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31. 发明授权

US06300685B1 Semiconductor package 失效
标题翻译：半导体封装
公开(公告)号：US06300685B1
公开(公告)日：2001-10-09
申请号：US09358366
申请日：1999-07-21
申请人： Kiyoshi Hasegawa , Fumihiko Ooka
发明人： Kiyoshi Hasegawa , Fumihiko Ooka
IPC分类号： H01L2348
CPC分类号： H01L24/06 , H01L23/13 , H01L23/24 , H01L23/3107 , H01L23/49816 , H01L23/49827 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/94 , H01L24/97 , H01L2224/0401 , H01L2224/04042 , H01L2224/05556 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/48599 , H01L2224/49171 , H01L2224/49175 , H01L2224/73204 , H01L2224/73215 , H01L2224/94 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package includes a semiconductor chip having a major surface and first pads formed on the major surface. The semiconductor package also includes a package substrate having (a) opposite first and second major surfaces, (b) a side surface extending between the first and second major surfaces, (c) a pad forming region adjacent to and along the side surface, (d) second pads formed on the pad forming region, (e) external electrodes formed on the first major surface of the package substrate, wherein the second major surface of the package substrate is fixed to the major surface of the semiconductor chip, and wherein the external electrodes are electrically connected to the second pads. The semiconductor package further includes bonding wires electrically connecting the first pads to the second pads and a sealing material covering the bonding wires and first and second pads.
摘要翻译：半导体封装包括具有主表面的半导体芯片和在主表面上形成的第一焊盘。半导体封装还包括具有（a）相对的第一和第二主表面的封装衬底，（b）在第一和第二主表面之间延伸的侧表面，（c）与侧表面相邻并沿着侧表面的焊盘形成区域（ d）形成在焊盘形成区域上的第二焊盘，（e）形成在封装基板的第一主表面上的外部电极，其中封装基板的第二主表面固定到半导体芯片的主表面，并且其中外部电极电连接到第二焊盘。半导体封装还包括将第一焊盘电连接到第二焊盘的接合线和覆盖接合线以及第一和第二焊盘的密封材料。

32. 发明授权

US6160682A Magnetic head device with rail formed within width of head chip and method of making same 失效
标题翻译：磁头装置与磁头芯片宽度形成，其制作方法
公开(公告)号：US6160682A
公开(公告)日：2000-12-12
申请号：US190463
申请日：1998-11-13
申请人： Masahiko Yamazaki , Kiyoshi Hasegawa
发明人： Masahiko Yamazaki , Kiyoshi Hasegawa
IPC分类号： G11B5/49 , G11B5/127 , G11B5/265 , G11B5/60 , G11B5/187
CPC分类号： G11B5/6005
摘要： A magnetic head device exhibiting optimum floating characteristics without the risk of fracturing a first rail, and a manufacturing method for the magnetic head device. In this magnetic head device, the first rail is formed on a surface of a first head chip facing a disc-shaped recording medium for extending parallel to the running direction of the disc-shaped recording medium, and a second rail is formed for extending parallel to the first rail. The first rail is formed by grooving the center slider side of the first head chip.
摘要翻译：一种表现出最佳漂浮特性而没有压裂第一轨的风险的磁头装置，以及磁头装置的制造方法。在该磁头装置中，第一导轨形成在面向盘状记录介质的第一头芯片的表面上，用于平行于盘形记录介质的运行方向延伸，并且形成第二导轨，用于平行延伸到第一条铁路。第一轨道通过对第一头芯片的中心滑块侧进行切槽而形成。

