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31. 发明授权

US07243705B2 Integrated circuit coolant microchannel with compliant cover 有权
标题翻译：集成电路冷却剂微通道，带有合适的盖
公开(公告)号：US07243705B2
公开(公告)日：2007-07-17
申请号：US11069540
申请日：2005-03-01
申请人： Alan M. Myers , Je-Young Chang , Ravi Prasher , Ioan Sauciuc , Gregory M. Chrysler , Patrick D. Boyd , Chia-pin Chiu
发明人： Alan M. Myers , Je-Young Chang , Ravi Prasher , Ioan Sauciuc , Gregory M. Chrysler , Patrick D. Boyd , Chia-pin Chiu
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/473 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.
摘要翻译：一种装置包括其中形成有微通道的微通道结构。微通道将输送冷却剂并靠近集成电路以将热量从集成电路传递到冷却剂。该装置还包括位于微通道结构上的盖，以限定每个微通道的相应的上壁。盖子提供微通道的柔顺表面。

32. 发明申请

US20070035927A1 Heat dissipating device with enhanced boiling/condensation structure 有权
标题翻译：具有较高沸点/冷凝结构的散热装置
公开(公告)号：US20070035927A1
公开(公告)日：2007-02-15
申请号：US11582626
申请日：2006-10-17
申请人： Hakan Erturk , Ioan Sauciuc
发明人： Hakan Erturk , Ioan Sauciuc
IPC分类号： H05K7/20
CPC分类号： F28D15/046 , F28D15/043 , F28F13/187 , F28F2245/04 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column placed in fluid communication with the evaporator, and a set of condenser extension surfaces extending from the condenser. The evaporator includes a modulated porous layer and stores liquid. The condenser column includes a non-wetting surface. The condenser extension surface facilitates heat dissipation.
摘要翻译：散热装置所述散热装置包括放置在产生热量的装置上的接收板，与所述接收板连接的蒸发器，与所述蒸发器流体连通的冷凝器柱以及从所述冷凝器延伸的一组冷凝器延伸表面。蒸发器包括调制多孔层并储存液体。冷凝器柱包括非润湿表面。冷凝器延伸表面有助于散热。

33. 发明申请

US20050078451A1 Computer system having controlled cooling 有权
标题翻译：具有控制冷却的计算机系统
公开(公告)号：US20050078451A1
公开(公告)日：2005-04-14
申请号：US10683924
申请日：2003-10-10
申请人： Ioan Sauciuc , Gregory Chrysler , Ravi Mahajan
发明人： Ioan Sauciuc , Gregory Chrysler , Ravi Mahajan
IPC分类号： G06F1/20 , H03K17/955 , H05K7/20
CPC分类号： G06F1/20 , G06F1/206 , G06F2200/201
摘要： A computer system and its method of cooling are provided. A vapor chamber serves as a heat spreader for heat from the microelectronic die. A thermoelectric module serves to cool the vapor chamber and maintain proper functioning of the vapor chamber, thus keeping the microelectronic die cooled. A controller receives input from five temperature sensors, and utilizes the input to control current to the thermoelectric module and voltage/current to a motor that drives a fan and provides additional cooling. A current sensor allows the controller to monitor and limit power provided to the thermoelectric module.
摘要翻译：提供了一种计算机系统及其冷却方法。蒸气室用作来自微电子管芯的热量的散热器。热电模块用于冷却蒸气室并保持蒸气室的适当功能，从而保持微电子模具的冷却。控制器从五个温度传感器接收输入，并利用输入来控制热电模块的电流和驱动风扇的电机的电压/电流，并提供额外的冷却。电流传感器允许控制器监测和限制提供给热电模块的功率。

34. 发明申请

US20050068737A1 Heatsink device and method 失效
标题翻译：散热装置及方法
公开(公告)号：US20050068737A1
公开(公告)日：2005-03-31
申请号：US10676230
申请日：2003-09-30
申请人： Javier Leija , Ioan Sauciuc , Gregory Chrysler
发明人： Javier Leija , Ioan Sauciuc , Gregory Chrysler
IPC分类号： H01L23/427 , H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152
摘要： A method and device for thermal conduction is provided. Devices and methods are shown that include the ability to dissipate increased amounts of heat due to the use of an active heat transfer device. Devices and methods are shown that share the necessary heat transfer between a passive heat transfer device and an active heat transfer device, thus increasing the amount of heat dissipated while maintaining reliability of the individual components. Devices and methods are shown that include an increased length of the heatsink which can keep large temperature differences between heat transfer structures and the heat transfer fluid such as air.
摘要翻译：提供了一种用于导热的方法和装置。显示的装置和方法包括由于使用活性热传递装置而耗散增加的热量的能力。示出了在被动热传递装置和主动传热装置之间共享必要的热传递的装置和方法，因此在保持各个部件的可靠性的同时增加散热量。示出了包括增加长度的散热器的装置和方法，其可以在传热结构和诸如空气的传热流体之间保持较大的温差。

