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31. 发明申请

US20050248014A1 Resin-encapsulated semiconductor apparatus and process for its fabrication 失效
标题翻译：树脂封装的半导体装置及其制造方法
公开(公告)号：US20050248014A1
公开(公告)日：2005-11-10
申请号：US11182857
申请日：2005-07-18
申请人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
发明人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
IPC分类号： C08L79/08 , H01L23/29 , H01L23/31 , H01L23/495 , H01L29/76 , H01L31/0203
CPC分类号： C08L79/08 , H01L23/293 , H01L23/3171 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L31/0203 , H01L2224/32245 , H01L2224/45144 , H01L2224/4826 , H01L2224/73215 , H01L2924/01019 , H01L2924/01039 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed of a polyimide. The present invention also provides a process for fabricating a resin-encapsulated semiconductor apparatus, comprising the steps of forming a film of a polyimide precursor composition on the surface of a semiconductor device having a ferroelectric film; heat-curing the polyimide precursor composition film to form a surface-protective film formed of a polyimide; and encapsulating, with an encapsulant resin, the semiconductor device on which the surface-protective film has been formed. The polyimide may preferably have a glass transition temperature of from 240° C. to 400° C. and a Young's modulus of from 2,600 MPa to 6 GPa. The curing may preferably be carried out at a temperature of from 230° C. to 300° C.
摘要翻译：本发明提供一种包含具有铁电体膜和表面保护膜的半导体器件的树脂封装半导体装置和包含树脂的密封剂构件; 表面保护膜由聚酰亚胺形成。本发明还提供一种制造树脂封装的半导体装置的方法，包括以下步骤：在具有铁电体膜的半导体器件的表面上形成聚酰亚胺前体组合物的膜; 热固化聚酰亚胺前体组合物膜以形成由聚酰亚胺形成的表面保护膜; 并用密封树脂封装形成有表面保护膜的半导体器件。聚酰亚胺的玻璃化转变温度优选为240℃〜400℃，杨氏模量为2600MPa〜6GPa。固化可优选在230℃至300℃的温度下进行。

32. 发明授权

US06319656B1 Photosensitive polyimide precursor and its use for pattern formation 失效
标题翻译：光敏聚酰亚胺前体及其用于图案形成
公开(公告)号：US06319656B1
公开(公告)日：2001-11-20
申请号：US09455929
申请日：1999-12-07
申请人： Haruhiko Kikkawa , Fumio Kataoka , Issei Takemoto , Jun Tanaka , Keiko Isoda , Shunichiro Uchimura , Makoto Kaji , Minoru Sugiura
发明人： Haruhiko Kikkawa , Fumio Kataoka , Issei Takemoto , Jun Tanaka , Keiko Isoda , Shunichiro Uchimura , Makoto Kaji , Minoru Sugiura
IPC分类号： G03F730
CPC分类号： C08G73/1025 , C08G73/10 , G03F7/0387
摘要： A polyimide precursor having repeating units of the formula: wherein R1 is a tetravalent organic group having 4 or more carbon atoms; R2 is a trivalent or tetravalent organic group having one or more aromatic rings; R3 is a monovalent organic group; A is a monovalent group showing acidity; and n is an integer of 1 or 2, is effective for preparing a highly sensitive negative-working photosensitive material developable with an alkaline aqueous solution in a short time with high resolution.
摘要翻译：一种具有下式重复单元的聚酰亚胺前体：其中R1是具有4个或更多个碳原子的四价有机基团; R2是具有一个或多个芳环的三价或四价有机基团; R3是一价有机基团; A是显示酸度的一价基团; n为1或2的整数，能够以高分辨率在短时间内制备用碱性水溶液显影的高敏感性负性感光性物质。