33. 发明授权

US5774701A Microprocessor operating at high and low clok frequencies 失效
标题翻译：微处理器工作在高低低频率
公开(公告)号：US5774701A
公开(公告)日：1998-06-30
申请号：US500227
申请日：1995-07-10
申请人： Shigezumi Matsui , Mitsuyoshi Yamamoto , Shinichi Yoshioka , Susumu Narita , Ikuya Kawasaki , Susumu Kaneko , Kiyoshi Hasegawa
发明人： Shigezumi Matsui , Mitsuyoshi Yamamoto , Shinichi Yoshioka , Susumu Narita , Ikuya Kawasaki , Susumu Kaneko , Kiyoshi Hasegawa
IPC分类号： G06F1/08 , G06F1/04
CPC分类号： G06F1/08
摘要： A microprocessor incorporating a PLL circuit using a clock pulse having a relatively low frequency as an input clock signal of a reference frequency to form an oscillating pulse of a relatively high frequency by multiplying the input clock signal. In the microprocessor, the operation of the PLL circuit is stopped in the low-speed mode to supply the clock pulse of the relatively low frequency to the microprocessor as a system clock signal, and, in the high-speed mode, the PLL circuit is activated upon reception of an event requiring high-speed processing. Until the operation of the PLL circuit is stabilized and the request for high-speed processing comes, the above-mentioned clock pulse having the relatively low frequency is kept supplied continuously to the microprocessor as the system clock signal. This novel setup permits the high-speed switching of the microprocessor from the operating mode to the high-speed operating mode. Accordingly, the microprocessor may be kept operating until the output frequency of the PLL circuit is stabilized, thereby allowing the microprocessor to cope with an unpredictable situation such as the occurrence of a priority event or a failure.
摘要翻译：一种微处理器，其使用具有相对较低频率的时钟脉冲的PLL电路作为参考频率的输入时钟信号，以通过乘以输入时钟信号来形成相对高频率的振荡脉冲。在微处理器中，PLL电路的操作在低速模式下停止，以较低频率的时钟脉冲作为系统时钟信号供给微处理器，在高速模式下，PLL电路为在接收到需要高速处理的事件时被激活。直到PLL电路的操作稳定并且高速处理的请求到来之前，具有较低频率的上述时钟脉冲作为系统时钟信号被连续地提供给微处理器。这种新颖的设置允许微处理器从操作模式到高速操作模式的高速切换。因此，微处理器可以保持工作，直到PLL电路的输出频率稳定，从而允许微处理器处理诸如发生优先事件或故障的不可预知的情况。

34. 发明授权

US5653037A Apparatus and method for measurement of tapped hole 失效
标题翻译：螺纹孔测量装置及方法
公开(公告)号：US5653037A
公开(公告)日：1997-08-05
申请号：US558401
申请日：1995-11-16
申请人： Kiyoshi Hasegawa , Hidehiro Manabe , Ryuji Fukada
发明人： Kiyoshi Hasegawa , Hidehiro Manabe , Ryuji Fukada
IPC分类号： G01K13/10 , G01B13/10
CPC分类号： G01K13/10 , G01B13/10 , G01B5/204 , Y10S33/02
摘要： A tapped hole measuring apparatus available for automatically measuring the major diameter, minor diameter, effective diameter and depth of a tapped hole. The apparatus comprises a measuring stylus with at least two air discharging ports which can take inserting movement into the tapped hole. The apparatus separately measures the variations of the back pressures of air supplied to the air discharging ports, and converts the back pressure variations into electric signals and stores them. Also included in the apparatus is a configuration calculating section for comparing the variation of the electric signal from the tapped hole with a variation of electric signal from a reference tapped hole to obtain the configurational dimensions of the tapped hole being measured.
摘要翻译：螺纹孔测量装置可用于自动测量螺纹孔的长径，小直径，有效直径和深度。该装置包括具有至少两个空气排放口的测量笔，其可以将插入的运动插入到螺纹孔中。该装置分别测量供给到排气口的空气的背压的变化，并将背压变化转换为电信号并将其存储。装置中还包括一个配置计算部分，用于将来自螺纹孔的电信号的变化与来自参考螺纹孔的电信号的变化进行比较，以获得所测量的螺纹孔的结构尺寸。

