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31. 发明授权

US6147790A Spring-ring micromechanical device 有权
标题翻译：弹簧环微机械装置
公开(公告)号：US6147790A
公开(公告)日：2000-11-14
申请号：US311009
申请日：1999-05-13
申请人： Robert E. Meier , Richard L. Knipe
发明人： Robert E. Meier , Richard L. Knipe
IPC分类号： G02B26/08 , G02B26/00
CPC分类号： G02B26/0841
摘要： An improved micromechanical device comprising a substrate (104), a rigid deflectable member (302, 314, 326) suspended over the substrate, and at least one spring (328) supported above the substrate and spaced apart from the rigid deflectable member. The spring resists deflection of the rigid deflectable member when the rigid deflectable member deflects to contact the spring. The improved micromechanical device is constructed by fabricating at least one support structure (116) on a substrate, fabricating at least one spring spaced apart from the substrate and supported by at least one of the support structures, and fabricating a deflectable member spaced apart from both the substrate and spring, and supported by at least one of the support structures. The improved micromechanical device is useful in a projection display system in which a micromirror device selectively reflects incident light, as directed by a controller electrically connected to the micromirror device, and the selectively reflected light is focused onto an image plane. The micromirror device is comprised an array of micromirror elements, each comprised of: a substrate, a spring supported by the substrate, and a deflectable rigid member supported by the substrate and spaced apart from the spring. The deflectable rigid member including a mirror to deflect toward the spring, which resists the deflection of the deflectable rigid member.
摘要翻译：一种改进的微机械装置，包括衬底（104），悬置在衬底上的刚性可偏转构件（302,314,326）以及支撑在衬底上并与刚性可偏转构件间隔开的至少一个弹簧（328）。当刚性可偏转构件偏转以接触弹簧时，弹簧抵抗刚性可偏转构件的偏转。改进的微机械装置通过在衬底上制造至少一个支撑结构（116）而构成，制造至少一个与衬底间隔开的弹簧并由至少一个支撑结构支撑，并且制造与两个间隔开的可偏转构件基板和弹簧，并且由至少一个支撑结构支撑。改进的微机械装置在投影显示系统中是有用的，其中微反射镜装置根据与微镜装置电连接的控制器的指示选择性地反射入射光，并且选择性反射的光聚焦在图像平面上。微镜装置包括一组微镜元件，每个微镜元件包括：衬底，由衬底支撑的弹簧以及由衬底支撑并与弹簧间隔开的可偏转的刚性构件。可偏转的刚性构件包括朝向弹簧偏转的反射镜，其抵抗可偏转的刚性构件的偏转。

32. 发明授权

US5696619A Micromechanical device having an improved beam 失效
标题翻译：具有改进光束的微机械装置
公开(公告)号：US5696619A
公开(公告)日：1997-12-09
申请号：US395562
申请日：1995-02-27
申请人： Richard L. Knipe , John H. Tregilgas , Thomas W. Orent , Hidekazu Yoshihara
发明人： Richard L. Knipe , John H. Tregilgas , Thomas W. Orent , Hidekazu Yoshihara
IPC分类号： G02B26/08
CPC分类号： G02B26/0841
摘要： An electrically addressable, integrated, monolithic, micromirror device (10) is formed by the utilization of sputtering techniques, including various metal and oxide layers, photoresists, liquid and plasma etching, plasma stripping and related techniques and materials. The device (10) includes a selectively electrostatically deflectable mass or mirror (12) of supported by one or more beams (18) formed by sputtering and selective etching. The beams (18) are improved by being constituted of an impurity laden titanium-tungsten layer (52) with an impurity such as nitrogen, which causes the beams to have lattice constant different from TiW. The improved beams (18) exhibit increased strength, and decreased relaxation and creep.
摘要翻译：通过利用包括各种金属和氧化物层，光致抗蚀剂，液体和等离子体蚀刻，等离子体剥离和相关技术和材料的溅射技术形成电可寻址，集成的单片微镜器件（10）。装置（10）包括由溅射和选择性蚀刻形成的一个或多个光束（18）支撑的选择性静电偏转质量块或反射镜（12）。梁（18）由具有氮杂质的含杂质的钛 - 钨层（52）构成，从而使光束具有与TiW不同的晶格常数。改进的梁（18）表现出增加的强度，并且减小了松弛和蠕变。

