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1. 发明授权

US09024184B2 Sealing structure 有权
标题翻译：密封结构
公开(公告)号：US09024184B2
公开(公告)日：2015-05-05
申请号：US13878830
申请日：2011-07-28
申请人： Atsushi Kajiya , Hidekazu Yoshihara
发明人： Atsushi Kajiya , Hidekazu Yoshihara
IPC分类号： H05K5/00 , H05K5/06 , F21V8/00
CPC分类号： H05K5/061 , G02B6/0095
摘要： A sealing structure to seal a housing for electronic equipment such as a cellular phone, and which provides reliable sealing for the housing, and at the same time can attain to improve design with a simple construction. A sealing structure, which seals a housing, is provided with a seal member mounted on the housing, a substrate integrally molded with the seal member, and having at least a part thereof lying in the inside of the housing in a state where the seal member is mounted on the housing, and a light source element arranged on the substrate board, wherein the seal member is transparent or translucent, and it is constructed such that the light source element is arranged in a region of hermetic sealing formed by the seal member, whereby at least a part of the seal member emits light by the light radiated from the light source element.
摘要翻译：用于密封诸如蜂窝电话的电子设备的外壳并且为壳体提供可靠的密封的密封结构，并且同时可以通过简单的结构实现改进设计。密封壳体的密封结构设置有安装在壳体上的密封构件，与密封构件一体模制的基底，并且在其中至少一部分位于壳体内部的状态下，密封构件安装在所述壳体上，以及设置在所述基板上的光源元件，其中所述密封构件是透明或半透明的，并且其构造使得所述光源元件布置在由所述密封构件形成的密封密封区域中，由此密封构件的至少一部分通过从光源元件辐射的光而发光。

2. 外观设计

USD687397S1 Flexible printed circuit board 有权
标题翻译：柔性印刷电路板
公开(公告)号：USD687397S1
公开(公告)日：2013-08-06
申请号：US29371184
申请日：2010-11-17
申请人： Atsushi Kajiya , Hidekazu Yoshihara
设计人： Atsushi Kajiya , Hidekazu Yoshihara

3. 外观设计

USD669045S1 Flexible printed circuit board 有权
标题翻译：柔性印刷电路板
公开(公告)号：USD669045S1
公开(公告)日：2012-10-16
申请号：US29371187
申请日：2010-11-17
申请人： Atsushi Kajiya , Hidekazu Yoshihara
设计人： Atsushi Kajiya , Hidekazu Yoshihara

4. 外观设计

USD656111S1 Flexible printed circuit board 有权
公开(公告)号：USD656111S1
公开(公告)日：2012-03-20
申请号：US29371185
申请日：2010-11-17
申请人： Atsushi Kajiya , Hidekazu Yoshihara
设计人： Atsushi Kajiya , Hidekazu Yoshihara

5. 发明授权

US5942054A Micromechanical device with reduced load relaxation 失效
标题翻译：微机械装置减轻负载松弛
公开(公告)号：US5942054A
公开(公告)日：1999-08-24
申请号：US772588
申请日：1996-12-20
申请人： John Harold Tregilgas , Richard Lee Knipe , Thomas William Orent , Hidekazu Yoshihara , Elliott Keith Carpenter
发明人： John Harold Tregilgas , Richard Lee Knipe , Thomas William Orent , Hidekazu Yoshihara , Elliott Keith Carpenter
IPC分类号： G02B26/08 , C22C45/08 , C23C14/00 , C23C14/16
CPC分类号： C23C14/165 , C22C45/08 , C23C14/0036 , G02B26/0841
摘要： An improved elastic member (24) for micromechanical devices (12). The micromechanical device (12) includes a stationary member (28) and a moving member (26) which are connected together by a elastic member (24). Because of repeated and frequent movement of the moving member (26), the elastic member (24) can become permanently flexed or deformed, resulting in poor operation of the device. Aluminum alloys are formed to include oxygen, in combination with nitrogen if desired, to obtain a film with dramatically reduced load relaxation characteristics. Oxygen is added to an Argon sputter gas during deposition, and an amorphous film is produced.
摘要翻译：一种用于微机械装置（12）的改进的弹性构件（24）。微机械装置（12）包括通过弹性构件（24）连接在一起的固定构件（28）和移动构件（26）。由于移动构件（26）的重复和频繁的移动，弹性构件（24）可能永久地弯曲或变形，导致装置的操作不良。如果需要，铝合金形成为包括与氮组合的氧，以获得具有显着降低的负载松弛特性的膜。在沉积期间将氧加入到氩溅射气体中，并产生非晶膜。

