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31. 外观设计

USD960053S1 Electric bicycle 有权
公开(公告)号：USD960053S1
公开(公告)日：2022-08-09
申请号：US29721575
申请日：2020-01-22
申请人： Qiang Chen
设计人： Qiang Chen

32. 外观设计

USD960052S1 Electric bicycle 有权
公开(公告)号：USD960052S1
公开(公告)日：2022-08-09
申请号：US29721574
申请日：2020-01-22
申请人： Qiang Chen
设计人： Qiang Chen

33. 外观设计

USD904501S1 Glasses 有权
公开(公告)号：USD904501S1
公开(公告)日：2020-12-08
申请号：US29691404
申请日：2019-05-16
申请人： Qiang Chen
设计人： Qiang Chen
摘要： FIG. 1 is an exploded perspective view of glasses showing my new design;
FIG. 2 is a perspective view of the glasses;
FIG. 3 is an exploded top plan view thereof;
FIG. 4 is an exploded rear elevation view thereof;
FIG. 5 is an exploded bottom plan view thereof;
FIG. 6 is an exploded right side view thereof;
FIG. 7 is an exploded front elevation view thereof; and,
FIG. 8 is an exploded left side view thereof.

34. 发明申请

US20180144997A1 SAMPLE WITH IMPROVED EFFECT OF BACKSIDE POSITIONING, FABRICATION METHOD AND ANALYSIS METHOD THEREOF 审中-公开
公开(公告)号：US20180144997A1
公开(公告)日：2018-05-24
申请号：US15390521
申请日：2016-12-25
申请人： Qiang Chen , Chinte Kuo
发明人： Qiang Chen , Chinte Kuo
IPC分类号： H01L21/66 , H01L21/304 , G01B11/14 , G01R31/28
CPC分类号： G01R31/2851 , G01R31/311 , H01L22/12
摘要： A sample with improved effect of backside positioning, fabrication method and analysis method thereof are disclosed in the present invention. The present invention has formed the arc-shaped convex structure with a certain arc at the back surface of the substrate, so that the value of the numerical aperture of the conventional lens in the positioning analysis is increased. That is that using a conventional lens of the EMMI may also obtain a better positioning analysis result of the back side of the chip. In addition, depending on the different thicknesses of the substrate, convex structures with different arcs are formed. Therefore, only one lens is used to perform a positioning analysis for different samples, so as to greatly reduce the cost of analysis.

35. 发明申请

US20170053778A1 METHOD OF PREPARING A PLAN-VIEW TRANSMISSION ELECTRON MICROSCOPE SAMPLE USED IN AN INTEGRATED CIRCUIT ANALYSIS 审中-公开
标题翻译：制备在一体化电路分析中使用的平面传输电子显微镜样品的方法
公开(公告)号：US20170053778A1
公开(公告)日：2017-02-23
申请号：US15241284
申请日：2016-08-19
申请人： Qiang Chen , Yanping Shi
发明人： Qiang Chen , Yanping Shi
IPC分类号： H01J37/302 , H01J37/285 , H01J37/305
CPC分类号： G01N1/286 , G01N1/28 , H01J37/26 , H01J2237/31745
摘要： The present invention discloses a preparation method of plan-view TEM sample used in an integrated circuit analysis. The method comprises the steps of: providing a carrying slice, and fixing a chip containing a targeted structure sample and the carrying slice on a sample holder in a horizontal direction, and putting them in a process chamber of a FIB apparatus; cutting off a piece of chip structure containing a target structure sample by adopting a FIB; and welding the piece of chip structure on the flat and clean side of the carrying slice by using a nano-manipulator; after being taken out from the process chamber of the FIB apparatus, the carrying slice welded with the chip structure is adjusted to vertical direction, and is put in the process chamber of the FIB apparatus again; transferring and welding the chip structure on the TEM copper grid by using the nano-manipulator; and removing one layer or multiple layers above the preset target layer from the surface layer of the chip by using the FIB to obtain the desired plan-view TEM sample.
摘要翻译：本发明公开了在集成电路分析中使用的平面图TEM样品的制备方法。该方法包括以下步骤：提供携带片，并将含有目标结构样品的芯片和携带片在水平方向上固定在样品架上，并将其放入FIB装置的处理室中; 通过FIB切断含有目标结构样品的芯片结构; 并通过使用纳米机械手将芯片结构焊接在承载片的平坦且干净的一侧; 在从FIB装置的处理室中取出之后，将与芯片结构焊接的承载片调整到垂直方向，并再次放入FIB装置的处理室中; 通过使用纳米操纵器将TEM芯片上的芯片结构转移和焊接; 并且通过使用FIB从芯片的表面层去除预设目标层上方的一层或多层以获得所需的平面图TEM样品。

