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31. 发明授权

US6030850A Method for manufacturing a sensor 失效
标题翻译：制造传感器的方法
公开(公告)号：US6030850A
公开(公告)日：2000-02-29
申请号：US030414
申请日：1998-02-25
申请人： Juergen Kurle , Karsten Funk , Franz Laermer , Michael Offenberg , Andrea Schilp
发明人： Juergen Kurle , Karsten Funk , Franz Laermer , Michael Offenberg , Andrea Schilp
IPC分类号： G01L1/18 , B81B3/00 , B81C1/00 , G01P15/08 , G01P15/125 , H01L29/84 , G01L1/00 , H01L21/461
CPC分类号： B81B7/007 , B81C1/0019 , G01P15/0802 , G01P15/125 , B81B2201/0235 , B81B2203/033 , B81C2201/0136 , B81C2203/0118 , G01P2015/0814
摘要： In a sensor and a method for manufacturing a sensor, a movable element is patterned out of a silicon layer and is secured to a substrate. The conducting layer is subdivided into various regions, which are electrically insulated from one another. The electrical connection between the various regions of the silicon layer is established by a conducting layer, which is arranged between a first and a second insulating layer.
摘要翻译：在传感器和制造传感器的方法中，可移动元件被图案化为硅层并固定到基底。导电层被细分成彼此电绝缘的各个区域。通过布置在第一和第二绝缘层之间的导电层来建立硅层的各个区域之间的电连接。

32. 发明授权

US5756901A Sensor and method for manufacturing a sensor 失效
标题翻译：用于制造传感器的传感器和方法
公开(公告)号：US5756901A
公开(公告)日：1998-05-26
申请号：US718603
申请日：1996-09-24
申请人： Juergen Kurle , Karsten Funk , Franz Laermer , Michael Offenberg , Andrea Schilp
发明人： Juergen Kurle , Karsten Funk , Franz Laermer , Michael Offenberg , Andrea Schilp
IPC分类号： G01L1/18 , B81B3/00 , B81C1/00 , G01P15/08 , G01P15/125 , H01L29/84 , G01L1/00
CPC分类号： B81B7/007 , B81C1/0019 , G01P15/0802 , G01P15/125 , B81B2201/0235 , B81B2203/033 , B81C2201/0136 , B81C2203/0118 , G01P2015/0814
摘要： In a sensor and a method for manufacturing a sensor, a movable element is patterned out of a silicon layer and is secured to a substrate. The conducting layer is subdivided into various regions, which are electrically insulated from one another. The electrical connection between the various regions of the silicon layer is established by a conducting layer, which is arranged between a first and a second insulating layer.
摘要翻译：在传感器和制造传感器的方法中，可移动元件被图案化为硅层并固定到基底。导电层被细分成彼此电绝缘的各个区域。通过布置在第一和第二绝缘层之间的导电层来建立硅层的各个区域之间的电连接。

33. 发明授权

US5595940A Method of producing micromechanical structures 失效
标题翻译：微机械结构的生产方法
公开(公告)号：US5595940A
公开(公告)日：1997-01-21
申请号：US446271
申请日：1995-05-22
申请人： Hans-Peter Trah , Franz Laermer , Andrea Schilp
发明人： Hans-Peter Trah , Franz Laermer , Andrea Schilp
IPC分类号： G01P15/125 , G01P15/08 , H01L29/84 , H01L49/00 , H01L21/302
CPC分类号： G01P15/0802
摘要： In a method of producing micromechanical structures on semiconductor components, in particular on the surface of a wafer containing integrated circuits, provision is made for the micromechanical structures to be provided subsequently on a fully processed semiconductor component using process steps which are normally applied in semiconductor component production and are at most slightly modified, but independently of the semiconductor component production process.
摘要翻译：在一种在半导体部件上制造微机械结构的方法中，特别是在含有集成电路的晶片的表面上，提供随后在完全处理的半导体部件上提供微机械结构的方法，该方法通常应用于半导体部件生产和修饰最多，但与半导体元件生产过程无关。

34. 发明授权

US5553506A Force sensor and a method for manufacturing a force sensor 失效
标题翻译：力传感器和制造力传感器的方法
公开(公告)号：US5553506A
公开(公告)日：1996-09-10
申请号：US303099
申请日：1994-09-08
申请人： Gerhard Benz , Franz Laermer , Andrea Schilp , Erich Zabler , Jurgen Schirmer , Werner Uhler
发明人： Gerhard Benz , Franz Laermer , Andrea Schilp , Erich Zabler , Jurgen Schirmer , Werner Uhler
IPC分类号： G01L1/10 , G01L9/00 , G01P15/08 , G01P15/097 , G01P15/10 , H01L29/84 , G01L1/00
CPC分类号： G01P15/097 , G01L9/0019 , G01L9/0042 , G01P15/0802 , Y10S148/159
摘要： In a force sensor, a resonator is mounted by means of a dielectric layer on a bending element. Deformation of the bending element changes the resonant frequency of the resonator.
摘要翻译：在力传感器中，通过介电层将谐振器安装在弯曲元件上。弯曲元件的变形会改变谐振器的谐振频率。

