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31. 发明授权

US07601954B2 Method and apparatus for reviewing defects 有权
标题翻译：检查缺陷的方法和装置
公开(公告)号：US07601954B2
公开(公告)日：2009-10-13
申请号：US11668510
申请日：2007-01-30
申请人： Hidetoshi Nishiyama , Toshifumi Honda , Sachio Uto
发明人： Hidetoshi Nishiyama , Toshifumi Honda , Sachio Uto
IPC分类号： G01N23/00
CPC分类号： G01N23/225 , G02B15/14 , G02B21/0016 , H01J37/226 , H01J37/28 , H01J2237/216 , H01J2237/2482 , H01J2237/2817 , H01K3/02
摘要： A method and an apparatus for reviewing defects detected by an optical particle inspection system or an optical profile inspection system in detail by an electron microscope are provided. In order to putting defects to be reviewed in the viewing field of the electron microscope and reducing the size of the apparatus, the electron microscope reviews defects detected by an optical defect inspection system. In the electron microscope, an optical microscope for reviewing detects is arranged, and when focusing of this optical microscope is carried out, the illumination position and the detection position of the optical microscope are not changed to the sample.
摘要翻译：提供了一种用于通过电子显微镜详细检查由光学粒子检查系统或光学轮廓检查系统检测到的缺陷的方法和装置。为了在电子显微镜的观察区域中提供缺陷以及减小设备的尺寸，电子显微镜检查由光学缺陷检查系统检测到的缺陷。在电子显微镜中，设置检查用光学显微镜，当进行该光学显微镜的聚焦时，光学显微镜的照明位置和检测位置不变为样品。

32. 发明授权

US07432503B2 Scanning electron microscope and method for detecting an image using the same 有权
标题翻译：扫描电子显微镜及使用其的图像检测方法
公开(公告)号：US07432503B2
公开(公告)日：2008-10-07
申请号：US11319721
申请日：2005-12-29
申请人： Toshifumi Honda , Hiroshi Makino
发明人： Toshifumi Honda , Hiroshi Makino
IPC分类号： G01N23/00
CPC分类号： G01N23/2251 , H01J37/1471 , H01J37/153 , H01J37/21 , H01J37/243 , H01J37/265 , H01J37/28 , H01J2237/1501 , H01J2237/1532 , H01J2237/216 , H01J2237/2487 , H01J2237/2817 , H01J2237/2826
摘要： In the present invention, in order to realize both a reduction of an image detecting time and high quality image detection in a scanning electron microscope for measurement, inspection, defect review, or the like of semiconductor wafers, a low-magnification image is taken by using a large beam current; a high-magnification image is taken by using a small beam current; control amounts for correcting a change in luminance, a focus deviation, misalignment, and visual field misalignment of taken images, which are generated due to a variation of a beam current are saved in advance in a memory of an overall control system; and these amounts are corrected every time the beam current is switched, thereby making it possible to take the images without any adjustment operation after switching the currents.
摘要翻译：在本发明中，为了实现半导体晶片的测量，检查，缺陷检查等的扫描型电子显微镜中的图像检测时间的缩短和高质量图像检测，低倍率图像被采用使用大束电流; 通过使用小束电流拍摄高倍率图像; 在整个控制系统的存储器中预先保存用于校正由于波束电流的变化而产生的拍摄图像的亮度变化，聚焦偏移，未对准和视场未对准的控制量; 并且每当切换电流时校正这些量，从而可以在切换电流之后进行没有任何调整操作的图像。

33. 发明授权

US07361896B2 Scanning electron microscope and a method for adjusting a focal point of an electron beam of said scanning electron microscope 有权
标题翻译：扫描电子显微镜和用于调整所述扫描电子显微镜的电子束焦点的方法
公开(公告)号：US07361896B2
公开(公告)日：2008-04-22
申请号：US11130121
申请日：2005-05-17
申请人： Toshifumi Honda , Munenori Fukunishi , Kenji Obara
发明人： Toshifumi Honda , Munenori Fukunishi , Kenji Obara
IPC分类号： G01N23/00
CPC分类号： H01J37/21 , H01J2237/216
摘要： In a scanning electron microscope, scanning region is set to be narrow, upon which focused electron beam is scanned, so that the focused electron beam can be irradiated at the almost same position by plural numbers of times, irrespective of movement of the stage or of moving of the stage during braking thereof, and upon that region to be scanned is irradiated the focused electron beam, by plural numbers of times, while changing the focal position, thereby forming an image thereof. From the image formed is calculated out a section, from which a focus-in position can be calculated out, and then the focus-in position is calculated out from that calculated section.
摘要翻译：在扫描电子显微镜中，扫描区域被设置为窄，扫描聚焦电子束，使得聚焦电子束可以几乎相同的位置被照射多次，而不管平台的移动或者是在改变焦点位置的同时，在聚焦电子束多次照射被扫描的区域的同时，在其制动期间移动舞台，从而形成其图像。从形成的图像中计算出可从其计算聚焦位置的部分，然后从该计算部分计算聚焦位置。