36. 发明授权

US08897578B2 Image recognition device, image recognition method, and integrated circuit 有权
标题翻译：图像识别装置，图像识别方法和集成电路
公开(公告)号：US08897578B2
公开(公告)日：2014-11-25
申请号：US13817631
申请日：2012-08-29
申请人： Zhongyang Huang , Yang Hua , Shuicheng Yan , Qiang Chen , Ryouichi Kawanishi
发明人： Zhongyang Huang , Yang Hua , Shuicheng Yan , Qiang Chen , Ryouichi Kawanishi
IPC分类号： G06K9/62 , G06K9/34 , G06K9/74 , G06T7/00 , G06K9/46
CPC分类号： G06T7/0081 , G06K9/4642 , G06K9/4676
摘要： An image recognition device that improves the accuracy of generic object recognition compared with conventional technologies by reducing the influence of the position, size, background clutter and the like of an object that is targeted to be recognized in the input image by the generic object recognition. The image recognition device performs a generic object recognition and includes: a segmenting unit configured to segment an input image into a plurality of regions in accordance with meanings extracted from content of the input image; a generating unit configured to compute feature data for each of the plurality of regions and generate feature data of the input image reflecting the computed feature data; and a checking unit configured to check whether or not a recognition-target object is present in the input image in accordance with the feature data of the input image.
摘要翻译：一种图像识别装置，通过减少通过通用对象识别在目标被识别的对象的位置，大小，背景杂波等的影响，与传统技术相比，提高了通用对象识别的准确性。图像识别装置执行通用对象识别，包括：分割单元，被配置为根据从输入图像的内容中提取的含义将输入图像分割成多个区域; 生成单元，被配置为计算所述多个区域中的每一个的特征数据，并且生成反映所计算的特征数据的所述输入图像的特征数据; 以及检查单元，被配置为根据输入图像的特征数据来检查输入图像中是否存在识别对象物体。

37. 发明授权

US08644019B2 Electronic device with cooling module 失效
标题翻译：带冷却模块的电子设备
公开(公告)号：US08644019B2
公开(公告)日：2014-02-04
申请号：US13337256
申请日：2011-12-26
申请人： Qiang Chen
发明人： Qiang Chen
IPC分类号： H05K7/20
CPC分类号： G06F1/181 , G06F1/20
摘要： An electronic device includes a housing. A motherboard is arranged in a first end of the housing. A hard disk drive area is arranged at a second end of the housing. A cooling module is arranged at the housing between the motherboard and the hard disk drive area. The cooling module includes a chassis and a semiconductor chilling plate received in the chassis. An outside airflow flows through the hard disk drive area, and then flows through the semiconductor chilling plate to be cooled. The cooled airflow is driven to flow through the motherboard.
摘要翻译：电子设备包括壳体。主板布置在壳体的第一端。硬盘驱动器区域布置在壳体的第二端。在主板和硬盘驱动器区域之间的壳体处布置有冷却模块。冷却模块包括容纳在底盘中的底架和半导体冷却板。外部空气流过硬盘驱动区域，然后流过要冷却的半导体冷却板。冷却的气流被驱动流过主板。

38. 发明授权

US08513397B2 DNA replicon system for high-level rapid production of vaccines and monoclonal antibody therapeutics in plants 有权
标题翻译：用于在植物中高水平快速生产疫苗和单克隆抗体治疗剂的DNA复制子系统
公开(公告)号：US08513397B2
公开(公告)日：2013-08-20
申请号：US13060414
申请日：2009-08-27
申请人： Hugh S. Mason , Zhong Huang , Qiang Chen , Charles J. Arntzen , Shuo Yuan , Brooke Hjelm
发明人： Hugh S. Mason , Zhong Huang , Qiang Chen , Charles J. Arntzen , Shuo Yuan , Brooke Hjelm
IPC分类号： C12N15/34 , C12N15/117 , C12N15/13 , C12N15/36 , C12N15/82 , C12N5/10
CPC分类号： C12N15/8257 , C12N15/8203 , C12N15/8258
摘要： Plant viral vectors have great potential in rapid production of proteins, but no simple. Here a geminivirus-based system for high-yield and rapid production of oligomeric protein complexes, including virus-like particle (VLP) vaccines and monoclonal antibodies (mAbs) is described. In particular, a single vector that contains two non-competing replicons for transient expression in Nicotiana benthamiana leaves is described. The correct assembly of these subunit proteins into functional oligomeric structures (VLPs or full-size mAb) is also described. This system advances plant transient expression technology by eliminating the need for non-competing viruses, and thus, enhances the realistic commercial application of this technology for producing multiple-subunit protein complexes.
摘要翻译：植物病毒载体在快速生产蛋白质方面具有很大的潜力，但并不简单。这里描述了用于高产率和快速生产低聚蛋白复合物的双基因病毒的系统，包括病毒样颗粒（VLP）疫苗和单克隆抗体（mAb）。特别地，描述了在烟草属烟草叶中含有两个用于瞬时表达的非竞争性复制子的单一载体。还描述了将这些亚基蛋白正确组装到功能性寡聚结构（VLP或全尺寸mAb）中。该系统通过消除对非竞争病毒的需求，推进植物瞬时表达技术，从而增强了该技术生产多亚基蛋白复合物的实际商业应用。