35. 发明授权

US5542558A Method for manufacturing micro-mechanical components using selective anodization of silicon 失效
标题翻译：使用硅的选择性阳极氧化制造微机械部件的方法
公开(公告)号：US5542558A
公开(公告)日：1996-08-06
申请号：US308245
申请日：1994-09-19
申请人： Gerhard Benz , Jiri Marek , Martin Willmann , Frank Bantien , Horst Muenzel , Franz Laermer , Michael Offenberg , Andrea Schilp
发明人： Gerhard Benz , Jiri Marek , Martin Willmann , Frank Bantien , Horst Muenzel , Franz Laermer , Michael Offenberg , Andrea Schilp
IPC分类号： H01L29/84 , F16C11/06 , F16C23/04 , F16C33/10 , G01P15/08 , H01L21/3063 , H01L21/316 , H01L21/306
CPC分类号： G01P15/0802 , Y10S438/96
摘要： A method for manufacturing micro-mechanical components in which a structure is produced on a silicon layer, which is to be undercut in a further step. The silicon is selectively anodized for this undercutting operation. Thus, the method enables the manufacturing of micro-mechanical components that can be integrated together with bipolar circuit elements.
摘要翻译：一种制造微机械部件的方法，其中在另一步骤中将被切削的硅层上产生结构。对于该底切操作，硅被选择性地阳极氧化。因此，该方法能够制造可与双极电路元件集成在一起的微机械部件。

36. 发明授权

US06360604B1 Acceleration sensor 有权
标题翻译：加速度传感器
公开(公告)号：US06360604B1
公开(公告)日：2002-03-26
申请号：US09423532
申请日：1999-10-09
申请人： Franz Laermer , Bernhard Elsner , Wilhelm Frey
发明人： Franz Laermer , Bernhard Elsner , Wilhelm Frey
IPC分类号： G01P1500
CPC分类号： G01P15/125 , G01P2015/0814
摘要： An acceleration sensor has an oscillating structure which is movably suspended on a substrate and can be deflected by an acting acceleration. The acceleration sensor also has an analyzing arrangement detecting a deflection of the oscillating structure due to the acceleration. The oscillating structure and/or the analyzing arrangement are connected to the substrate by mechanical decoupling devices.
摘要翻译：加速度传感器具有可移动地悬挂在基板上并且可以通过作用加速度而偏转的振荡结构。加速度传感器还具有检测由于加速度引起的振动结构的偏转的分析装置。振荡结构和/或分析装置通过机械解耦装置连接到基板。

37. 发明授权

US05996409A Acceleration sensing device 失效
标题翻译：加速度传感装置
公开(公告)号：US05996409A
公开(公告)日：1999-12-07
申请号：US64495
申请日：1998-04-22
申请人： Karsten Funk , Franz Laermer , Bernhard Elsner , Wilhelm Frey
发明人： Karsten Funk , Franz Laermer , Bernhard Elsner , Wilhelm Frey
IPC分类号： B60R21/00 , B60R21/01 , B60R21/013 , B60R21/0132 , G01C19/56 , G01C19/5712 , G01P15/125 , G01P15/18 , G01C19/00 , G01P15/08
CPC分类号： B60R21/0132 , B60R21/013 , G01C19/5712 , G01P15/097 , G01P15/125 , G01P15/18 , B60G2800/9124 , B60R2021/0018 , B60R2021/01006 , B60R2021/01306 , G01P2015/0814
摘要： An acceleration sensing device includes a rotational speed sensor which is mounted on a substrate and detects rotational speed, at least one oscillating structure with a deflectable seismic mass, and an acceleration sensor that detects linear acceleration and has at least one additional seismic mass which is suspended on flexible elements so that it can be deflected. The seismic masses of the two sensors are deflected independently of one another.
摘要翻译：加速度感测装置包括安装在基板上并检测转速的转速传感器，具有可偏转地震质量的至少一个振荡结构和检测线性加速度的至少一个额外的地震块悬挂的加速度传感器在柔性元件上，使其可以偏转。两个传感器的地震质量彼此独立地偏转。