35. 发明授权

US5553297A Industrial control apparatus 失效
标题翻译：工业控制装置
公开(公告)号：US5553297A
公开(公告)日：1996-09-03
申请号：US119322
申请日：1993-09-09
申请人： Masaaki Yonezawa , Kiyoshi Hasegawa , Yasunori Kawata , Kouji Matsuoka , Takasi Kadowaki
发明人： Masaaki Yonezawa , Kiyoshi Hasegawa , Yasunori Kawata , Kouji Matsuoka , Takasi Kadowaki
IPC分类号： G05B19/05 , G06F9/38 , G06F15/16
CPC分类号： G06F9/3879 , G05B19/052 , G06F9/3877
摘要： A programmable controller is disclosed that incorporates a sequence control program adapted to input and output information to a variety of local intelligent appliances at a high velocity and a high efficiency in the field of factory automation for efficiently controlling factory production lines or the field of process automation for controlling multiple industrial processes. Provided for this purpose is an improved a change-over system associated with a 1-bit processor and an ordinary processor for executing the sequence control program. Also improved are functions for a user to particularly specify a BASIC program, software/hardware control functions for a group of I/O boards for transferring signals to receiving signals from the local appliances, and the ability to program the internally stored sequence control program.
摘要翻译：公开了一种可编程控制器，其包括顺序控制程序，其适于在工厂自动化领域以高速度和高效率向各种本地智能设备输入和输出信息，以有效地控制工厂生产线或过程自动化领域用于控制多个工业过程。为此目的提供了一种改进的与1位处理器和用于执行顺序控制程序的普通处理器相关联的切换系统。还改进了用于特别指定BASIC程序的功能，用于将信号传送到来自本地设备的接收信号的一组I / O板的软件/硬件控制功能以及对内部存储的序列控制程序进行编程的能力。

36. 发明授权

US09562279B2 Prespray processing method 有权
标题翻译：预喷处理方法
公开(公告)号：US09562279B2
公开(公告)日：2017-02-07
申请号：US13378621
申请日：2010-05-26
申请人： Kiyoshi Hasegawa , Shuuji Adachi , Mitsuo Uchiyama , Yoshirou Noguchi , Takahiro Iwasaki , Kimio Nishimura
发明人： Kiyoshi Hasegawa , Shuuji Adachi , Mitsuo Uchiyama , Yoshirou Noguchi , Takahiro Iwasaki , Kimio Nishimura
IPC分类号： B23H5/00 , C23C4/02 , B23K26/00 , F02F1/00
CPC分类号： C23C4/02 , B23B41/12 , B23H9/008 , B23K26/0093 , B23K26/3584 , B23K26/364 , F02F1/00 , F05C2253/12 , Y10T428/24281 , Y10T428/2457
摘要： A boring cutter body (5) is inserted into a circular hole (3) and is rotated and moved in an axial direction, whereby screw-shaped groove parts (11) are formed by using a tool bit (9) provided on a tip end of an outer peripheral portion, and broken surfaces (15) are formed by breaking tips of ridge parts generated by formation of the groove parts (11). Moreover, the groove parts (11) are processed through electric discharge machining using a wire electrode (17) provided to the boring cutter body (5) behind the tool bit (9) in the rotating direction, thereby forming finely roughened portions (41) having more finely roughened shapes than the broken surfaces (15).
摘要翻译：将钻头（5）插入圆孔（3）中并沿轴向转动和移动，由此通过使用设置在尖端（3）上的工具钻头（9）形成螺旋形槽部分（11）的外周部分，并且通过破坏通过形成槽部（11）而产生的脊部的尖端而形成断裂面（15）。此外，通过使用在工具钻头（9）的旋转方向上设置在镗刀体（5）上的线电极（17）的放电加工来对槽部（11）进行加工，从而形成细小的粗糙部（41）具有比破碎表面（15）更细的粗糙的形状。