33. 发明申请

US20080293223A1 Method for Manufacturing Strained Silicon 审中-公开
标题翻译：制造应变硅的方法
公开(公告)号：US20080293223A1
公开(公告)日：2008-11-27
申请号：US12185167
申请日：2008-08-04
申请人： Richard L. Knipe , Grady L. Endsley
发明人： Richard L. Knipe , Grady L. Endsley
IPC分类号： H01L21/203
CPC分类号： H01L21/02532 , C30B29/06 , C30B33/00 , H01L21/02381 , H01L21/0243
摘要： In accordance with a particular embodiment of the present invention, a method for manufacturing strained silicon is provided. In one embodiment, the method for manufacturing strained silicon includes inducing a curvature in a silicon wafer, depositing an epitaxial layer of silicon upon an upper surface of the silicon water while the silicon wafer is under the induced curvature, and releasing the silicon wafer from the induced curvature, after depositing the epitaxial layer, such that a strain is induced in the epitaxial layer.
摘要翻译：根据本发明的特定实施例，提供一种制造应变硅的方法。在一个实施例中，制造应变硅的方法包括在硅晶片中引入曲率，在硅晶片处于诱导曲率下方的同时，在硅水的上表面上沉积硅的外延层，并将硅晶片从在沉积外延层之后，使得在外延层中诱发应变。

34. 发明授权

US07410888B2 Method for manufacturing strained silicon 有权
标题翻译：应变硅制造方法
公开(公告)号：US07410888B2
公开(公告)日：2008-08-12
申请号：US11027512
申请日：2004-12-30
申请人： Richard L. Knipe , Grady L. Endsley
发明人： Richard L. Knipe , Grady L. Endsley
IPC分类号： H01L21/20
CPC分类号： H01L21/02532 , C30B29/06 , C30B33/00 , H01L21/02381 , H01L21/0243
摘要： In accordance with a particular embodiment of the present invention, a method for manufacturing strained silicon is provided. In one embodiment, the method for manufacturing strained silicon includes inducing a curvature in a silicon wafer, depositing an epitaxial layer of silicon upon an upper surface of the silicon water while the silicon wafer is under the induced curvature, and releasing the silicon wafer from the induced curvature, after depositing the epitaxial layer, such that a strain is induced in the epitaxial layer.
摘要翻译：根据本发明的特定实施例，提供一种制造应变硅的方法。在一个实施例中，制造应变硅的方法包括在硅晶片中引入曲率，在硅晶片处于诱导曲率下方的同时，在硅水的上表面上沉积硅的外延层，并将硅晶片从在沉积外延层之后，使得在外延层中诱发应变。

35. 发明授权

US06908791B2 MEMS device wafer-level package 有权
标题翻译： MEMS器件晶圆级封装
公开(公告)号：US06908791B2
公开(公告)日：2005-06-21
申请号：US10135559
申请日：2002-04-29
申请人： Thomas A. Kocian , Richard L. Knipe , Mark H. Strumpell
发明人： Thomas A. Kocian , Richard L. Knipe , Mark H. Strumpell
IPC分类号： B81C99/00 , H01L21/48 , H01L21/50
CPC分类号： B81C99/004 , B81C99/0065 , B81C2203/0109 , G02B26/0833 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592 , H01L2924/01019 , H01L2924/09701 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.
摘要翻译：通过目视检查和/或电气测试检查具有多个管芯的半导体晶片的方法和系统。如果晶片上的某些管芯通过检查，那么在它们仍然是晶片的一部分的同时，将窗口安装或固定在那些特定的金属模上。