34. 发明申请

US20060215901A1 Method and apparatus for reviewing defects 有权
标题翻译：检查缺陷的方法和装置
公开(公告)号：US20060215901A1
公开(公告)日：2006-09-28
申请号：US11311254
申请日：2005-12-20
申请人： Ryo Nakagaki , Toshifumi Honda
发明人： Ryo Nakagaki , Toshifumi Honda
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30148
摘要： An apparatus for reviewing defects including an image processing section (defect classification device section) with a function of estimating a non-defective state (reference image) of a portion in which the defect exists by use of a defect image, and a function of judging criticality or non-flat state of the defect by use of the estimation result. It becomes possible to establish both of a high-throughput image collecting sequence in which any reference image is not acquired and high-precision defect classification, and then to realize both of a high performance classifying function and a high-throughput image collecting function in a defect reviewing apparatus which automatically collects and classifies images of defects existing on a sample of a semiconductor wafer or the like.
摘要翻译：一种用于检查缺陷的装置，包括具有通过使用缺陷图像来估计存在缺陷的部分的非缺陷状态（参考图像）的功能的图像处理部分（缺陷分类装置部分），以及判断通过使用估计结果，缺陷的关键性或非平坦状态。可以建立不获取任何参考图像的高通量图像采集序列和高精度缺陷分类，然后实现高性能分类功能和高吞吐量图像采集功能缺陷检查装置，其自动地收集和分类存在于半导体晶片等的样本上的缺陷的图像。

35. 发明授权

US07105815B2 Method and apparatus for collecting defect images 有权
标题翻译：用于收集缺陷图像的方法和装置
公开(公告)号：US07105815B2
公开(公告)日：2006-09-12
申请号：US11020255
申请日：2004-12-27
申请人： Kenji Obara , Toshifumi Honda , Toshiro Kubo
发明人： Kenji Obara , Toshifumi Honda , Toshiro Kubo
IPC分类号： G01N23/00 , G21K7/00
CPC分类号： H01J37/28 , H01J37/241 , H01J37/263 , H01J37/265 , H01J2237/2809 , H01J2237/2817
摘要： To acquire defect images even when a defect exists below an optically transparent film, an electron optical system of an electron microscope is set to a first imaging condition. A defect position of a specimen is set so as to fall within the visual field of the electron microscope, using position data of a defect of the specimen. The position of the defect is imaged by the electron microscope set to the first imaging condition to obtain a first image corresponding to the defect position. The first image is processed to determine whether a defect exists. The electron optical system is then set to a second imaging condition on the basis of the result of determination. A point imaged under the first imaging condition is imaged by the electron microscope set to the second imaging condition to acquire a second image corresponding to a defect position.
摘要翻译：为了获得缺陷图像，即使当缺陷存在于光学透明膜下方时，将电子显微镜的电子光学系统设置为第一成像条件。使用试样的缺陷的位置数据，将试样的缺陷位置设定为落入电子显微镜的视野内。通过设置为第一成像条件的电子显微镜对缺陷的位置成像，以获得对应于缺陷位置的第一图像。处理第一个图像以确定是否存在缺陷。然后基于确定的结果将电子光学系统设置为第二成像条件。在第一成像条件下成像的点通过设置为第二成像条件的电子显微镜成像，以获得对应于缺陷位置的第二图像。