37. 发明授权

US09109276B2 Cylindrical internal surface processing method 有权
标题翻译：圆柱内表面处理方法
公开(公告)号：US09109276B2
公开(公告)日：2015-08-18
申请号：US12885026
申请日：2010-09-17
申请人： Koichi Kanai , Kiyokazu Sugiyama , Eiji Shiotani , Kimio Nishimura , Junichi Uchiyama , Kiyohisa Suzuki , Jun Inomata , Daisuke Terada , Akira Shimizu , Hidenobu Matsuyama , Kiyoshi Hasegawa , Takashi Iiya
发明人： Koichi Kanai , Kiyokazu Sugiyama , Eiji Shiotani , Kimio Nishimura , Junichi Uchiyama , Kiyohisa Suzuki , Jun Inomata , Daisuke Terada , Akira Shimizu , Hidenobu Matsuyama , Kiyoshi Hasegawa , Takashi Iiya
IPC分类号： C23C4/18 , C23C4/12 , C23C4/16 , F02F1/00 , B05B7/22 , B05B13/06
CPC分类号： C23C4/124 , B05B7/224 , B05B13/0636 , C23C4/12 , C23C4/129 , C23C4/16 , C23C4/18 , F02F1/00 , F05C2253/12 , Y10T29/49272 , Y10T428/13
摘要： A cylindrical internal surface processing method comprises forming a cylinder bore, roughening an upper section of the bore, depositing coating onto the bore, and machining a lower section of the bore and the coating. The forming of the cylinder bore includes forming the upper and lower sections with the lower section being axially spaced from the upper section and having an axial length greater than zero. The roughening creates a roughened surface such that a radially innermost edge of the roughened surface has an internal diameter smaller than an internal diameter of the lower section. The coating is deposited to cover the upper section and at least a portion of the lower section. The machining forms a tapered portion and a cylindrical portion, a radially outermost edge of the cylindrical portion having an internal diameter larger than that of a radially outermost edge of the roughened surface.
摘要翻译：圆柱形内表面处理方法包括形成气缸孔，使孔的上部部分粗糙化，在孔上沉积涂层，以及加工孔的下部和涂层。缸孔的形成包括形成上部和下部，其中下部与上部轴向间隔开并具有大于零的轴向长度。粗糙化产生粗糙表面，使得粗糙表面的径向最内边缘具有小于下部内径的内径。沉积涂层以覆盖上部和下部的至少一部分。加工形成锥形部分和圆柱形部分，圆柱形部分的径向最外边缘的内径大于粗糙表面的径向最外边缘的内径。

38. 发明授权

US08882486B2 Control device for an injection molding machine 有权
标题翻译：注塑机控制装置
公开(公告)号：US08882486B2
公开(公告)日：2014-11-11
申请号：US13496446
申请日：2011-08-01
申请人： Koichiro Ueda , Kiyoshi Hasegawa , Hidemasa Ogi , Yukihiko Kobayashi
发明人： Koichiro Ueda , Kiyoshi Hasegawa , Hidemasa Ogi , Yukihiko Kobayashi
IPC分类号： B29C45/77 , B29C45/76
CPC分类号： B29C45/76 , B29C45/77 , B29C2945/76006 , B29C2945/76257 , B29C2945/76381 , B29C2945/76598 , B29C2945/76859 , B29C2945/76933 , B29C2945/76936
摘要： To execute a stable pressure control, in a control device for an injection molding machine, a filling/pressure-keeping determining unit determines whether the injection molding machine is performing a pressure keeping operation, an elastic constant identifier acquires, when the filling/pressure-keeping determining unit determines that the pressure keeping operation is in progress, a pressure detection value and a position detection value as operation information of a motor and identifies an elastic constant K based on the acquired pressure detection value and the position detection value, and a pressure-control control-parameter setting unit calculates a proportional gain Ka of a pressure controller such that a product of the proportional gain Ka of the pressure controller and the elastic constant K is smaller than a speed control bandwidth ωsc of a speed controller, and sets the calculated proportional gain Ka to the pressure controller.
摘要翻译：为了执行稳定的压力控制，在注射成型机的控制装置中，填充/保压确定单元确定注射成型机是否进行压力保持操作，弹性常数标识符获取当填充/压力 - 保持确定单元确定压力保持操作正在进行，压力检测值和位置检测值作为电动机的操作信息，并且基于获取的压力检测值和位置检测值来识别弹性常数K，并且压力控制控制参数设定单元计算压力控制器的比例增益Ka，使得压力控制器的比例增益Ka与弹性常数K的乘积小于速度控制器的速度控制带宽ωsc，并将计算比例增益Ka到压力控制器。