39. 发明申请

US20130202103A1 DIRECT CURRENT/DIRECT CURRENT CONVERTER FOR ACQUIRING STABILIZED LOW VOLTAGE AND TELEPHONE POWER SUPPLY CIRCUIT 审中-公开
标题翻译：用于获取稳定的低电压和电话电源电路的直流/直流电流转换器
公开(公告)号：US20130202103A1
公开(公告)日：2013-08-08
申请号：US13641968
申请日：2011-01-05
申请人： Qiang Chen , Hao Chen , Huijian Si , Gangjian Ying
发明人： Qiang Chen , Hao Chen , Huijian Si , Gangjian Ying
IPC分类号： G05F1/46
CPC分类号： G05F1/46 , H02M3/156
摘要： A Direct Current/Direct Current (DC/DC) converter for acquiring stabilized low voltage and a telephone power supply circuit based on the DC/DC converter are provided by the present invention. The DC/DC converter includes a power level circuit (1), which receives a dynamic voltage input from an outside circuit; a tank circuit (2), which uses energy-storage elements to store the electric energy outputted from the power level circuit and outputs the electric energy to a load; and a feedback control circuit (3), which receives the voltage from the output and feeds it back to the input of the tank circuit so as to control the connection and disconnection of the input of the tank circuit and further to control output voltage of the tank circuit. By the technical solution of the present invention, which uses the energy-storage inductance to store energy, limits the output, and acquires a stabilized low voltage from a wider range output voltage by using a feedback circuit, the power consumption is reduced, and the impact on the telephone is reduced at the time of picking up and/or hanging up the telephone.
摘要翻译：本发明提供一种直流/直流（DC / DC）转换器，用于获取稳定的低电压和基于DC / DC转换器的电话电源电路。 DC / DC转换器包括功率电平电路（1），其接收从外部电路输入的动态电压; 储罐电路（2），其使用能量存储元件来存储从功率电平电路输出的电能并将电能输出到负载; 以及反馈控制电路（3），其从输出端接收电压并将其馈送回到储能电路的输入端，以便控制储能电路的输入的连接和断开，并进一步控制输出电压坦克回路。通过使用储能电感来存储能量的本发明的技术方案，通过使用反馈电路限制输出并从较宽范围的输出电压获取稳定的低电压，降低了功耗，在拿起和/或挂断电话时，对电话的影响减小了。

40. 发明授权

US08492229B2 Method and layout of semiconductor device with reduced parasitics 有权
标题翻译：减少寄生效应的半导体器件的方法和布局
公开(公告)号：US08492229B2
公开(公告)日：2013-07-23
申请号：US13087102
申请日：2011-04-14
申请人： Albert Birner , Qiang Chen
发明人： Albert Birner , Qiang Chen
IPC分类号： H01L21/336
CPC分类号： H01L29/7835 , H01L29/0653 , H01L29/0661 , H01L29/402 , H01L29/4175 , H01L29/4238 , H01L29/456 , H01L29/4933 , H01L29/4941 , H01L29/7823
摘要： An semiconductor device is disclosed. The device includes a semiconductor body, a layer of insulating material disposed over the semiconductor body, and a region of gate electrode material disposed over the layer of insulating material. Also included are a source region adjacent to gate region and a drain region adjacent to the gate region. A gate connection is disposed over the semiconductor body, wherein the gate connection includes a region of gate electrode material electrically coupling a contact region to the gate electrode. An insulating region is disposed on the semiconductor body beneath the gate connection.
摘要翻译：公开了一种半导体器件。该器件包括半导体本体，设置在半导体本体上的绝缘材料层以及设置在绝缘材料层上的栅电极材料区域。还包括与栅极区域相邻的源极区域和与栅极区域相邻的漏极区域。栅极连接设置在半导体本体上，其中栅极连接包括将接触区域电耦合到栅电极的栅电极材料区域。绝缘区域设置在栅极连接下方的半导体本体上。

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