35. 发明授权

US06845622B2 Phase-change refrigeration apparatus with thermoelectric cooling element and methods 失效
标题翻译：具有热电冷却元件的相变制冷装置及方法
公开(公告)号：US06845622B2
公开(公告)日：2005-01-25
申请号：US10401376
申请日：2003-03-27
申请人： Ioan Sauciuc , Gregory M. Chrysler
发明人： Ioan Sauciuc , Gregory M. Chrysler
IPC分类号： F25B21/02 , F28D15/02 , H01L35/00 , H01L35/30
CPC分类号： F25B21/02 , F25B2321/0212 , F28D15/0266 , F28D15/0275 , H01L35/00 , H01L35/30
摘要： A heat-transfer device has a sealed vapor chamber with a phase-change fluid therein, and a thermoelectric cooling (TEC) element with a cooled side in thermal contact with the vapor chamber and a heated side in contact with heat-dissipation fins. The TEC element decreases the temperature of the vapor chamber and increases the temperature of the fins for improved efficiency. The vapor chamber is defined between concentrically positioned tubes, and a tunnel region is located within the inner tube. Additional TEC elements within the tunnel region further dissipate heat. In two-phase natural convection embodiments, TEC elements may further cool liquid returning to the heat source. Parallel heat dissipation paths may also be provided. In a two-phase forced convection embodiment, a TEC element may further cool liquid returning to the heat source, and additional TEC elements may be provided on the condenser. In some embodiments, active feedback controls the amount of energy transferred by a TEC element.
摘要翻译：传热装置具有其中具有相变流体的密封蒸气室，以及具有与蒸气室热接触的冷却侧的热电冷却（TEC）元件和与散热翅片接触的加热侧。 TEC元件降低蒸气室的温度，并提高翅片的温度以提高效率。蒸汽室被定义在同心定位的管之间，隧道区位于内管内。隧道区域内的额外TEC元件进一步散热。在两相自然对流实施例中，TEC元件可以进一步冷却返回到热源的液体。还可以提供平行散热路径。在两相强制对流实施例中，TEC元件可以进一步冷却返回到热源的液体，并且可以在冷凝器上提供额外的TEC元件。在一些实施例中，主动反馈控制由TEC元件传送的能量的量。

36. 发明授权

US06609561B2 Tunnel-phase change heat exchanger 失效
标题翻译：隧道相变换热器
公开(公告)号：US06609561B2
公开(公告)日：2003-08-26
申请号：US10023989
申请日：2001-12-21
申请人： Ioan Sauciuc , Gregory M. Chrysler
发明人： Ioan Sauciuc , Gregory M. Chrysler
IPC分类号： F28D1500
CPC分类号： H01L23/427 , F28D15/0266 , F28F3/025 , H01L2924/0002 , H01L2924/00
摘要： A phase change heat exchanger and method for cooling a heat dissipating electronic component, such as an electronics package, transfers heat from the electronic component by way of a heatsink including a base in heat conducting relation with the electronic component and fins arranged in heat conducting relation at one end thereof with the base. The efficiency of the fins is increased by also transferring heat from the base to the fins at a location spaced from the one end thereof using a phase change fluid separated from the fins. A chamber containing the phase change fluid is defined between two telescoping tubes which extend peripherally about the fins to form a tunnel or duct through which a cooling fluid such as air can be flowed in contact with the fins. A further increase in cooling efficiency is obtained using an additional remote heat exchangers attached to the surface of the chamber.
摘要翻译：相变换热器和电子封装等散热电子部件的冷却方法，通过散热器从电子部件传递热量，该散热器包括与导电关系的电子部件和导热关系的散热基板在其一端与基部。通过使用从散热片分离的相变流体，在与其一端间隔开的位置处也将热量从基底转移到散热片，从而提高散热片的效率。包含相变流体的室被限定在两个伸缩管之间，这两个伸缩管围绕翅片周向延伸以形成隧道或管道，诸如空气的冷却流体可以通过该通道或管道与翅片接触。使用附加到室的表面的另外的远程热交换器来获得冷却效率的进一步提高。

37. 发明授权

US07939945B2 Electrically conductive fluid interconnects for integrated circuit devices 有权
标题翻译：用于集成电路器件的导电流体互连
公开(公告)号：US07939945B2
公开(公告)日：2011-05-10
申请号：US12113024
申请日：2008-04-30
申请人： Ioan Sauciuc , Ward Scott
发明人： Ioan Sauciuc , Ward Scott
IPC分类号： H01L29/40
CPC分类号： H05K3/321 , H01L2224/16225 , H05K3/3436 , H05K3/3463 , H05K2201/09472 , H05K2201/10734
摘要： Disclosed are embodiments of an electrically conductive fluid interconnect for coupling an integrated circuit (IC) device to a substrate. The IC device may be coupled to the substrate in a socketless manner or using a socket. The electrically conductive fluid interconnect may include, for example, a metal, an electrically conductive paste, or an electrically conductive polymer material. The fluid may be in a liquid or paste state over at least part of an operating temperature range of the IC device, and in other embodiments the fluid may be in the liquid or paste state at room temperature. Other embodiments are described and claimed.
摘要翻译：公开了用于将集成电路（IC）器件耦合到衬底的导电流体互连件的实施例。 IC器件可以以无插槽的方式或使用插座耦合到基板。导电流体互连可以包括例如金属，导电膏或导电聚合物材料。流体可以在IC器件的至少一部分工作温度范围内处于液体或糊状态，并且在其它实施例中，流体可以在室温下处于液体或糊状态。描述和要求保护其他实施例。