36. 发明申请

US20060151700A1 Scanning electron microscope and method for detecting an image using the same 有权
标题翻译：扫描电子显微镜及使用其的图像检测方法
公开(公告)号：US20060151700A1
公开(公告)日：2006-07-13
申请号：US11319721
申请日：2005-12-29
申请人： Toshifumi Honda , Hiroshi Makino
发明人： Toshifumi Honda , Hiroshi Makino
IPC分类号： G21K7/00
CPC分类号： G01N23/2251 , H01J37/1471 , H01J37/153 , H01J37/21 , H01J37/243 , H01J37/265 , H01J37/28 , H01J2237/1501 , H01J2237/1532 , H01J2237/216 , H01J2237/2487 , H01J2237/2817 , H01J2237/2826
摘要： In the present invention, in order to realize both a reduction of an image detecting time and high quality image detection in a scanning electron microscope for measurement, inspection, defect review, or the like of semiconductor wafers, a low-magnification image is taken by using a large beam current; a high-magnification image is taken by using a small beam current; control amounts for correcting a change in luminance, a focus deviation, misalignment, and visual field misalignment of taken images, which are generated due to a variation of a beam current are saved in advance in a memory of an overall control system; and these amounts are corrected every time the beam current is switched, thereby making it possible to take the images without any adjustment operation after switching the currents.
摘要翻译：在本发明中，为了实现半导体晶片的测量，检查，缺陷检查等的扫描型电子显微镜中的图像检测时间的缩短和高质量图像检测，低倍率图像被采取使用大束电流; 通过使用小束电流拍摄高倍率图像; 在整个控制系统的存储器中预先保存用于校正由于波束电流的变化而产生的拍摄图像的亮度变化，聚焦偏移，未对准和视场未对准的控制量; 并且每当切换电流时校正这些量，从而可以在切换电流之后进行没有任何调整操作的图像。

37. 发明申请

US20050258366A1 Scanning electron microscope and a method for adjusting a focal point of an electron beam of said scanning electron microscope 有权
标题翻译：扫描电子显微镜和用于调整所述扫描电子显微镜的电子束焦点的方法
公开(公告)号：US20050258366A1
公开(公告)日：2005-11-24
申请号：US11130121
申请日：2005-05-17
申请人： Toshifumi Honda , Munenori Fukunishi , Kenji Obara
发明人： Toshifumi Honda , Munenori Fukunishi , Kenji Obara
IPC分类号： H01J37/20 , G21K7/00 , H01J37/21
CPC分类号： H01J37/21 , H01J2237/216
摘要： In a scanning electron microscope, scanning region is set to be narrow, upon which focused electron beam is scanned, so that the focused electron beam can be irradiated at the almost same position by plural numbers of times, irrespective of movement of the stage or of moving of the stage during braking thereof, and upon that region to be scanned is irradiated the focused electron beam, by plural numbers of times, while changing the focal position, thereby forming an image thereof. From the image formed is calculated out a section, from which a focus-in position can be calculated out, and then the focus-in position is calculated out from that calculated section.
摘要翻译：在扫描电子显微镜中，扫描区域被设置为窄，扫描聚焦电子束，使得聚焦电子束可以几乎相同的位置被照射多次，而不管平台的移动或者是在改变焦点位置的同时，在聚焦电子束多次照射被扫描的区域的同时，在其制动期间移动舞台，从而形成其图像。从形成的图像中计算出可从其计算聚焦位置的部分，然后从该计算部分计算聚焦位置。

38. 发明授权

US06249598B1 Solder testing apparatus 失效
标题翻译：焊接试验装置
公开(公告)号：US06249598B1
公开(公告)日：2001-06-19
申请号：US08968125
申请日：1997-11-12
申请人： Toshifumi Honda , Yukio Matsuyama , Guenter Doemens , Peter Mengel , Ludwig Listl
发明人： Toshifumi Honda , Yukio Matsuyama , Guenter Doemens , Peter Mengel , Ludwig Listl
IPC分类号： G06K900
CPC分类号： G01R31/048 , G01R31/309
摘要： A solder testing apparatus comprising image processing means for performing image processing on an image of an appearance of a soldered portion to identify shape characterizing amounts for the soldered portion; and defect determining means for performing good/bad determination on the soldered portion from data derived by the image processing means and data from test parameter storing means for storing shape characterizing amounts at design time, wherein tested-object standard shape estimating means is included for extracting shape characterizing amounts of a non-defective soldered portion by statistically processing shape characterizing amounts for soldered portions identified by the image processing means, and defect determining parameters stored in the test parameter storing means are updated based on standard shape values from the tested-object standard shape estimating means, so that a highly reliable test is realized by setting defect determining parameters based on actual shapes and dimensions of leads and pads of electronic components on a printed circuit board.
摘要翻译：一种焊料测试装置，包括图像处理装置，用于对焊接部分的外观的图像进行图像处理，以识别焊接部分的形状特征量; 以及缺陷确定装置，用于根据由图像处理装置导出的数据对焊接部分进行良好/不良确定，以及用于在设计时存储形状特征量的测试参数存储装置的数据，其中包括用于提取的测试对象标准形状估计装置通过统计处理由图像处理装置识别的焊接部分的形状特征量的无缺陷焊接部分的形状特征量，以及存储在测试参数存储装置中的缺陷确定参数基于来自测试对象标准的标准形状值而被更新形状估计装置，使得通过基于印刷电路板上的电子部件的引线和焊盘的实际形状和尺寸设置缺陷确定参数来实现高度可靠的测试。

