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    • 31. 发明申请
    • Semiconductor device with double barrier film
    • 具有双阻挡膜的半导体器件
    • US20080061357A1
    • 2008-03-13
    • US11980561
    • 2007-10-31
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • H01L29/788
    • H01L27/115H01L27/105H01L27/11526H01L27/11529
    • A semiconductor device comprising a first insulation layer, a second insulation layer, a first barrier film, a second barrier film, a diffusion layer. The device further comprises an upper contact hole, a lower contact hole, and a contact plug. The upper contact hole penetrates the second insulation layer and has a bottom in the second barrier film. The bottom has a width greater than a trench made in the first insulation layer, as measured in a direction crossing the widthwise direction of the trench. The lower contact hole penetrates the first insulation layer and first barrier film, communicates with the first contact hole via the trench and is provided on the diffusion layer. The upper portion of the lower contact hole has the same width as the trench. The contact plug is provided in the upper contact hole and lower contact hole.
    • 一种半导体器件,包括第一绝缘层,第二绝缘层,第一阻挡膜,第二阻挡膜,扩散层。 该装置还包括上接触孔,下接触孔和接触塞。 上接触孔穿透第二绝缘层,并且在第二阻挡膜中具有底部。 底部的宽度大于在与沟槽宽度方向交叉的方向上测量的在第一绝缘层中形成的沟槽。 下接触孔穿过第一绝缘层和第一阻挡膜,经由沟槽与第一接触孔连通并设置在扩散层上。 下接触孔的上部具有与沟槽相同的宽度。 接触塞设置在上接触孔和下接触孔中。
    • 32. 发明申请
    • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20070196986A1
    • 2007-08-23
    • US11676814
    • 2007-02-20
    • Masayuki IchigeMakoto SakumaFumitaka Arai
    • Masayuki IchigeMakoto SakumaFumitaka Arai
    • H01L21/336
    • H01L27/105H01L27/11526H01L27/11529H01L29/0638
    • A method for manufacturing a semiconductor device including a substrate, a memory cell region including first pattern, first guard ring around the memory cell, second guard ring around the first guard ring, an isolation region between the first and second guard ring, and a peripheral circuit region around the second guard ring and including second pattern, the method including exposing the resist film by multiple exposure including first and second exposures for forming latent images corresponding to the first and second patterns, a boundary area of the multiple exposure being set on the isolation region, on the first or second guard ring, or on an area between the first guard ring and the memory cell region, forming a resist pattern by developing the resist film, and etching the substrate with the resist pattern as a mask.
    • 一种半导体器件的制造方法,包括:衬底,包括第一图案的存储单元区域,存储单元周围的第一保护环,第一保护环周围的第二保护环,第一和第二保护环之间的隔离区域, 电路区域,并且包括第二图案,所述方法包括通过多次曝光曝光所述抗蚀剂膜,所述多次曝光包括用于形成对应于所述第一和第二图案的潜像的第一和第二曝光,所述多次曝光的边界区域设置在 在第一或第二保护环上或第一保护环和存储单元区域之间的区域上,通过显影抗蚀剂膜形成抗蚀剂图案,并用抗蚀剂图案作为掩模蚀刻基板。
    • 36. 发明授权
    • Semiconductor memory device and semiconductor device including multilayer gate electrode
    • 半导体存储器件和包括多层栅电极的半导体器件
    • US07541654B2
    • 2009-06-02
    • US11565843
    • 2006-12-01
    • Fumitaka AraiMakoto Sakuma
    • Fumitaka AraiMakoto Sakuma
    • H01L27/115
    • H01L27/115H01L27/11521H01L27/11524
    • In a memory cell array are arranged a plurality of cell units having memory cells and selection gate transistors to select the memory cell. A first selection gate line includes a control gate of the selection gate transistors. A second selection gate line is formed above the first selection gate line. The first selection gate line has a first gate electrode, a first inter-gate insulating film and a second gate electrode superimposed in this order. The first inter-gate insulating film has a first opening portion through which the first gate electrode and the second gate electrode come into contact with each other. A contact material is formed on the first selection gate line, and electrically connects the first selection gate line and the second selection gate line with each other. The contact material is arranged on the first selection gate line on which the first opening portion is not arranged.