38. 发明授权

US07764499B2 Electromagnetically-actuated micropump for liquid metal alloy 有权
标题翻译：用于液态金属合金的电磁致动微型泵
公开(公告)号：US07764499B2
公开(公告)日：2010-07-27
申请号：US12454413
申请日：2009-05-18
申请人： Ioan Sauciuc , Ravi Mahajan
发明人： Ioan Sauciuc , Ravi Mahajan
IPC分类号： H05K7/20 , F04B43/14
CPC分类号： H01L23/427 , F28D15/00 , F28D15/0266 , H01L2924/0002 , H01L2924/00
摘要： The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop system; turning on an electromagnet to generate a magnetic field to permeate flexible sidewalls of the cavity; attracting the liquid metal alloy in the cavity towards the electromagnet to expand the flexible sidewalls; inducing a second portion of the liquid metal alloy to enter the cavity from an inlet end of a pipe within the closed-loop system; turning off the electromagnet; repelling the liquid metal alloy in the cavity away from the electromagnet to contract the flexible sidewalls; and inducing a third portion of the liquid metal alloy to exit the cavity to an outlet end of the pipe.
摘要翻译：本发明公开了一种将液态金属合金限制在闭环系统内的方法; 将所述液态金属合金的第一部分分布在所述闭环系统内的空腔中; 打开电磁体以产生磁场以渗透空腔的柔性侧壁; 将空腔中的液态金属合金吸引到电磁体以膨胀柔性侧壁; 引起所述液态金属合金的第二部分从所述闭环系统内的管的入口端进入所述空腔; 关闭电磁铁; 将空腔中的液态金属合金排斥离开电磁体以收缩柔性侧壁; 并且引起所述液态金属合金的第三部分离开所述腔到所述管的出口端。

39. 发明申请

US20100047092A1 Piezoelectric fan, method of cooling a microelectronic device using same, and system containing same 审中-公开
标题翻译：压电风扇，使用其的微电子器件的冷却方法以及包含该微电子器件的系统
公开(公告)号：US20100047092A1
公开(公告)日：2010-02-25
申请号：US12589408
申请日：2009-10-22
申请人： Hakan Erturk , Ioan Sauciuc
发明人： Hakan Erturk , Ioan Sauciuc
IPC分类号： F04B17/00 , H02N2/00 , H02N2/06
CPC分类号： F04D33/00
摘要： A piezoelectric fan comprises a blade (110, 210, 310, 410, 510, 610), a piezoelectric actuator patch (120, 220, 320, 420, 520 ,620, 811) adjacent to the blade, and a piezoelectric sensor patch (130, 230, 330, 430, 530, 630, 812) adjacent to one of the piezoelectric actuator patch and the blade. The piezoelectric sensor patch measures a voltage proportional to a deflection of the piezoelectric actuator patch and a deflection of a tip of the blade and uses that voltage to generate an input signal to an active feedback controller (840) that in turn ensures that the oscillation amplitude of the blade satisfies certain cooling specifications.
摘要翻译：压电风扇包括叶片（110,210,310,410,510,610），与叶片相邻的压电致动器贴片（120,220,320,420,520,620,811）和压电传感器贴片（ 130,230,330,430,530,630,812），与所述压电致动器补片和所述刀片之一相邻。压电传感器贴片测量与压电致动器贴片的偏转成比例的电压和刀片的尖端的偏转，并且使用该电压来产生到主动反馈控制器（840）的输入信号，从而确保振荡幅度的叶片满足一定的冷却规格。

40. 发明申请

US20090230819A1 COMPACT RAKE PIEZOELECTRIC ASSEMBLY AND METHOD OF MANUFACTURING SAME 有权
标题翻译：紧凑型压电组件及其制造方法
公开(公告)号：US20090230819A1
公开(公告)日：2009-09-17
申请号：US12047432
申请日：2008-03-13
申请人： Ioan Sauciuc
发明人： Ioan Sauciuc
IPC分类号： H01L41/08 , H01L41/083 , H01L41/053 , H01L41/09 , H01L41/22
CPC分类号： F04B43/046 , H01L23/467 , H01L2924/0002 , Y10T29/42 , H01L2924/00
摘要： A compact rake piezoelectric assembly comprises a body (110), a plurality of blades (120) extending away from the body, and a piezoelectric patch (130) attached to the body. The piezoelectric patch has a fixed portion (138) and a free portion (139), with the fixed portion being constrained to be in physical contact with the body.
摘要翻译：紧凑型前置压电组件包括主体（110），远离主体延伸的多个叶片（120）和附接到主体的压电贴片（130）。压电贴片具有固定部分（138）和自由部分（139），固定部分被限制为与身体物理接触。

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