33. 发明申请

US20130334213A1 INDUCTION HEATING COOKER 有权
标题翻译：感应加热烹饪机
公开(公告)号：US20130334213A1
公开(公告)日：2013-12-19
申请号：US14002495
申请日：2012-11-07
申请人： Keiko Isoda , Yuji Fujii , Daisuke Sawada
发明人： Keiko Isoda , Yuji Fujii , Daisuke Sawada
IPC分类号： H05B6/06 , H05B6/08
CPC分类号： H05B6/065 , H05B6/08
摘要： A conventional induction heating cooker which operates two inverters at the same time, with only one input current detecting circuit provided, cannot measure each of input currents to each of the plurality of inverters, and cannot control input powers by feedback control on input currents. In the induction heating cooker which has a plurality of inverters, when the input power varies to the inverter which has less input power supplied, the variation hardly influences the cooking. The induction heating cooker according to the present invention fixes the operating frequency for the inverter which has less input power supplied and performs the feedback control of the input current for the inverter which has bigger input power supplied.
摘要翻译：同时只有一个输入电流检测电路同时操作两个反相器的常规感应加热烹调器不能测量到多个逆变器中的每一个的每个输入电流，并且不能通过对输入电流的反馈控制来控制输入功率。在具有多个逆变器的感应加热烹调器中，当输入功率变化到输入功率较小的逆变器时，变化几乎不影响烹调。根据本发明的感应加热烹调器固定了输入功率较小的逆变器的工作频率，并对输入功率较大的逆变器进行输入电流的反馈控制。

34. 发明授权

US08164030B2 Heating cooker with touch panel having user guiding illumination function 有权
标题翻译：具有触摸屏的加热炊具具有用户引导照明功能
公开(公告)号：US08164030B2
公开(公告)日：2012-04-24
申请号：US12374621
申请日：2007-07-26
申请人： Keiko Isoda , Ryuuji Nagata , Chikashi Satou , Tsuyoshi Inada
发明人： Keiko Isoda , Ryuuji Nagata , Chikashi Satou , Tsuyoshi Inada
IPC分类号： H05B3/02 , F09V9/16 , H03K17/975 , G09G3/30
CPC分类号： F24C7/082 , H03K17/9622 , H03K2217/96042 , H03K2217/96046 , H05B2213/03
摘要： An appliance including a top plate has its operability improved and prevents an operation error. The appliance includes electrostatic touch keys provided on a lower surface of the top plate, the electrostatic touch keys including electrodes made of conductive films having predetermined light-blocking property, respectively, operation-unit illuminators emitting light toward the electrodes, which are partially cut, from a direction opposite to the top plate, respectively, and an illumination controller controlling illumination of the operation-unit illuminators. The illumination controller changes the illumination state of the shapes of key indicators above the electrodes to allow a user to identify function and validity of the electrostatic touch keys. The illumination controller controls the illumination state of operation-unit illuminators, such as lighting-on, blinking, lighting-off, and adjusting the brightness, to provide information required for operation.
摘要翻译：包括顶板的设备具有改进的可操作性并防止操作错误。该器具包括设置在顶板的下表面上的静电式触摸键，静电式触摸键包括分别具有预定遮光性的导电膜的电极，朝向电极发射光的操作单元照明部分，分别与顶板相反的方向，以及控制操作单元照明器的照明的照明控制器。照明控制器改变电极上方的关键指示器的形状的照明状态，以允许用户识别静电式触摸键的功能和有效性。照明控制器控制操作单元照明器的照明状态，例如点亮，闪烁，点亮和调整亮度，以提供操作所需的信息。

35. 发明申请

US20090261088A1 HEATING COOKER 有权
标题翻译：加热烹饪机
公开(公告)号：US20090261088A1
公开(公告)日：2009-10-22
申请号：US12374621
申请日：2007-07-26
申请人： Keiko Isoda , Ryuuji Nagata , Chikashi Satou , Tsuyoshi Inada
发明人： Keiko Isoda , Ryuuji Nagata , Chikashi Satou , Tsuyoshi Inada
IPC分类号： H05B3/02 , H01H9/00
CPC分类号： F24C7/082 , H03K17/9622 , H03K2217/96042 , H03K2217/96046 , H05B2213/03
摘要： An appliance including a top plate has its operability improved and prevents an operation error. The appliance includes electrostatic touch keys provided on a lower surface of the top plate, the electrostatic touch keys including electrodes made of conductive films having predetermined light-blocking property, respectively, operation-unit illuminators emitting light toward the electrodes, which are partially cut, from a direction opposite to the top plate, respectively, and an illumination controller controlling illumination of the operation-unit illuminators. The illumination controller changes the illumination state of the shapes of key indicators above the electrodes to allow a user to identify function and validity of the electrostatic touch keys. The illumination controller controls the illumination state of operation-unit illuminators, such as lighting-on, blinking, lighting-off, and adjusting the brightness, to provide information required for operation.
摘要翻译：包括顶板的设备具有改进的可操作性并防止操作错误。该器具包括设置在顶板的下表面上的静电式触摸键，静电式触摸键包括分别具有预定遮光性的导电膜的电极，朝向电极发射光的操作单元照明部分，分别与顶板相反的方向，以及控制操作单元照明器的照明的照明控制器。照明控制器改变电极上方的关键指示器的形状的照明状态，以允许用户识别静电式触摸键的功能和有效性。照明控制器控制操作单元照明器的照明状态，例如点亮，闪烁，点亮和调整亮度，以提供操作所需的信息。