6. 发明申请

US20140124257A1 FLEXIBLE CIRCUIT BODY AND METHOD FOR PRODUCTION THEREOF 有权
标题翻译：柔性电路体及其生产方法
公开(公告)号：US20140124257A1
公开(公告)日：2014-05-08
申请号：US14113480
申请日：2012-03-06
申请人： Hidekazu Yoshihara , Akihiko Matsumaru , Taisuke Kimura , Atsushi Kajiya
发明人： Hidekazu Yoshihara , Akihiko Matsumaru , Taisuke Kimura , Atsushi Kajiya
IPC分类号： H05K1/02 , H05K3/28 , H05K1/18
CPC分类号： H05K1/02 , H05K1/0216 , H05K1/023 , H05K1/028 , H05K1/0283 , H05K1/183 , H05K1/185 , H05K3/281 , H05K3/284 , H05K3/285 , H05K2201/0715 , Y10T156/1043
摘要： Provided is a highly reliable flexible circuit body in which a flexible wiring board is prevented from wear caused by rubbing, and a method for production of the flexible circuit body. A flexible circuit body includes a flexible wiring board having an insulating film, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer. The flexible wiring board is coated with a thermoplastic elastomer.
摘要翻译：提供了一种高度可靠的柔性电路体，其中防止由于摩擦引起的柔性布线板磨损，以及柔性电路体的制造方法。柔性电路体包括具有绝缘膜的柔性布线板，形成在绝缘膜上的布线层和形成在布线层上的绝缘层。柔性布线板涂有热塑性弹性体。

7. 发明授权

US08545056B2 LED flexible board assembly and lighting unit 有权
标题翻译： LED柔性板组装及照明单元
公开(公告)号：US08545056B2
公开(公告)日：2013-10-01
申请号：US13521651
申请日：2011-12-16
申请人： Atsushi Kajiya , Hidekazu Yoshihara
发明人： Atsushi Kajiya , Hidekazu Yoshihara
IPC分类号： F21L4/02 , F21L4/00
CPC分类号： F21L4/02 , F21K9/232 , F21V3/061 , F21V3/062 , F21Y2107/30 , F21Y2107/40 , F21Y2115/10 , H05K1/056 , H05K1/147 , H05K2201/0154 , H05K2201/10106
摘要： A lighting unit, e.g. an LED bulb or a straight LED luminaire, which illuminates a wide range and is configured with low cost. In a light-emitting diode lamp, a board assembly is disposed in a lamp main body, and light-emitting diodes are attached to the board assembly. The board assembly comprises a plurality of flexible printed circuit boards. Each flexible printed circuit board includes a base in the form of a flat plate, respective connections to a power supply portion of the light-emitting diode lamp are provided at two ends of the base, and the base is bent at a plurality of points of a middle portion to form a top surface portion and side surface portions. The flexible printed circuit boards are three-dimensionally assembled such that the top surface portions cross each other and such that one of the top surface portions lies on top of another.
摘要翻译：照明单元，例如一个LED灯泡或直的LED灯具，照明范围广，配置成本低廉。在发光二极管灯中，灯组件设置在灯主体中，并且发光二极管附接到板组件。板组件包括多个柔性印刷电路板。每个柔性印刷电路板包括平板形式的基座，在基座的两端设置与发光二极管灯的电源部分的各个连接，并且基座在多个点处弯曲形成上表面部分和侧表面部分的中间部分。柔性印刷电路板是三维组装的，使得顶表面部分彼此交叉，使得顶表面部分中的一个位于另一个的顶部。

8. 发明申请

US20130058824A1 METHOD FOR PRODUCING DECORATIVE SINTERED METALLIC ARTICLE AND DECORATIVE SINTERED METALLIC ARTICLE 审中-公开
标题翻译：装饰性烧结金属制品和装饰性烧结金属制品的制造方法
公开(公告)号：US20130058824A1
公开(公告)日：2013-03-07
申请号：US13695692
申请日：2010-11-04
申请人： Masashi Hirama , Hidekazu Yoshihara , Toshie Ito
发明人： Masashi Hirama , Hidekazu Yoshihara , Toshie Ito
IPC分类号： B22F7/02 , B32B15/01
CPC分类号： B44F5/00 , B22F5/106 , B22F7/06 , B44C3/02 , B44C5/005
摘要： Provided is a method for producing a decorative sintered metallic article and the same, used in jewelry goods, ornaments, clothing accessories, by combining a copper paste and a silver paste. The method comprises the steps of: producing a patterned piece by alternately arranging the copper paste containing an organic binder and water in 10 to 35 wt % and one or more kinds of copper powders selected from a copper powder and a copper alloy powder, and the silver paste similarly prepared to the copper paste; forming patterned pastes by drawing a pattern through deforming at least rows on the upper surface of the alternately arranged copper and silver pastes; drying the patterned pastes to produce a patterned piece; shaping a decorative object by processing the produced patterned piece; and firing the decorative object to produce a decorative sintered object.
摘要翻译：本发明提供一种用于制造装饰性烧结金属制品的方法，用于通过将铜膏和银膏结合在珠宝用品，装饰品，服装辅料中。该方法包括以下步骤：通过交替地将包含有机粘合剂的铜糊和10至35重量％的水和选自铜粉和铜合金粉末中的一种或多种铜粉交替排列而制造图案片，银膏类似地制备成铜膏; 通过在交替布置的铜和银浆料的上表面上至少排变形来绘制图案来形成图案糊状物; 干燥图案糊以产生图案片; 通过加工所制成的图案来对装饰物进行成形; 并烧制装饰物以制造装饰性烧结物体。

