable epoxy resin as its main component, and does not include a phenol resin. The binder layer of the fixing tape further includes no more than % by weight of acrylonitrile butadiene rubber. By using this material for the binder layer of the fixing tape, migration of the copper in the leads is suppressed even when a degradation test with strict environmental degradation conditions is conducted.
摘要翻译：半导体器件通过将固定带粘附到包括铜合金的引线框架的多个引线上，将引线框架的突片上安装半导体芯片，通过接合线将引线电连接到半导体芯片的电极a，形成密封半导体芯片，突片，接合线，引线和固定带的密封树脂部分，以及切割引线框架。固定带的粘合剂层至少包含以胺可固化的环氧树脂为主要成分的重量百分比，不包括酚醛树脂。定影带的粘合剂层还包括不超过重量％的丙烯腈丁二烯橡胶。通过将该材料用于固定带的粘合剂层，即使进行严格的环境退化条件的劣化试验，也能抑制引线中铜的迁移。

40. 发明申请

US20060138617A1 Semiconductor integrated circuit device and method of manufacturing the same 有权
公开(公告)号：US20060138617A1
公开(公告)日：2006-06-29
申请号：US11362732
申请日：2006-02-28
申请人： Yoshinori Miyaki , Hiromichi Suzuki , Tsuyoshi Kaneda
发明人： Yoshinori Miyaki , Hiromichi Suzuki , Tsuyoshi Kaneda
IPC分类号： H01L23/495 , H01L23/48
CPC分类号： H01L24/32 , H01L21/565 , H01L23/3114 , H01L23/49582 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/29 , H01L2224/29007 , H01L2224/29101 , H01L2224/29111 , H01L2224/2929 , H01L2224/29339 , H01L2224/29393 , H01L2224/32014 , H01L2224/32245 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48455 , H01L2224/48465 , H01L2224/48599 , H01L2224/48664 , H01L2224/49 , H01L2224/49171 , H01L2224/73265 , H01L2224/743 , H01L2224/78 , H01L2224/78303 , H01L2224/83464 , H01L2224/83801 , H01L2224/85 , H01L2224/85181 , H01L2224/85464 , H01L2224/92 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/078 , H01L2924/10162 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/01026 , H01L2924/3512 , H01L2924/00012
摘要： A semiconductor integrated circuit device is provided which includes a wire having a diameter equal to or less than 30 μm, and a connected member molded by a resin. The connected member includes a metal layer including a palladium layer provided at a portion to which said wire is connected. A solder containing Pb as a main composition metal is provided at a portion outside a portion molded by the resin.

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