36. 发明授权

US6087006A Surface-protecting film and resin-sealed semiconductor device having said film 失效
标题翻译：具有所述膜的表面保护膜和树脂密封的半导体器件
公开(公告)号：US6087006A
公开(公告)日：2000-07-11
申请号：US517613
申请日：1995-08-22
申请人： Jun Tanaka , Fumio Kataoka , Haruhiko Kikkawa , Isao Obara , Keiko Isoda
发明人： Jun Tanaka , Fumio Kataoka , Haruhiko Kikkawa , Isao Obara , Keiko Isoda
IPC分类号： C08G73/10 , H01L23/31 , H01L23/495 , B32B9/00 , H01L23/00 , B29C13/00
CPC分类号： H01L23/3171 , C08G73/10 , H01L23/4951 , H01L2224/274 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/92147 , H01L24/45 , H01L24/48 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01039 , H01L2924/01046 , H01L2924/01077 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , Y10S428/901 , Y10T428/31504 , Y10T428/31721
摘要： A surface-protecting film is formed on the surface of the semiconductor element of a resin-sealed semiconductor device to prevent the peeling and cracking of the sealing member used in said device, by coating on said surface a polyimide precursor composition containing a polyimide precursor having a recurring unit constitution represented by the following general formula (1) and heat-curing the coated polyimide precursor composition: ##STR1## wherein R.sup.1 is a trivalent or tetravalent aromatic group; R.sup.2 and R.sup.3 are each a tetravalent organic group having 4 or more carbon atoms; R.sup.4 is a bivalent organic group having 4 or more carbon atoms; X is a bivalent organic group containing at least one member selected from the group consisting of oxygen and nitrogen: Y is a monovalent organic group having 15 or less carbon atoms; n=5-100 and m=0-95 with a proviso that n+m=100; and p is 1 or 2).
摘要翻译：在树脂密封半导体装置的半导体元件的表面上形成表面保护膜，以防止在所述装置中使用的密封构件的剥离和破裂，通过在所述表面上涂覆含有聚酰亚胺前体的聚酰亚胺前体组合物，由下述通式（1）表示的重复单元结构和热固化涂覆的聚酰亚胺前体组合物：其中R1是三价或四价芳族基团; R2和R3各自为具有4个或更多个碳原子的四价有机基团; R4是碳原子数为4以上的二价有机基团， X是含有选自氧和氮的至少一种的二价有机基团：Y是碳原子数为15以下的一价有机基团; n = 5-100和m = 0-95，条件是n + m = 100; p为1或2）。

37. 发明授权

US6025113A Photosensitve polymide precursor and its use for pattern formation 失效
标题翻译：光敏聚合物前体及其用于图案形成
公开(公告)号：US6025113A
公开(公告)日：2000-02-15
申请号：US876240
申请日：1997-06-16
申请人： Haruhiko Kikkawa , Fumio Kataoka , Issei Takemoto , Jun Tanaka , Keiko Isoda , Shunichiro Uchimura , Makoto Kaji , Minoru Sugiura
发明人： Haruhiko Kikkawa , Fumio Kataoka , Issei Takemoto , Jun Tanaka , Keiko Isoda , Shunichiro Uchimura , Makoto Kaji , Minoru Sugiura
IPC分类号： G03F7/027 , C08G73/10 , C08L79/08 , G03F7/031 , G03F7/038 , G03F7/40 , H01L21/027 , H01L21/312
CPC分类号： C08G73/1025 , C08G73/10 , G03F7/0387
摘要： A polyimide precursor having repeating units of the formula: ##STR1## wherein R.sup.1 is a tetravalent organic group having 4 or more carbon atoms; R.sup.2 is a trivalent or tetravalent organic group having one or more aromatic rings; R.sup.3 is a monovalent organic group; A is a monovalent group showing acidity; and n is an integer of 1 or 2, is effective for preparing a highly sensitive negative-working photosensitive material developable with an alkaline aqueous solution in a short time with high resolution.
摘要翻译：一种具有下式重复单元的聚酰亚胺前体：其中R1是具有4个或更多个碳原子的四价有机基团; R2是具有一个或多个芳环的三价或四价有机基团; R3是一价有机基团; A是显示酸度的一价基团; n为1或2的整数，能够以高分辨率在短时间内制备用碱性水溶液显影的高敏感性负性感光性物质。