39. 发明申请

US20130032961A1 CONTROL DEVICE AND CONTROL METHOD FOR INJECTION MOLDING MACHINE 有权
标题翻译：注射成型机的控制装置及其控制方法
公开(公告)号：US20130032961A1
公开(公告)日：2013-02-07
申请号：US13496446
申请日：2011-08-01
申请人： Koichiro Ueda , Kiyoshi Hasegawa , Hidemasa Ogi , Yukihiko Kobayashi
发明人： Koichiro Ueda , Kiyoshi Hasegawa , Hidemasa Ogi , Yukihiko Kobayashi
IPC分类号： B29C45/77 , B29C45/76
CPC分类号： B29C45/76 , B29C45/77 , B29C2945/76006 , B29C2945/76257 , B29C2945/76381 , B29C2945/76598 , B29C2945/76859 , B29C2945/76933 , B29C2945/76936
摘要： To execute a stable pressure control, in a control device for an injection molding machine, a filling/pressure-keeping determining unit determines whether the injection molding machine is performing a pressure keeping operation, an elastic constant identifier acquires, when the filling/pressure-keeping determining unit determines that the pressure keeping operation is in progress, a pressure detection value and a position detection value as operation information of a motor and identifies an elastic constant K based on the acquired pressure detection value and the position detection value, and a pressure-control control-parameter setting unit calculates a proportional gain Ka of a pressure controller such that a product of the proportional gain Ka of the pressure controller and the elastic constant K is smaller than a speed control bandwidth ωsc of a speed controller, and sets the calculated proportional gain Ka to the pressure controller.
摘要翻译：为了执行稳定的压力控制，在注射成型机的控制装置中，填充/保压确定单元确定注射成型机是否进行压力保持操作，弹性常数标识符获取当填充/压力 - 保持确定单元确定压力保持操作正在进行，压力检测值和位置检测值作为电动机的操作信息，并且基于获取的压力检测值和位置检测值来识别弹性常数K，并且压力控制控制参数设定单元计算压力控制器的比例增益Ka，使得压力控制器的比例增益Ka与弹性常数K的乘积小于速度控制器的速度控制带宽ωsc，并将计算比例增益Ka到压力控制器。

40. 发明授权

US08193351B2 HSP90 inhibitor 失效
标题翻译： HSP90抑制剂
公开(公告)号：US08193351B2
公开(公告)日：2012-06-05
申请号：US12302149
申请日：2007-05-25
申请人： Takuo Tsukuda , Ken-Ichi Kawasaki , Susumu Komiyama , Yoshiaki Isshiki , Yasuhiko Shiratori , Kiyoshi Hasegawa , Takaaki Fukami , Takaaki Miura , Naomi Ono , Toshikazu Yamazaki , Young-Jun Na , Dong-Oh Yoon , Sung-Jin Kim
发明人： Takuo Tsukuda , Ken-Ichi Kawasaki , Susumu Komiyama , Yoshiaki Isshiki , Yasuhiko Shiratori , Kiyoshi Hasegawa , Takaaki Fukami , Takaaki Miura , Naomi Ono , Toshikazu Yamazaki , Young-Jun Na , Dong-Oh Yoon , Sung-Jin Kim
IPC分类号： C07D239/47 , C07D251/42 , A61K31/506 , A61K31/53 , A61P35/00
CPC分类号： C07D251/16 , C07D239/47 , C07D239/48 , C07D401/12 , C07D403/10 , C07D403/12 , C07D405/04 , C07D405/14 , C07D409/04 , C07D413/14 , C07D417/12 , C07D417/14
摘要： Compounds represented by formula (1) shown below, pharmaceutically acceptable salts thereof, and pharmaceutical compositions comprising such compounds are provided.
摘要翻译：提供了由下式（1）表示的化合物及其药学上可接受的盐，以及包含这些化合物的药物组合物。

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