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31. 发明授权

US07422516B2 Conductive polishing article for electrochemical mechanical polishing 失效
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US07422516B2
公开(公告)日：2008-09-09
申请号：US11868829
申请日：2007-10-08
申请人： Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
发明人： Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
IPC分类号： B24D11/02 , B23H5/06 , C25D5/22
CPC分类号： B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要： Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.
摘要翻译：提供了用于研磨衬底的抛光制品的实施例。在一个实施例中，抛光制品包括由与由导电材料制成的环形下层耦合的电介质材料制成的环形上层，以及夹在环形上层和环形下层之间的环形子垫，其与之形成可更换组件。

32. 发明申请

US20070290166A1 METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE 审中-公开
标题翻译：用于抛光底物的方法和组合物
公开(公告)号：US20070290166A1
公开(公告)日：2007-12-20
申请号：US11838512
申请日：2007-08-14
申请人： Feng Liu , Tianbao Du , Alain Duboust , Wei-Yung Hsu
发明人： Feng Liu , Tianbao Du , Alain Duboust , Wei-Yung Hsu
IPC分类号： C09K13/04
CPC分类号： C09K3/1463
摘要： Compositions and processes for producing compositions for removing conductive material, such as copper or copper alloys, from a substrate with reduced dishing and reduced insensitivity to overpolishing are provided. Embodiments include polishing compositions for electrochemical mechanical polishing of a substrate surface comprising a conductive material, the compositions having a pH of between about 3.0 to about 9.0, such as between about 4.0 to about 7.0, for example between about 5.0 to about 6.5. The polishing compositions comprise one or more inorganic based electrolytes, such as potassium phosphate monobasic, one or more chelating agents, such as citric acid, imidodiacetic acid, glycine, or salts thereof, such as ammonium citrate, one or more corrosion inhibitors, such as benzotriazole, a basic pH adjusting agent, such as ammonium hydroxide, potassium hydroxide or combinations thereof, one or more oxidizers, such as hydrogen peroxide or ammonium persulphate (APS), and a solvent, such as deionized water.
摘要翻译：提供了用于从具有减少的凹陷的基底中去除导电材料（例如铜或铜合金）的组合物的组合物和方法，并且降低了对过度抛光的不敏感性。实施方案包括用于包含导电材料的基底表面的电化学机械抛光的抛光组合物，所述组合物的pH为约3.0至约9.0，例如约4.0至约7.0，例如约5.0至约6.5。抛光组合物包含一种或多种无机基电解质，例如磷酸二氢钾，一种或多种螯合剂，例如柠檬酸，亚氨基二乙酸，甘氨酸或其盐，例如柠檬酸铵，一种或多种腐蚀抑制剂，例如苯并三唑，碱性pH调节剂，例如氢氧化铵，氢氧化钾或其组合，一种或多种氧化剂，例如过氧化氢或过硫酸铵（APS），以及溶剂如去离子水。

33. 发明申请

US20070044913A1 Grooved Retaining Ring 失效
标题翻译：凹槽保持环
公开(公告)号：US20070044913A1
公开(公告)日：2007-03-01
申请号：US11468267
申请日：2006-08-29
申请人： Shi-Ping Wang , Alain Duboust , Antoine Manens , Wei-Yung Hsu , Jose Salas-Vernis , Zhihong Wang
发明人： Shi-Ping Wang , Alain Duboust , Antoine Manens , Wei-Yung Hsu , Jose Salas-Vernis , Zhihong Wang
IPC分类号： C03C15/00 , H01L21/306
CPC分类号： B24B37/32
摘要： A retaining ring for chemical mechanical polishing is described. The ring has a bottom surface with non-intersecting grooves. Alternating grooves are at opposing angles to one another.
摘要翻译：描述了用于化学机械抛光的保持环。环具有具有不相交槽的底面。交替的槽彼此成相对的角度。