38. 发明授权

US07064368B2 Resin-encapsulated semiconductor apparatus and process for its fabrication 失效
公开(公告)号：US07064368B2
公开(公告)日：2006-06-20
申请号：US10964637
申请日：2004-10-15
申请人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
发明人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
IPC分类号： H01L23/28 , H01L23/29
CPC分类号： C08L79/08 , H01L23/293 , H01L23/3171 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L31/0203 , H01L2224/32245 , H01L2224/45144 , H01L2224/4826 , H01L2224/73215 , H01L2924/01019 , H01L2924/01039 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed of a polyimide. The present invention also provides a process for fabricating a resin-encapsulated semiconductor apparatus, comprising the steps of forming a film of a polyimide precursor composition on the surface of a semiconductor device having a ferroelectric film; heat-curing the polyimide precursor composition film to form a surface-protective film formed of a polyimide; and encapsulating, with an encapsulant resin, the semiconductor device on which the surface-protective film has been formed. The polyimide may preferably have a glass transition temperature of from 240° C. to 400° C. and a Young's modulus of from 2,600 MPa to 6 GPa. The curing may preferably be carried out at a temperature of from 230° C. to 300° C.

39. 发明申请

US20050046047A1 Resin-encapsulated semiconductor apparatus and process for its fabrication 失效
公开(公告)号：US20050046047A1
公开(公告)日：2005-03-03
申请号：US10964637
申请日：2004-10-15
申请人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
发明人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
IPC分类号： C08L79/08 , H01L23/29 , H01L23/31 , H01L23/495 , H01L29/76 , H01L31/0203 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119
CPC分类号： C08L79/08 , H01L23/293 , H01L23/3171 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L31/0203 , H01L2224/32245 , H01L2224/45144 , H01L2224/4826 , H01L2224/73215 , H01L2924/01019 , H01L2924/01039 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed of a polyimide. The present invention also provides a process for fabricating a resin-encapsulated semiconductor apparatus, comprising the steps of forming a film of a polyimide precursor composition on the surface of a semiconductor device having a ferroelectric film; heat-curing the polyimide precursor composition film to form a surface-protective film formed of a polyimide; and encapsulating, with an encapsulant resin, the semiconductor device on which the surface-protective film has been formed. The polyimide may preferably have a glass transition temperature of from 240° C. to 400° C. and a Young's modulus of from 2,600 MPa to 6 GPa. The curing may preferably be carried out at a temperature of from 230° C. to 300° C.

40. 发明授权

US06525359B2 Resin-encapsulated semiconductor apparatus and process for its fabrication 失效
公开(公告)号：US06525359B2
公开(公告)日：2003-02-25
申请号：US09969848
申请日：2001-10-04
申请人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
发明人： Jun Tanaka , Keiko Isoda , Kiyoshi Ogata
IPC分类号： H01L2976
CPC分类号： C08L79/08 , H01L23/293 , H01L23/3171 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L31/0203 , H01L2224/32245 , H01L2224/45144 , H01L2224/4826 , H01L2224/73215 , H01L2924/01019 , H01L2924/01039 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed of a polyimide. The present invention also provides a process for fabricating a resin-encapsulated semiconductor apparatus, comprising the steps of forming a film of a polyimide precursor composition on the surface of a semiconductor device having a ferroelectric film; heat-curing the polyimide precursor composition film to form a surface-protective film formed of a polyimide; and encapsulating, with an encapsulant resin, the semiconductor device on which the surface-protective film has been formed. The polyimide may preferably have a glass transition temperature of from 240° C. to 400° C. and a Young's modulus of from 2,600 MPa to 6 GPa. The curing may preferably be carried out at a temperature of from 230° C. to 300° C.

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