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31. 发明授权

US06988942B2 Conductive polishing article for electrochemical mechanical polishing 失效
公开(公告)号：US06988942B2
公开(公告)日：2006-01-24
申请号：US10894756
申请日：2004-07-20
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
IPC分类号： B24D11/00
CPC分类号： H01L21/32125 , B23H5/08 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , B24B57/02 , B82Y30/00 , Y10T428/24273 , Y10T428/24355 , Y10T428/24628 , Y10T428/24917
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

32. 发明授权

US06977036B2 Method and apparatus for substrate polishing 失效
公开(公告)号：US06977036B2
公开(公告)日：2005-12-20
申请号：US10837955
申请日：2004-05-03
申请人： Ralph Wadensweiler , Alain Duboust , Liang-Yuh Chen , Manoocher Birang , Ratson Morad , Paul D. Butterfield
发明人： Ralph Wadensweiler , Alain Duboust , Liang-Yuh Chen , Manoocher Birang , Ratson Morad , Paul D. Butterfield
IPC分类号： B23H5/08 , C25F7/00 , C25F3/00 , C25C7/04 , C25D17/00
CPC分类号： B23H5/08 , C25F7/00
摘要： A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.

33. 发明申请

US20090036037A1 APPARATUS FOR CONDITIONING PROCESSING PADS 有权
标题翻译：调节加工垫的设备
公开(公告)号：US20090036037A1
公开(公告)日：2009-02-05
申请号：US12248302
申请日：2008-10-09
申请人： Paul D. Butterfield , Sen-Hou Ko
发明人： Paul D. Butterfield , Sen-Hou Ko
IPC分类号： B24B1/00
CPC分类号： B24B53/017 , B24B53/12
摘要： Embodiments of an apparatus for conditioning a processing pad are provided. In one embodiment, an apparatus for conditioning a processing pad includes a member having a bottom surface selectively maintained in a non-planar orientation and an abrasive disposed on the bottom surface of the member. The abrasive is configured for conditioning a processing pad. The member and abrasive have a profile that produces a non-planar processing pad surface.
摘要翻译：提供了一种用于调理处理垫的装置的实施例。在一个实施例中，用于调理处理垫的装置包括具有选择性地保持在非平面取向的底表面和设置在构件的底表面上的研磨件的构件。研磨剂配置用于调理加工垫。构件和磨料具有产生非平面加工垫表面的轮廓。

34. 发明授权

US07040964B2 Polishing media stabilizer 有权
公开(公告)号：US07040964B2
公开(公告)日：2006-05-09
申请号：US10262164
申请日：2002-10-01
申请人： Phillip R. Sommer , Paul D. Butterfield
发明人： Phillip R. Sommer , Paul D. Butterfield
IPC分类号： B24B1/00
CPC分类号： B24B37/26 , B24B37/20 , H01L21/30625 , Y10S451/921
摘要： A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support surface. Also, a porous layer may be placed between the polishing media and the support surface to form dimples in the polishing media upon the application of vacuum. An alternative arrangement draws the polishing media against a carrier and the substrate to be polished.

35. 发明授权

US06645050B1 Multimode substrate carrier 失效
标题翻译：多模基板载体
公开(公告)号：US06645050B1
公开(公告)日：2003-11-11
申请号：US09718050
申请日：2000-11-20
申请人： Paul D. Butterfield , Phillip R. Sommer
发明人： Paul D. Butterfield , Phillip R. Sommer
IPC分类号： B24B100
CPC分类号： B24B37/32 , B24B41/04 , H01L21/30625
摘要： Generally, a method and apparatus for retaining a substrate is provided. In one embodiment, a carrier for retaining a substrate comprises a carrier plate having a lower surface, at least one first fluid outlet and a second fluid outlet. The first fluid outlet is fluidly coupled to the lower surface of the carrier plate. The second fluid outlet is fluidly coupled to the lower surface of the carrier plate. A first fluid circuit is coupled to the first fluid outlet and is adapted to flow a fluid forms a fluidic layer between the carrier plate and the substrate. A second fluid circuit is coupled to the second fluid outlet and is separate from the first fluid circuit.
摘要翻译：通常，提供了用于保持基板的方法和装置。在一个实施例中，用于保持衬底的载体包括具有下表面的载体板，至少一个第一流体出口和第二流体出口。第一流体出口流体地联接到承载板的下表面。第二流体出口流体地联接到承载板的下表面。第一流体回路耦合到第一流体出口并且适于使流体流动在载体板和基底之间形成流体层。第二流体回路耦合到第二流体出口并且与第一流体回路分离。