    • 在存储单元阵列中布置有具有存储单元的多个单元单元和选择栅晶体管以选择存储单元。 第一选择栅极线包括选择栅极晶体管的控制栅极。 在第一选择栅极线之上形成第二选择栅极线。 第一选择栅极线具有依次叠加的第一栅电极,第一栅间绝缘膜和第二栅电极。 第一栅极间绝缘膜具有第一开口部,第一栅极电极和第二栅极电极相互接触。 接触材料形成在第一选择栅极线上,并且使第一选择栅极线和第二选择栅极线彼此电连接。 接触材料配置在不配置第一开口部的第一选择栅极线上。
    • 37. 发明授权
    • Method of manufacturing nonvolatile semiconductor memory device having adjacent selection transistors connected together
    • 具有连接在一起的相邻选择晶体管的非易失性半导体存储器件的制造方法
    • US07416935B2
    • 2008-08-26
    • US11407242
    • 2006-04-20
    • Makoto SakumaFumitaka Arai
    • Makoto SakumaFumitaka Arai
    • H01L21/8238
    • H01L27/11521H01L27/115H01L27/11524H01L29/42324
    • A method of manufacturing a nonvolatile semiconductor memory device, including forming a gate insulating film, a first conductive layer providing floating gates and a mask, in that order, on a semiconductor substrate, forming a plurality of element-isolating regions in the mask layer, first conductive layer, gate insulating film and semiconductor substrate; forming first trenches in parts of the first conductive layer separated by the element-isolating region; forming inter-gate insulating films on sides of each floating gate; forming control gates in the first trenches; making second trenches in parts of the mask layer and first conductive layer and in adjacent parts of the element-isolating regions; forming conductive members in the second trenches, wherein a top of the conductive members is at the same level as an upper surface of the mask layer; and removing parts of the first conductive layer and the gate insulating film exclusive of the conductive members.
    • 一种制造非易失性半导体存储器件的方法,包括在半导体衬底上形成栅绝缘膜,提供浮栅和掩模的第一导电层,在掩模层中形成多个元件隔离区, 第一导电层,栅极绝缘膜和半导体衬底; 在由元件隔离区隔开的第一导电层的部分中形成第一沟槽; 在每个浮动栅极的侧面形成栅极间绝缘膜; 在第一沟槽中形成控制栅极; 在掩模层和第一导电层的部分以及元件隔离区的相邻部分中形成第二沟槽; 在所述第二沟槽中形成导电构件,其中所述导电构件的顶部处于与所述掩模层的上表面相同的水平; 以及去除不包括导电构件的第一导电层和栅极绝缘膜的部分。
    • 39. 发明授权
    • Semiconductor device with double barrier film
    • 具有双阻挡膜的半导体器件
    • US07291875B2
    • 2007-11-06
    • US11447947
    • 2006-06-07
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • H01L23/485
    • H01L27/115H01L27/105H01L27/11526H01L27/11529
    • A semiconductor device comprising a first insulation layer, a second insulation layer, a first barrier film, a second barrier film, a diffusion layer. The device further comprises an upper contact hole, a lower contact hole, and a contact plug. The upper contact hole penetrates the second insulation layer and has a bottom in the second barrier film. The bottom has a width greater than a trench made in the first insulation layer, as measured in a direction crossing the widthwise direction of the trench. The lower contact hole penetrates the first insulation layer and first barrier film, communicates with the first contact hole via the trench and is provided on the diffusion layer. The upper portion of the lower contact hole has the same width as the trench. The contact plug is provided in the upper contact hole and lower contact hole.
    • 一种半导体器件,包括第一绝缘层,第二绝缘层,第一阻挡膜,第二阻挡膜,扩散层。 该装置还包括上接触孔,下接触孔和接触塞。 上接触孔穿透第二绝缘层,并且在第二阻挡膜中具有底部。 底部的宽度大于在与沟槽宽度方向交叉的方向上测量的在第一绝缘层中形成的沟槽。 下接触孔穿过第一绝缘层和第一阻挡膜,经由沟槽与第一接触孔连通并设置在扩散层上。 下接触孔的上部具有与沟槽相同的宽度。 接触塞设置在上接触孔和下接触孔中。