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    • 32. 发明申请
    • DUPLEXER
    • 双机
    • US20100219901A1
    • 2010-09-02
    • US12681182
    • 2008-09-26
    • Tetsuya TsurunariHiroyuki NakamuraJoji Fujiwara
    • Tetsuya TsurunariHiroyuki NakamuraJoji Fujiwara
    • H03H9/70
    • H03H9/0576H03H9/725
    • A duplexer according to the present invention includes: an acoustic wave element having a first terminal and a second terminal; a substrate mounting the acoustic wave element on the surface; a first columnar conductor electrically connected to the first terminal, and drawn to a back surface of the substrate, while being buried partially in the substrate; a second columnar conductor electrically connected to the second terminal, and drawn to the back surface of the substrate, while being buried partially in the substrate; a first ground pattern region arranged between the first columnar conductor drawn part and the second columnar conductor drawn part on the back surface of the substrate; a second ground pattern region electrically connected to the first ground pattern region on the back surface of the substrate and arranged in the part not including the part between the first columnar conductor drawn part and the second columnar conductor drawn part; and a third columnar conductor electrically connected to the first ground pattern region, while being buried partially in the substrate.
    • 根据本发明的双工器包括:具有第一端子和第二端子的声波元件; 将声波元件安装在表面上的基板; 电连接到第一端子的第一柱状导体,并被部分地埋设在基板中,并被拉到基板的背面; 电连接到第二端子的第二柱状导体,并被部分地埋设在基板中,并被拉到基板的背面; 布置在所述基板的背面上的所述第一柱状导体拉出部和所述第二柱状导体拉伸部之间的第一接地图案​​区域; 电连接到基板的背面上的第一接地图案​​区域并布置在不包括第一柱状导体拉出部分和第二柱状导体拉出部分之间的部分中的第二接地图案区域; 以及第三柱状导体,其电连接到所述第一接地图案​​区域,同时被部分地掩埋在所述衬底中。
    • 34. 发明申请
    • ACOUSTIC WAVE DEVICE
    • 声波设备
    • US20090267447A1
    • 2009-10-29
    • US12428577
    • 2009-04-23
    • Rei GOTOHidekazu NakanishiHiroyuki Nakamura
    • Rei GOTOHidekazu NakanishiHiroyuki Nakamura
    • H01L41/04
    • H03H9/02559H03H9/02834
    • An acoustic wave device includes a piezoelectric substrate having a surface adapted to allow leaky surface wave to propagate thereon, an interdigital electrode provided on a portion of the surface of the piezoelectric substrate, and a dielectric layer provided on the surface of the piezoelectric substrate to cover the interdigital electrode. The piezoelectric substrate is made of lithium niobate. The dielectric layer is made of tantalum pentoxide. The piezoelectric substrate is made of a rotated Y-cut substrate having a cut angle which is not smaller than 2.5 degrees and is not larger than 22.5 degrees. A ratio H/λ of a film thickness H of the dielectric layer to a wavelength λ of a center frequency of the leaky surface wave ranges from 0.034 to 0.126. This acoustic wave device works in a wide band width.
    • 声波装置包括:压电基板,其具有适于允许漏表面波传播的表面;设置在压电基板的表面的一部分上的叉指电极;以及设置在压电基板的表面上的电介质层, 叉指电极。 压电基板由铌酸锂制成。 电介质层由五氧化二钽制成。 压电基板由具有不小于2.5度且不大于22.5度的切割角度的旋转Y切割基板制成。 电介质层的膜厚H与漏表面波的中心频率的波长λ的比率H /λ为0.034〜0.126。 该声波装置工作在宽带宽。
    • 38. 发明申请
    • Binding Device and Binding Method for Horticulture
    • 园艺装订装置及装订方法
    • US20080104886A1
    • 2008-05-08
    • US11792944
    • 2005-07-28
    • Hiroyuki NakamuraMoriyuki Watanuki
    • Hiroyuki NakamuraMoriyuki Watanuki
    • A01G17/08B65B13/24
    • A01G17/085B65B13/305
    • A binding device for horticulture for binding a tape by cutting and bending a tape overlapping part is provided.In the binding device, a blade (4) is attached to one of an arm (3) or a main body (2), and a blade receiver (5) is attached to the other of them facing with each other. The blade (4) and the blade receiver (5) form cutting to a tape overlapping part, and the blade (4) has a shape for cutting and bending the tape to form a locking to the inner end of the cut tape as well as the blade receiver (5) is formed to pull the cut tape out therefrom in an outer end direction, so that the tape can be maintained in a bound state by locking the tape itself.
    • 提供了一种用于通过切割和弯曲带重叠部分来结合带子的园艺装订装置。 在装订装置中,叶片(4)附接到臂(3)或主体(2)中的一个,并且叶片接收器(5)附接到彼此面对的另一个。 刀片(4)和刀片接收器(5)形成切割到带重叠部分,并且刀片(4)具有用于切割和弯曲带子以形成锁定到切割带的内端的形状,以及 刀片接收器(5)被形成为在外端方向上将切割的带从其中拉出,使得可以通过锁定带自身来将带保持在绑定状态。