36. 发明申请

US20090036032A1 TEMPERATURE CONTROL FOR ECMP PROCESS 审中-公开
标题翻译： ECMP过程温度控制
公开(公告)号：US20090036032A1
公开(公告)日：2009-02-05
申请号：US12248414
申请日：2008-10-09
申请人： Yongqi Hu , Paul D. Butterfield , Junzi Zhao , Stan D. Tsai , Feng Q. Liu
发明人： Yongqi Hu , Paul D. Butterfield , Junzi Zhao , Stan D. Tsai , Feng Q. Liu
IPC分类号： B24B1/00
CPC分类号： B23H5/08 , B24B37/015 , B24B37/046 , B24B37/12 , B24B49/14 , C25D7/00
摘要： Methods for polishing a substrate are provided. In one embodiment, the method includes pressing a substrate against a pad assembly disposed on rotating platen assembly, the pad assembly comprising an electrode coupled to a power source, flowing an electrolyte fluid onto the pad assembly, wherein the electrolyte fluid is in contact with the substrate and the electrode, creating an electrical bias between the electrode and the substrate, and heating the electrolyte fluid with an infrared lamp to a temperature of at least 10 degrees Celsius above room temperature.
摘要翻译：提供了抛光基板的方法。在一个实施例中，该方法包括将基板压靠在设置在旋转台板组件上的焊盘组件上，该焊盘组件包括耦合到电源的电极，将电解液流动到焊盘组件上，其中电解质流体与衬底和电极，在电极和衬底之间产生电偏压，并用红外灯将电解质液体加热到高于室温的至少10摄氏度的温度。

37. 发明授权

US07375449B2 Optimized modular electrical machine using permanent magnets 有权
标题翻译：使用永磁体优化模块化电机
公开(公告)号：US07375449B2
公开(公告)日：2008-05-20
申请号：US11506636
申请日：2006-08-17
申请人： Paul D. Butterfield
发明人： Paul D. Butterfield
IPC分类号： H02K3/04
CPC分类号： H02K3/26 , H02K1/2793 , H02K3/28 , H02K3/47 , H02K5/20 , H02K5/225 , H02K11/048 , H02K11/33 , H02K13/08 , H02K21/24
摘要： An electrical machine having a magnet assembly with a magnet carrier ring with an even number of permanent magnets mounted in the carrier ring around a circular locus, and a conductor assembly with one or more conductor circuits wound in a double helix wave winding around a flat conductor support ring with the conductor circuits having uniformly curved conductor segments of involute or arcuate configuration wherein the magnet assembly and conductor assembly are contained in a housing with the magnet assembly rotating relative to the conductor assembly.
摘要翻译：一种具有磁体组件的电机，具有安装在环形轨迹周围的承载环中的偶数个永磁体的磁体载体环，以及具有一个或多个导体电路的导体组件，所述导体组件缠绕在围绕扁平导体的双螺旋波绕组中支撑环具有导体电路，其具有渐开线或弓形构造的均匀弯曲的导体段，其中磁体组件和导体组件容纳在壳体中，磁体组件相对于导体组件旋转。

38. 发明授权

US07137879B2 Conductive polishing article for electrochemical mechanical polishing 有权
公开(公告)号：US07137879B2
公开(公告)日：2006-11-21
申请号：US11393220
申请日：2006-03-30
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
IPC分类号： B24D3/34 , B24D11/00 , B24D17/00
CPC分类号： B82Y30/00 , B24B37/046 , B24B37/24 , B24B37/26 , B24D3/34
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

39. 发明授权

US07666061B2 Method for conditioning processing pads 失效
标题翻译：调理加工垫的方法
公开(公告)号：US07666061B2
公开(公告)日：2010-02-23
申请号：US11671818
申请日：2007-02-06
申请人： Paul D. Butterfield , Sen-Hou Ko
发明人： Paul D. Butterfield , Sen-Hou Ko
IPC分类号： B24B53/00
CPC分类号： B24B53/017 , B24B53/12
摘要： Embodiments of a flexible pad conditioner for conditioning a processing pad are provided. The pad conditioner includes an arc-shaped member having an abrasive bottom surface configured for conditioning the processing pad. Means are provided to apply a downward force as well as to oscillate the pad conditioner. Further means may be provided to vary the downward force along the length of the pad conditioner. In one embodiment, a plurality of actuators may be coupled to a top surface of the member and adapted to selectively provide an independently controllable force against the member to finely control the conditioning profile.
摘要翻译：提供了一种用于调理处理垫的柔性垫调节器的实施例。垫调节器包括具有用于调理处理垫的研磨底面的弧形构件。提供装置以施加向下的力以及使垫调节器振荡。可以提供另外的装置来改变沿衬垫调节器的长度的向下的力。在一个实施例中，多个致动器可以联接到构件的顶表面并且适于选择性地提供抵靠构件的独立可控的力以精细地控制调节轮廓。

40. 发明授权

US07311592B2 Conductive polishing article for electrochemical mechanical polishing 有权
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US07311592B2
公开(公告)日：2007-12-25
申请号：US11556011
申请日：2006-11-02
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
IPC分类号： B24D3/34 , B24D11/00 , B24D17/00
CPC分类号： B82Y30/00 , B24B37/046 , B24B37/24 , B24B37/26 , B24D3/34
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate. A plurality of perforations may be formed in the polishing article for flow of material therethrough. An electrode is also exposed to the polishing surface by at least a portion of the plurality of perforations. The article of manufacture may also include a polishing surface having a plurality of grooves, wherein a portion of the plurality of grooves intersect with a portion of the plurality of perforations.
摘要翻译：提供了一种用于平坦化基板表面的制造和设备。在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括抛光制品，所述抛光制品包括具有适于抛光所述衬底的至少部分导电表面的主体。可以在抛光制品中形成多个穿孔，以使材料流过其中。电极还通过多个穿孔的至少一部分暴露于抛光表面。制品还可以包括具有多个凹槽的抛光表面，其中多个凹槽的一部分与多个穿孔的一部分相交。

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