34. 发明申请

US20060219663A1 Metal CMP process on one or more polishing stations using slurries with oxidizers 审中-公开
标题翻译：使用具有氧化剂的浆料在一个或多个抛光站上进行金属CMP处理
公开(公告)号：US20060219663A1
公开(公告)日：2006-10-05
申请号：US11338146
申请日：2006-01-23
申请人： Shi-Ping Wang , Martin Wohlert , Alain Duboust , Renhe Jia , Feng Liu , Yuan Tian , Liang-Yuh Chen , Stan Tsai , Wei-Yung Hsu
发明人： Shi-Ping Wang , Martin Wohlert , Alain Duboust , Renhe Jia , Feng Liu , Yuan Tian , Liang-Yuh Chen , Stan Tsai , Wei-Yung Hsu
IPC分类号： C03C15/00 , H01L21/302 , B44C1/22 , H01L21/461
CPC分类号： H01L21/3212 , C09G1/02 , C23F3/04 , C23F3/06 , H01L21/32125 , H01L21/7684
摘要： Polishing compositions and methods for removing conductive materials and barrier materials from a substrate surface are provided. In one aspect, a full sequence electrochemical mechanical planarization technique is provided. In another aspect, a hybrid planarization technique using combination of at least one chemical mechanical polishing process and at least one electrochemical mechanical polishing process is provided. In addition, a multi-step polishing process for polishing a substrate surface using at least two oxidizers in one or more polishing composition is described. The polishing composition may be used in the full sequence or the hybrid planarization technique. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface with a reduction in planarization defects.
摘要翻译：提供了抛光组合物和从衬底表面去除导电材料和阻挡材料的方法。一方面，提供了全序列电化学机械平面化技术。在另一方面，提供了使用至少一种化学机械抛光工艺和至少一种电化学机械抛光工艺的组合的混合平面化技术。此外，描述了在一种或多种研磨组合物中使用至少两种氧化剂来研磨衬底表面的多步抛光方法。抛光组合物可以以全序或混合平面化技术使用。本文所述的抛光组合物和方法改善了材料从衬底表面的有效去除速率，同时减小了平坦化缺陷。

35. 发明申请

US20070227902A1 Removal profile tuning by adjusting conditioning sweep profile on a conductive pad 审中-公开
标题翻译：通过调节导电垫上的调节扫描轮廓来消除轮廓调整
公开(公告)号：US20070227902A1
公开(公告)日：2007-10-04
申请号：US11392193
申请日：2006-03-29
申请人： Tianbao Du , Feng Liu , May Yu , Alain Duboust , Wei-Yung Hsu
发明人： Tianbao Du , Feng Liu , May Yu , Alain Duboust , Wei-Yung Hsu
IPC分类号： B23H5/08
CPC分类号： B23H5/08 , B24B49/00 , B24B53/017
摘要： A method for controlling the removal rate of material from a substrate during a polishing process is described. In one embodiment, the pre-polish profile of the substrate is determined and polishing pad conditioning parameters are adjusted based on that profile. Parameters such as conditioning head sweep range and frequency, and conditioning element downforce and RPM may be adjusted to selectively condition portions of the pad to maintain optimum polishing qualities of the pad.
摘要翻译：描述了一种用于在抛光过程中控制来自基底的材料的去除速率的方法。在一个实施例中，确定基板的预抛光轮廓并且基于该轮廓来调整抛光垫调节参数。可以调节诸如调节头扫描范围和频率以及调节元件下压力和RPM的参数以选择性地调节焊盘的部分以保持焊盘的最佳抛光质量。

36. 发明申请

US20060169597A1 Method and composition for polishing a substrate 审中-公开
标题翻译：抛光基材的方法和组合物
公开(公告)号：US20060169597A1
公开(公告)日：2006-08-03
申请号：US11356352
申请日：2006-02-15
申请人： Feng Liu , Tianbao Du , Alain Duboust , Wei-Yung Hsu , Robert Ewald , Yuan Tian , You Wang , Stan Tsai
发明人： Feng Liu , Tianbao Du , Alain Duboust , Wei-Yung Hsu , Robert Ewald , Yuan Tian , You Wang , Stan Tsai
IPC分类号： B23H9/00 , B23H7/00
CPC分类号： C25F3/02 , B23H5/08
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, a corrosion inhibitor having an azole group, an organic acid salt, a pH adjusting agent to provide a pH between about 2 and about 10, and a solvent, and a solvent. The composition may be used in a conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as copper, with a reduction in planarization type defects and yielding a desirable surface finish.
摘要翻译：提供了抛光组合物和从衬底表面去除导电材料的方法。在一个方面，组合物包括酸基电解质体系，具有唑基的腐蚀抑制剂，有机酸盐，pH调节剂以提供约2至约10的pH以及溶剂和溶剂。该组合物可以用于导电材料去除工艺中，包括在包括电极的工艺设备中设置其上形成有导电材料层的衬底，在电极和衬底之间提供组合物，在电极和衬底之间施加偏压，以及从导电材料层去除导电材料。本文所述的抛光组合物和方法提高了材料从衬底表面（例如铜）的有效去除速率，同时平坦化型缺陷减少并产生理想的表面光洁度。