38. 发明授权

US08885849B2 Component having a micromechanical microphone structure, and method for operating such a microphone component 有权
标题翻译：具有微机械麦克风结构的部件，以及用于操作这种麦克风组件的方法
公开(公告)号：US08885849B2
公开(公告)日：2014-11-11
申请号：US13138276
申请日：2010-01-11
申请人： Alberto Arias-Drake , Thomas Buck , Jochen Zoellin , Juan Ramos-Martos , Franz Laermer , Antonio Ragel-Morales , Joaquin Ceballos-Caceres , Jose M. Mora-Gutierrez
发明人： Alberto Arias-Drake , Thomas Buck , Jochen Zoellin , Juan Ramos-Martos , Franz Laermer , Antonio Ragel-Morales , Joaquin Ceballos-Caceres , Jose M. Mora-Gutierrez
IPC分类号： H04B15/00 , H04R19/01 , H04R3/00
CPC分类号： H04R3/007 , H04R19/016
摘要： A concept is proposed for a MEMS microphone which may be operated at a relatively low voltage level and still have comparatively high sensitivity. The component according to the present invention includes a micromechanical microphone structure having an acoustically active diaphragm which functions as a deflectable electrode of a microphone capacitor (1), and a stationary acoustically permeable counterelement which functions as a counter electrode of the microphone capacitor (1). The component also includes means for applying a high-frequency clock signal (2) to the microphone capacitor (1) and for applying the inverted clock signal (2′) to an adjustable but acoustically inactive compensation capacitor (7), an integrating operational amplifier (3) which integrates the sum of the current flow through the microphone capacitor (1) and the current flow through the compensation capacitor (7), a demodulator (4) for the output signal of the integrating operational amplifier (3), the demodulator being synchronized with the clock signal (2), and a low-pass filter for obtaining a microphone signal which corresponds to the changes in capacitance of the microphone capacitor (1), based on the output signal of the demodulator (4).
摘要翻译：对于可以在相对低的电压水平操作且仍具有较高灵敏度的MEMS麦克风提出了一个概念。根据本发明的部件包括具有用作麦克风电容器（1）的可偏转电极的声学活动膜片的微机械麦克风结构和用作麦克风电容器（1）的对电极的静止声透射反射器，。该组件还包括用于将高频时钟信号（2）施加到麦克风电容器（1）并用于将反相时钟信号（2'）施加到可调谐但无声补偿电容器（7）的装置，积分运算放大器（3），其集成了通过麦克风电容器（1）的电流和通过补偿电容器（7）的电流之和，用于积分运算放大器（3）的输出信号的解调器（4），解调器与时钟信号（2）同步，以及低通滤波器，用于基于解调器（4）的输出信号获得与麦克风电容器（1）的电容变化相对应的麦克风信号。

39. 发明授权

US08329555B2 Method for producing a capping wafer for a sensor 有权
标题翻译：一种用于生产用于传感器的封盖晶片的方法
公开(公告)号：US08329555B2
公开(公告)日：2012-12-11
申请号：US12734994
申请日：2008-10-20
申请人： Frank Reichenbach , Franz Laermer , Silvia Kronmueller , Andreas Scheurle
发明人： Frank Reichenbach , Franz Laermer , Silvia Kronmueller , Andreas Scheurle
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： B81C1/00301 , B81B2207/095 , H01L21/76879 , H01L21/76898 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/13025 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2924/00014
摘要： A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material.
摘要翻译：一种用于制造具有至少一个盖的传感器的封盖晶片的方法包括：产生通过晶片延伸的接触通孔，并且在其后随后通过导电材料填充接触通孔。

40. 发明授权

US08148234B2 Method for manufacturing a semiconductor structure, and a corresponding Semiconductor Structure 失效
标题翻译：半导体结构的制造方法以及相应的半导体结构
公开(公告)号：US08148234B2
公开(公告)日：2012-04-03
申请号：US12282842
申请日：2007-03-09
申请人： Gerhard Lammel , Hubert Benzel , Matthias Illing , Franz Laermer , Silvia Kronmueller , Paul Farber , Simon Armbruster , Ralf Reichenbach , Christoph Schelling , Ando Feyh
发明人： Gerhard Lammel , Hubert Benzel , Matthias Illing , Franz Laermer , Silvia Kronmueller , Paul Farber , Simon Armbruster , Ralf Reichenbach , Christoph Schelling , Ando Feyh
IPC分类号： H01L21/76
CPC分类号： H01L21/228 , H01L21/02378 , H01L21/02381 , H01L21/02532 , H01L21/02658 , H01L21/02667 , H01L21/223 , H01L21/225 , H01L21/324
摘要： A method for manufacturing a semiconductor structure is provided which includes the following operations: supplying a crystalline semiconductor substrate, providing a porous region adjacent to a surface of the semiconductor substrate, introducing a dopant into the porous region from the surface, and thermally recrystallizing the porous region into a crystalline doping region of the semiconductor substrate whose doping type and/or doping concentration and/or doping distribution are/is different from those or that of the semiconductor substrate. A corresponding semiconductor structure is likewise provided.
摘要翻译：提供了一种制造半导体结构的方法，其包括以下操作：提供晶体半导体衬底，提供与半导体衬底的表面相邻的多孔区域，从表面引入掺杂剂到多孔区域中，并将多孔区域形成半导体衬底的掺杂类型和/或掺杂浓度和/或掺杂分布/不同于半导体衬底或/或掺杂分布的晶体掺杂区域。同样提供相应的半导体结构。

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