36. 发明授权

US06906850B2 Capacitively coupled micromirror 有权
标题翻译：电容耦合微镜
公开(公告)号：US06906850B2
公开(公告)日：2005-06-14
申请号：US10027873
申请日：2001-12-21
申请人： Richard L. Knipe
发明人： Richard L. Knipe
IPC分类号： B81B3/00 , G02B26/08 , H04N5/74 , G02B26/00 , G09G3/34
CPC分类号： G02B26/0841 , H04N5/7458
摘要： A capacitively coupled microelectromechanical device comprising: a semiconductor substrate; a member operable to deflect to either of at least two states; and a switch for selectively connecting the member to a voltage signal. When a logic high signal is stored on memory capacitor, mirror transistor is turned on, grounding the mirror structure. When a logic low signal is stored on the memory capacitor, the mirror transistor is turned off, allowing the mirror to float electrically. Mirrors that are tied to a voltage potential, which typically are grounded, are affected by a reset pulse and rotate away from their landed position. When the mirrors have rotated to the opposite side, a bias signal is applied to hold the repositioned mirror in place in the opposite state. Mirrors that electrically are floating do not experience the forces generated by the reset voltage and remain in their previous state.
摘要翻译：一种电容耦合微机电装置，包括：半导体衬底; 可操作以偏转至少两个状态中的任一个的构件; 以及用于选择性地将构件连接到电压信号的开关。当逻辑高电平信号存储在存储电容上时，反射镜晶体管导通，将镜面结构接地。当逻辑低电平信号存储在存储电容器上时，反射镜晶体管关闭，允许反射镜电气浮动。连接到电压电位（通常为接地）的反射镜受到复位脉冲的影响，并远离其着陆位置旋转。当镜子旋转到相对侧时，施加偏置信号以将重新定位的镜子保持在相反的状态。电浮动的反射镜不会经历由复位电压产生的力并保持其先前状态。

37. 发明授权

US06775174B2 Memory architecture for micromirror cell 有权
标题翻译：微镜单元的内存架构
公开(公告)号：US06775174B2
公开(公告)日：2004-08-10
申请号：US10034896
申请日：2001-12-28
申请人： James D. Huffman , Larry J. Hornbeck , Richard L. Knipe
发明人： James D. Huffman , Larry J. Hornbeck , Richard L. Knipe
IPC分类号： G11C1124
CPC分类号： G11C7/005 , G02B26/0841 , G11C11/404 , G11C13/04
摘要： A one transistor one capacitor micromirror with DRAM memory cell built around a large polysilicon-to-substrate capacitor which is not susceptible to recombination of photo-generated carriers caused by illumination in the projector. This large polysilicon-to-substrate capacitor overshadows the much smaller inherent parallel depletion capacitance which is sensitive to light. The device is further 100% shielded from exposed light by metal layers and the address node is located under the center of the micromirror mirror to obtain maximum shielding of light for the smaller, light sensitive, depletion portion of the capacitance. As a result the micromirror of this invention can adequately hold the cell charge in excess of the device load time of 300 &mgr;Sec even in extremely high brightness projector applications. This invention also provides a feature which automatically forces micromirror mirrors located over bad CMOS memory cell to the dark state, which is much less objectionable in most applications, thereby improving the overall effective processing yield.
摘要翻译：一个单晶体管一个电容器微镜，其中存储有大量多晶硅对基板电容器的DRAM存储单元，该电容器不容易受到由投影仪中的照明引起的光生载流子的复合。这种大的多晶硅对衬底电容器掩盖了对光敏感的小得多的固有并联耗尽电容。该器件通过金属层进一步100％屏蔽曝光，并且地址节点位于微镜反射镜的中心下方，以获得对电容的较小的，光敏的耗尽部分的光的最大屏蔽。因此，即使在极高亮度的投影机应用中，本发明的微镜也能充分地保持超过300μSec的器件加载时间的电池电荷。本发明还提供了一种特征，其将位于不良CMOS存储器单元上方的微反射镜自动强制到暗状态，这在大多数应用中不太令人反感，从而提高了整体有效的处理产量。