9. 发明申请

US20120107167A1 METHOD FOR PRODUCING SINTERED COPPER ARTICLE FOR CRAFT OR DECORATIVE USE, AND PLASTIC COPPER CONTAINING CLAY COMPOUND 审中-公开
标题翻译：用于生产用于装饰或装饰用途的烧结铜制品的方法和包含粘合剂的塑料铜
公开(公告)号：US20120107167A1
公开(公告)日：2012-05-03
申请号：US13381800
申请日：2010-08-19
申请人： Tomoaki Kasukawa , Akiyoshi Yatsugi , Masashi Hirama , Hidekazu Yoshihara , Ryota Mitsuhashi
发明人： Tomoaki Kasukawa , Akiyoshi Yatsugi , Masashi Hirama , Hidekazu Yoshihara , Ryota Mitsuhashi
IPC分类号： B22F3/10 , B22F1/00
CPC分类号： C22C9/00 , A44C27/003 , B22F1/0014 , B22F1/0062 , B22F3/24 , B22F2998/10 , B22F2999/00 , B22F3/02 , B22F3/10 , B22F2201/50
摘要： A method for producing a sintered copper article for craft or decorative use made of copper or a copper alloy which can be sintered in the air by using a general heating furnace, and a plastic copper containing clay compound are provided. The method for producing the sintered copper article for craft or decorative use of the present invention comprises the steps of forming a shaped copper object using the copper containing clay compound which includes at least one kind of a powder selected from a copper powder or a copper alloy powder that contains copper in 50 wt % or more together with an organic binder, and subsequently sintering the shaped copper object, thereby to obtain a shaped copper sinter. Herein, the mean particle diameter of the powder included in the copper containing clay compound is restricted to 10 μm or less, whereby the shaped copper sinter is obtained by sintering the shaped copper object in the air.
摘要翻译：提供了一种用铜或铜合金制造的用于工艺或装饰用途的烧结铜制品的方法，所述铜或铜合金可以通过使用通用加热炉在空气中烧结，以及含有铜的粘土化合物。本发明的用于工艺或装饰用铜烧结铜制品的方法包括以下步骤：使用含铜粘土化合物形成成形铜物体，其包括选自铜粉或铜合金中的至少一种粉末含有50重量％以上的铜和有机粘合剂的粉末，随后烧结成形的铜物体，从而获得成形的铜烧结体。这里，包含在含铜粘土化合物中的粉末的平均粒径限制在10μm以下，由此通过在空气中烧结成形的铜物体来获得成形的铜烧结体。

10. 发明授权

US09024198B2 Flexible circuit board and method for production thereof 有权
标题翻译：柔性电路板及其制造方法
公开(公告)号：US09024198B2
公开(公告)日：2015-05-05
申请号：US13518470
申请日：2010-07-16
申请人： Atsushi Kajiya , Hidekazu Yoshihara , Toru Itani
发明人： Atsushi Kajiya , Hidekazu Yoshihara , Toru Itani
IPC分类号： H05K1/00 , H05K1/03 , H05K1/02 , H05K3/22 , H05K3/42 , H05K3/46
CPC分类号： H05K1/032 , H05K1/028 , H05K1/0393 , H05K3/22 , H05K3/429 , H05K3/4635 , H05K2201/0129 , H05K2201/0141 , H05K2201/09263 , H05K2203/1105
摘要： A flexible circuit board with high connection reliability and a manufacturing method thereof, wherein the flexible circuit board has a bent section formed thereon, can be deformed flexibly, and wherein a wiring layer will not be peeled off or ruptured even when deformation is repeated onto the flexible circuit board, heat is radiated from electronic parts, or minute wiring is formed on the flexible circuit board. The flexible circuit board is provided with an insulating film comprised of liquid crystal polymer, a wiring layer formed upon the insulating film, and an insulating layer comprised of liquid crystal polymer formed upon the wiring layer. The flexible circuit board has a bent section with a radius of curvature of R (mm) formed on at least one location thereof, and is made to be deformable in a state with the radius of curvature of the bent section maintained at R (mm).
摘要翻译：一种具有高连接可靠性的柔性电路板及其制造方法，其中柔性电路板具有形成在其上的弯曲部分，可以挠曲地变形，并且其中布线层即使在重复变形时也不会剥离或破裂柔性电路板，热量从电子部件辐射，或微小布线形成在柔性电路板上。柔性电路板设置有由液晶聚合物构成的绝缘膜，在绝缘膜上形成的布线层和由形成在布线层上的液晶聚合物构成的绝缘层。柔性电路板具有形成在其至少一个位置上的具有R（mm）的曲率半径的弯曲部分，并且在弯曲部分的曲率半径维持在R（mm）的状态下可变形）。

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