39. 发明授权

US09239283B2 Defect inspection method and device therefor 有权
标题翻译：缺陷检查方法及其设备
公开(公告)号：US09239283B2
公开(公告)日：2016-01-19
申请号：US13993888
申请日：2011-11-08
申请人： Toshifumi Honda , Yukihiro Shibata , Atsushi Taniguchi
发明人： Toshifumi Honda , Yukihiro Shibata , Atsushi Taniguchi
IPC分类号： G01N21/00 , G01N21/956 , G01N21/95 , G01N21/88
CPC分类号： G01N21/00 , G01N21/8851 , G01N21/9501 , G01N21/956 , G01N2021/8896
摘要： To process a signal from a plurality of detectors without being affected by a variation in the height of a substrate, and to detect more minute defects on the substrate, a defect inspection device is provided with a photoelectric converter having a plurality of rows of optical sensor arrays in each of first and second light-collecting/detecting unit and a processing unit for processing a detection signal from the first and the second light-collecting/detecting unit to determine the extent to which the positions of the focal points of the first and the second light-collecting/detecting unit are misaligned with respect to the surface of a test specimen, and processing the detection signal to correct a misalignment between the first and the second light-collecting/detecting unit, and the corrected detection signal outputted from the first and the second light-collecting/detecting unit are combined together to detect the defects on the test specimen.
摘要翻译：为了处理来自多个检测器的信号而不受基板高度的变化的影响，并且在基板上检测更多的微小缺陷，缺陷检查装置设置有具有多行光学传感器的光电转换器在第一和第二集光/检测单元中的每一个中的阵列，以及处理单元，用于处理来自第一和第二聚光/检测单元的检测信号，以确定第一和第二聚光/ 第二聚光/检测单元相对于试样的表面不对准，并且处理检测信号以校正第一和第二聚光/检测单元之间的未对准，并且校正的检测信号从第一和第二聚光/检测单元组合在一起以检测试样上的缺陷。

40. 发明授权

US08975582B2 Method and apparatus for reviewing defects 有权
标题翻译：检查缺陷的方法和装置
公开(公告)号：US08975582B2
公开(公告)日：2015-03-10
申请号：US13311734
申请日：2011-12-06
申请人： Hidetoshi Nishiyama , Toshifumi Honda , Sachio Uto
发明人： Hidetoshi Nishiyama , Toshifumi Honda , Sachio Uto
IPC分类号： G01N23/225 , G02B15/14 , G02B21/00 , H01J37/22 , H01J37/28 , H01K3/02
CPC分类号： G01N23/225 , G02B15/14 , G02B21/0016 , H01J37/226 , H01J37/28 , H01J2237/216 , H01J2237/2482 , H01J2237/2817 , H01K3/02
摘要： A method of inspecting defects of a sample on a movable table includes a first step for, on a basis of position information of the defects which is previously detected by an other inspection system, driving the table so that the defects come into a viewing field of an optical microscope having a focus which is adjusted, a second step for re-detecting the defects to obtain a first detection result, a third step for correcting the position information of defects on a basis of position information of the re-detected defects, and a fourth step for reviewing the defects whose position information is corrected to obtain a second detection result. At the second step, re-detecting is performed using reflection light or scattered light from the sample which passes an optical filter which includes a light shielding portion and a light transmitting portion.
摘要翻译：一种在可移动台上检查样本的缺陷的方法包括：第一步骤，用于基于先前由另一检查系统检测到的缺陷的位置信息来驱动该表，使得缺陷进入到具有调整焦点的光学显微镜，用于重新检测缺陷以获得第一检测结果的第二步骤，基于重新检测到的缺陷的位置信息来校正缺陷的位置信息的第三步骤，以及检查位置信息被校正以获得第二检测结果的缺陷的第四步骤。在第二步骤中，使用来自通过包括遮光部分和透光部分的滤光器的样品的反射光或散射光进行再检测。

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