38. 发明授权

US08432597B2 Micro-mirror hinge 有权
标题翻译：微镜铰链
公开(公告)号：US08432597B2
公开(公告)日：2013-04-30
申请号：US11429840
申请日：2006-05-08
申请人： Richard L. Knipe
发明人： Richard L. Knipe
IPC分类号： G02B26/00
CPC分类号： G02B26/0841
摘要： According to one embodiment of the present invention a digital micro-mirror device is taught that includes a pixel occupying an area of the device and a hinge coupled to the pixel and positioned such that at least a portion of the hinge falls outside the area of the pixel.
摘要翻译：根据本发明的一个实施例，教导了一种数字微镜装置，其包括占据该装置的区域的像素和与该像素耦合的铰链，并被定位成使得铰链的至少一部分落在像素。

39. 发明授权

US07654677B2 Yokeless hidden hinge digital micromirror device 有权
标题翻译：无线隐形铰链数码微镜装置
公开(公告)号：US07654677B2
公开(公告)日：2010-02-02
申请号：US11834583
申请日：2007-08-06
申请人： Anthony DiCarlo , Patrick I. Oden , Richard L. Knipe , Rabah Mezenner , James D. Huffman
发明人： Anthony DiCarlo , Patrick I. Oden , Richard L. Knipe , Rabah Mezenner , James D. Huffman
IPC分类号： G02B26/08 , G02B28/00
CPC分类号： B81B3/0035 , G02B26/0841 , Y10T428/22
摘要： A micromirror array 110 fabricated on a semiconductor substrate 11. The array 110 is comprised of three operating layers 12, 13, 14. An addressing layer 12 is fabricated on the substrate. A hinge layer 13 is spaced above the addressing layer 12 by an air gap. A mirror layer 14 is spaced over the hinge layer 13 by a second air gap. The hinge layer 13 has a hinge 13a under and attached to the mirror 14a, the hinge 13a permitting the mirror 14a to tilt. The hinge layer 13 further has spring tips 13c under the mirror 14a, which are attached to the addressing layer 12. These spring tips 13c provide a stationary landing surface for the mirror 14a.
摘要翻译：制造在半导体衬底11上的微镜阵列110.阵列110由三个工作层12,13,14组成。寻址层12被制造在衬底上。铰链层13通过气隙在寻址层12上方间隔开。镜层14通过第二气隙在铰链层13上间隔开。铰链层13在反射镜14a的下方并具有铰链13a，铰链13a允许反射镜14a倾斜。铰链层13还具有安装在寻址层12下方的反射镜14a下面的弹簧尖端13c。这些弹簧顶端13c为反射镜14a提供固定的着陆面。

40. 发明授权

US07226810B2 MEMS device wafer-level package 有权
标题翻译： MEMS器件晶圆级封装
公开(公告)号：US07226810B2
公开(公告)日：2007-06-05
申请号：US11157024
申请日：2005-06-20
申请人： Thomas A. Kocian , Richard L. Knipe , Mark H. Strumpell
发明人： Thomas A. Kocian , Richard L. Knipe , Mark H. Strumpell
IPC分类号： H01L21/50 , H01L21/46
CPC分类号： B81C99/004 , B81C99/0065 , B81C2203/0109 , G02B26/0833 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592 , H01L2924/01019 , H01L2924/09701 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.
摘要翻译：通过目视检查和/或电气测试来检查具有多个管芯的半导体晶片的方法和系统。如果晶片上的某些管芯通过检查，那么在它们仍然是晶片的一部分的同时，将窗口安装或固定在那些特定的金属模上。

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