37. 发明申请

US20060102872A1 Method and composition for electrochemical mechanical polishing processing 失效
标题翻译：电化学机械抛光加工的方法和组成
公开(公告)号：US20060102872A1
公开(公告)日：2006-05-18
申请号：US11312823
申请日：2005-12-19
申请人： Feng Liu , Tianbao Du , Alain Duboust , Wei-Yung Hsu
发明人： Feng Liu , Tianbao Du , Alain Duboust , Wei-Yung Hsu
IPC分类号： C09K13/00 , C09K13/04
CPC分类号： H01L21/32125 , B23H5/08 , C25F3/02 , H01L21/7684
摘要： A method of processing a substrate having a conductive material layer disposed thereon is provided which includes positioning the substrate in a process apparatus and supplying a first polishing composition between to the substrate. The polishing composition comprises a first chelating agent, a second chelating agent, a first corrosion inhibitor, a second corrosion inhibitor, a suppressor, a solvent, and an inorganic acid based electrolyte to provide a pH between about 3 and about 10.
摘要翻译：提供一种处理其上设置有导电材料层的基板的方法，其包括将基板定位在处理装置中并将第一抛光组合物提供到基板之间。抛光组合物包括第一螯合剂，第二螯合剂，第一腐蚀抑制剂，第二腐蚀抑制剂，抑制剂，溶剂和无机酸基电解质，以提供约3至约10的pH。

38. 发明申请

US20100267318A1 POLISHING PAD WITH PROJECTING PORTION 审中-公开
标题翻译：抛光垫与投影部分
公开(公告)号：US20100267318A1
公开(公告)日：2010-10-21
申请号：US12823872
申请日：2010-06-25
申请人： Alain Duboust , Shou-Sung Chang , Wei Lu , Siew Neo , Yan Wang , Antoine P. Manens , Yongsik Moon
发明人： Alain Duboust , Shou-Sung Chang , Wei Lu , Siew Neo , Yan Wang , Antoine P. Manens , Yongsik Moon
IPC分类号： B24D11/02
CPC分类号： B24B37/013 , B24B37/046 , B24B37/205 , B24B37/22 , B24B37/26 , B24D11/02
摘要： A polishing pad include a polishing layer having a polishing surface and a backing layer on a side of the polishing layer opposite the polishing surface. An outer edge of the polishing layer overhangs an outer edge of the backing layer.
摘要翻译：抛光垫包括在抛光层的与研磨表面相对的一侧上具有抛光表面和背衬层的抛光层。抛光层的外边缘突出在背衬层的外边缘上。

39. 发明申请

US20080038999A1 RETAINING RING WITH CONDUCTIVE PORTION 审中-公开
标题翻译：带导电部件的保持环
公开(公告)号：US20080038999A1
公开(公告)日：2008-02-14
申请号：US11865303
申请日：2007-10-01
申请人： Antoine Manens , Suresh Shrauti , Alain Duboust , Yan Wang , Liang-Yuh Chen
发明人： Antoine Manens , Suresh Shrauti , Alain Duboust , Yan Wang , Liang-Yuh Chen
IPC分类号： H01L21/302 , B24B5/00
CPC分类号： B23H5/08 , B24B37/32
摘要： A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that tends to occur with conventional electrochemical mechanical processing systems.
摘要翻译：描述了一种用于电化学机械加工的保持环。保持环具有形成有导电部分和非导电部分的大致环形体。非导电部分在抛光期间接触基板。导电部分在抛光期间被电偏置以减少常规电化学机械处理系统倾向于发生的边缘效应。

40. 发明申请

US20070099552A1 CONDUCTIVE PAD WITH ION EXCHANGE MEMBRANE FOR ELECTROCHEMICAL MECHANICAL POLISHING 失效
标题翻译：带有离子交换膜的电化学机械电化学机械抛光
公开(公告)号：US20070099552A1
公开(公告)日：2007-05-03
申请号：US11555145
申请日：2006-10-31
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel Carl , Ralph Wadensweiler , Manoocher Birang , Paul Butterfield , Rashid Mavliev , Stan Tsai , You Wang , Jie Diao , Renhe Jia , Lakshmanan Karuppiah , Robert Ewald
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel Carl , Ralph Wadensweiler , Manoocher Birang , Paul Butterfield , Rashid Mavliev , Stan Tsai , You Wang , Jie Diao , Renhe Jia , Lakshmanan Karuppiah , Robert Ewald
IPC分类号： B23F21/03
CPC分类号： B24B37/046 , B24B27/0023 , B24B37/24 , B24B37/26 , B24D3/34 , B82Y30/00
摘要： An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.
摘要翻译：提供了一种用于处理基板表面的制造和设备。在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括具有至少部分导电的抛光表面的主体的抛光制品。电极设置在其间具有介电材料的抛光表面下方。可以在抛光表面和电介质材料中形成多个孔，以至少部分地将电极暴露于抛光表面。可以在电极和抛光表面之间设置膜，其可透过离子和电流，以促进电极和抛光表面之间的连续性。

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